Introduction To Heat Transfer Basics On Altair

OPTISTRUCT FOR THERMAL v2019.
1
INTRODUCTION TO HEAT TRANSFER BASICS
September 18,
© 2019 Altair Engineering, Inc. Proprietary and Confidential. All rights reserved.
OPTISTRUCT FOR THERMAL ANALYSIS - AGENDA
1. Introduction to Heat Transfer Basics

2. Steady-State Heat Transfer Analysis
3. Transient Thermal Analysis
4. Contact-based Thermal Analysis
5. Thermal Fluid-Structural Interaction Analysis
6. Thermal Optimization
September 18,
INTRODUCTION TO HEAT TRANSFER BASICS: DETAILED OVERVIEW
Introduction to Heat Transfer Basics
• Introduction To Heat Transfer
• Thermal Conduction Elements And Surface Elements
• Specifying Thermal Materials In Optistruct
• Temperature-Dependent Structural Analysis Materials
• Thermal Loads And Boundary Conditions
• General Thermal Results

September 18,
INTRODUCTION TO HEAT TRANSFER

September 18,
INTRODUCTION TO HEAT TRANSFER MECHANISMS
Heat transfer is the exchange of thermal energy between physical systems
There are three fundamental physical heat transfer modes

• Conduction – heat transfer between objects in contact
• Convection – heat transfer between an object and its environment due to fluid motion
• Radiation – heat transfer by the emission of electromagnetic radiation
September 18,
HEAT TRANSFER SOLUTIONS AVAILABLE IN OPTISTRUCT
There are many heat transfer solutions supported in OptiStruct

• Linear and nonlinear steady state thermal analyses
• Linear transient thermal analysis
• Contact-based thermal analysis
• Sequentially coupled thermal-structural analysis
• Thermal fluid-structure interaction analysis (TFSI)
• Thermal optimization
September 18,
THERMAL CONDUCTION ELEMENTS AND SURFACE ELEMENTS

September 18,
THERMAL CONDUCTION ELEMENTS

Thermal analysis is supported for a number of element types
1D conduction elements
• CROD, CONROD, CBAR, CBEAM
• CTRIA3, CTRIA6, CQUAD4, CQUAD8
Tip: Shell elements are considered to be membranes in Heat Transfer Analysis
• CTETRA, CTETRA10, CHEXA, CHEXA20, CPENTA, CPENTA15, CPYRA, CPYRA13
The property cards for these elements in thermal analysis are the same as for structural
analysis; no modifications are required
September 18,
SPECIFYING THERMAL MATERIALS IN OPTISTRUCT

September 18,
MATERIALS FOR THERMAL ANALYSIS IN OPTISTRUCT
Generally, MAT4 and MAT5 are used to set up thermal analysis in OptiStruct
• MAT4 entries are for general isotropic materials
• MAT5 entries are for general anisotropic materials
In addition to dedicated MAT4 and MAT5 entries, information contained in MAT4 and MAT5
cards can be linked to MAT1 entries for use in analyses combining thermal and mechanical
simulation. The linked cards will then share the same material id.
September 18,
THERMAL MATERIALS SUMMARY TABLE
The following listing summarizes thermal and thermally-dependent material models available
Bulk Data Entry Element Type Material Type or Modeling Specialty

MAT4 Solids & Shells Isotropic
MAT5 Solids & Shells Anisotropic
MATS1 Solids & Shells Nonlinear
MATT1 Solids & Shells Isotropic
MATT2 Shells Anisotropic
MATT3 Shells Axisymmetry
MATT4 Solids & Shells Thermal Modeling
MATT8 Shells Orthotropic
MATT9 Solids Anisotropic
MATT9OR Solids Orthotropic
MATTVP Solids & Shells Creep
September 18,
THERMAL BULK DATA CARDS: MAT4 PARAMETERS
The MAT4 card defines constant thermal material properties for isotropic materials
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
MAT4 MID K CP RHO H HGEN
Where:
MID Material identification number.
K Thermal conductivity
CP Heat capacity per unit mass (specific heat)
RHO Density
H Free convection heat transfer coefficient
Heat generation capability used with QVOL entries. HGEN is the scale factor and QVOL is the power generated
HGEN
per unit volume, Pin = volume * HGEN * QVOL
September 18,
THERMAL BULK DATA CARDS: MAT5 PARAMETERS
The MAT5 card defines constant thermal material properties for anisotropic materials
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
MAT5 MID KXX KXY KXZ KYY KYZ KZZ CP
RHO HGEN
Where:
Kij Thermal conductivity matrix values
CP Heat capacity per unit mass (specific heat)
RHO Density
Heat generation capability used with QVOL entries. HGEN is the scale factor and QVOL is the power generated
HGEN
per unit volume, Pin = volume * HGEN * QVOL
September 18,
THERMAL BULK DATA CARDS: MATS1 PARAMETERS
The MATS1 card defines stress-dependent and temperature-dependent material properties

