Advances in Interconnect Technologies: An International Journal (AITIJ)

https://airccse.com/aitij/index.html

Scope & Topics

Advances in Interconnect Technologies: An International Journal (AITIJ) invites

original and significant contributions relating to the theory, design, performance and
reliability of interconnect, including materials, analysis, modeling and simulation of
interconnect. The journal proposes to stimulate the development of latest technology in
industry and academia. High quality review papers and short communications are also
acceptable.

Research areas suitable for publication include, but are not limited to the following fields:

Topics of interest include, but are not limited to, the following

 Emerging Materials
 CNT/ Graphene Interconnects
 Modeling and Simulation
 Testing
 RFIC
 Optical Interconnects
 Wireless Interconnects
 Microstrip Lines
 Analog and Mixed Signals
 Dedicated Software and Systems for Developing Interconnect Technology
 On-Chip and Off-Chip Interconnects
 EMC/EMI
 FPGA/ASICs
 Fabrication Techniques
 Neural Networks
 Parasitics Issues
 Optimization Techniques

Paper Submission

Authors are invited to submit papers for this journal through Email
aitijjournal@airccse.com or Submission System. Submissions must be original and
should not have been published previously or be under consideration for publication
while being evaluated for this Journal.

Important Dates

 Submission Deadline: March 06, 2021

 Notification : April 06, 2021
 Final Manuscript Due : April 14, 2021
 Publication Date : Determined by the Editor-in-Chief

Contact Us

Here's where you can reach us: aitijjournal@yahoo.com or aitijjournal@airccse.com