for use in applications involving nonlinear materials
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
MATS1 MID TID TYPE H YF HR LIMIT1
TYPSTRN TSC
JHCOOK A B N C RSTRT
Where:
TID Identification number of a table entry
TYPE Material nonlinearity type (PLASTIC or NLELAST)
H Work hardening slope in units of stress
YF Yield function criterion
HR Hardening rule
LIMIT1 Initial yield point
TYPSTRN Specifies the type of strain used on the x-axis of the TID table
TSC Tensile stress cutoff
September 18,
THERMAL BULK DATA CARDS: MATS1 PARAMETERS
The MATS1 card defines stress-dependent and temperature-dependent material properties

for use in applications involving nonlinear materials.
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
MATS1 MID TID TYPE H YF HR LIMIT1
TYPSTRN TSC
JHCOOK A B N C RSTRT
Where:
JHCOOK Flag that identifies the Johnson-Cook hardening method parameters to follow
A Material yield stress
B Coefficients to the plastic strain
N Exponent to the plastic strain
C Coefficient to the strain rate
RSTRT Reference strain rate
September 18,
TEMPERATURE-DEPENDENT STRUCTURAL ANALYSIS MATERIALS

September 18,
TEMPERATURE-DEPENDENT MATERIALS FOR COUPLED ANALYSIS
Some of the most common material cards have a corresponding bulk data material card for
which table data can be linked, allowing users to define a wide range of material types whose
mechanical properties have temperature-dependent characteristics. Most of these cards use
TABLEMi or TABLEG entries. For more information about creating TABLEMi or TABLEG
cards, please consult the HyperWorks Help OptiStruct Reference Manual.
These material types can be used to perform structural analysis of a structure following a
thermal solution where the change in temperature adjusts the mechanical properties of the
materials, particularly where adjacent materials’ properties are dissimilar.
Note that these specific material cards will not be used in this course’s exercise material,
however, performing coupled solutions will be discussed in subsequent chapters.
September 18,
THERMAL BULK DATA CARDS: MATT1 PARAMETERS
The MATT1 card defines temperature-dependent material properties for isotropic materials
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
MATT1 MID T(E) T(G) T(NU) T(RHO) T(A) T(GE)
T(ST) T(SC) T(SS)

Where:
MID Material identification number
T(E) A TABLEMi or TABLEG entry identification number for the Young’s Modulus
T(G) A TABLEMi or TABLEG entry identification number for the shear modulus
T(NU) A TABLEMi or TABLEG entry identification number for the Poisson’s ratio
T(RHO) A TABLEMi or TABLEG entry identification number for the mass density
T(A) A TABLEMi or TABLEG entry identification number for the thermal expansion coefficient
T(GE) A TABLEMi or TABLEG entry identification number for the damping coefficient
T(ST) A TABLEMi or TABLEG entry identification number for the tension stress limit
T(SC) A TABLEMi or TABLEG entry identification number for the compression limit
T(SS) A TABLEMi or TABLEG entry identification number for the shear limit
September 18,
The MATT2 card defines temperature-dependent material properties for anisotropic shells
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
MATT2 MID T(G11) T(G12) T(G13) T(G22) T(G23) T(G33) T(RHO)
T(A1) T(A2) T(A3) T(GE) T(ST) T(SC) T(SS)

Where:
T(Gij) A TABLEMi or TABLEG entry identification number for the terms in the material property matrix
T(Ai) A TABLEMi or TABLEG entry identification number for the thermal expansion coefficient
T(GE) A TABLEMi or TABLEG entry identification number for the damping coefficient
T(ST) A TABLEMi or TABLEG entry identification number for the tension stress limit
T(SC) A TABLEMi or TABLEG entry identification number for the compression limit
T(SS) A TABLEMi or TABLEG entry identification number for the shear limit
September 18,
The MATT3 card defines temperature-dependent material properties for axisymmetric shells
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
MATT3 MID T(EX) T(ETH) T(EZ) T(NUTXTH) T(NUTHZ) T(NUZX) T(RHO)
T(GZX) T(AX) T(ATH) T(AZ) T(TREF) T(GE)

Where:
T(EX), T(ETH),
TABLEMi or TABLEG entries identification number for the Young’s Moduli in x,θ, and z directions
T(EZ)
T(NUTXTH),
T(NUTHZ), TABLEMi or TABLEG entries identification number for the Poisson’s ratio in x,θ,θz, and z directions
T(NUZX)
T(GZX) A TABLEMi or TABLEG entry identification number for the shear modulus
T(AX), T(ATH),
TABLEMi or TABLEG entries identification number for the thermal expansion coefficients in x,θ, and z directions
T(AZ)
T(GE) A TABLEMi or TABLEG entry identification number for the shear modulus
September 18,
The MATT4 card defines temperature-dependent thermal material properties for isotropic
materials
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
MATT4 MID T(K)
Where:
T(K) A TABLEMi or TABLEG entry identification number for the temperature-dependent thermal conductivity
September 18,
The MATT8 card defines temperature-dependent material properties for orthotropic shells
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
MATT8 MID T(E1) T(E2) T(NU12) T(G12) T(G1Z) T(G2Z) T(RHO)
T(A1) T(A2) T(Xt) T(Xc) T(Yt) T(Yc) T(S)
T(GE) T(F12)
Where:
T(E1), T(E2) TABLEMi or TABLEG entries identification number for the Youngs Moduli in the 1 and 2 directions
T(NU12) A TABLEMi or TABLEG entry identification number for the Poisson’s ratio 12
T(G12),
TABLEMi or TABLEG entries identification number for the shear moduli in the 12, 1Z, and 2Z directions
T(G1Z), T(G2Z)
T(A1), T(A2) TABLEMi or TABLEG entries identification number for the thermal expansion coefficient1 and 2
September 18,
The MATT8 card defines temperature-dependent material properties for orthotropic shells
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
MATT8 MID T(E1) T(E2) T(NU12) T(G12) T(G1Z) T(G2Z) T(RHO)
T(A1) T(A2) T(Xt) T(Xc) T(Yt) T(Yc) T(S)
T(GE) T(F12)
Where:
T(Xt) TABLEMi or TABLEG entries identification number for the tension stress/strain limit 1
T(Xc) TABLEMi or TABLEG entries identification number for the compression stress/strain limit 1
T(Yt) TABLEMi or TABLEG entries identification number for the tension stress/strain limit 2
T(Yc) TABLEMi or TABLEG entries identification number for the compression stress/strain limit 2
T(S) TABLEMi or TABLEG entries identification number for the shear stress/strain limit
T(GE) TABLEMi or TABLEG entries identification number for the structural damping coefficient
T(F12) TABLEMi or TABLEG entries identification number for the Tsai-Wu interaction term
September 18,
The MATT9 card defines temperature-dependent material properties for anisotropic solids
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
MATT9 MID T(G11) T(G12) T(G13) T(G14) T(G15) T(G16) T(G22)
T(G23) T(G24) T(G25) T(G26) T(G33) T(G34) T(G35) T(G36)
T(G44) T(G45) T(G46) T(G55) T(G56) T(G66) T(RHO) T(A1)
T(A2) T(A3) T(A4) T(A5) T(A6) T(GE)
Where:
MID Material property identification number
T(Gij) TABLEMi or TABLEG entries identification number for the material property matrix
T(RHO) TABLEMi or TABLEG entries identification number for the mass density
T(Ai) TABLEMi or TABLEG entries identification number for the thermal expansion coefficients
T(GE) TABLEMi or TABLEG entries identification number for the damping coefficient
September 18,
THERMAL BULK DATA CARDS: MATT9OR PARAMETERS
The MATT9OR card defines temperature-dependent material properties for anisotropic solids
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
MATT9OR MID T(E1) T(E2) T(E3) T(NU12) T(NU23) T(NU31) T(RHO)
T(G12) T(G23) T(G31) T(A1) T(A2) T(A3) T(GE)
Where:
T(Ei) TABLEMi or TABLEG entries identification number for the Young’s Modulus in direction i
T(NUij) TABLEMi or TABLEG entries identification number for the Poisson’s ratios
T(Gij) TABLEMi or TABLEG entries identification number for the terms in the material property matrix
T(RHO) TABLEMi or TABLEG entries identification number for the mass density
T(Ai) TABLEMi or TABLEG entries identification number for the terms in the thermal expansion coefficients
T(GE) TABLEMi or TABLEG entries identification number for the damping coefficients
September 18,
THERMAL BULK DATA CARDS: MATTVP PARAMETERS
The MATTVP card defines temperature-dependent material properties for nonlinear creep
materials
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
MATTVP MID T(A) T(n) T(m)
Where:
T(A) TABLEMi or TABLEG entries identification number for the parameter A
T(n) TABLEMi or TABLEG entries identification number for the parameter n
T(m) TABLEMi or TABLEG entries identification number for the parameter m

September 18,
THERMAL LOADS AND BOUNDARY CONDITIONS

September 18,
THERMAL LOADINGS
-3-
IMPOSED
TEMPERATURE
BOUNDARY
CONDITIONS
-2-
HEAT FLUX
Thermal loading through a -4-
face or an edge (of a 2d FREE CONVECTION
part) from external BOUNDARY CONDITIONS
environment
(combustion, radiations,
heating process…)
-1-
VOLUMETRIC HEAT GENERATION
Thermal loading generated by the elements
themselves due to Joule effect, chemical reactions…
28
September 18,
ANALOGY BETWEEN MECHANICAL AND THERMAL ANALYSIS

Mechanical Thermal Comments
Volumetric Defines a heat generation of elements per unit of volume.

Inertial loads
heating This can be used to model heat generation by Joule effect for example.
[GRAV]
[QVOL] Units example : W/m3 or W/mm3 (depending on unit used for distance)
A thermal loading applied to a 2D area, the external face of a 3D part, or the edge of a 2D part.
Pressure Thermal flux Unlike in mechanical analysis, Flux are not directly applied to structural elements, but on dedicated entities,
[PLOAD] [QBDY1] the thermal interface elements (CHBDYE)
Units example : W/m² or W/mm² (depending on unit used for distance)
The same way we use SPC(D) to set displacement boundary conditions on nodes in a mechanical analysis
Imposed Imposed (dof =1 to 6), the same principle is used to set temperature boundary conditions on nodes (dof = 0).
displacements temperature
MPC also works in thermal analysis with dof=0.
[SPC / SPCD] [SPC / SPCD]
Units example : K or °C
This defines a convection interface between thermal interface elements and a single GRID or SPOINT, on
which a SPC is applied to model the external solid/fluid temperature away from the structure.
Convection
- Different convection rules can be used to determine the resulting loading. Thermal flux is not directly set by the
[CONV]
user but depends on convection rules, part temperature and fluid temperature.
29
September 18,
THERMAL LOADS – VOLUMETRIC HEAT GENERATION
When heat is conducted through an object, conversion of electrical/chemical/nuclear energy

into thermal energy may happen, which acts upon the part as a secondary heat source
• Heat generation is a volumetric phenomenon in heat conduction analysis.
• For steady state analysis, a total thermal energy into an element
Heat_in = volume * HGEN * QVOL
where,
QVOL is the constant volumetric heat generation rate defined in QVOL card
HGEN is the scale factor for volumetric heat generation defined in MAT4/MAT5
September 18,
THERMAL BULK DATA CARDS: QVOL PARAMETERS
The QVOL card defines a rate of volumetric heat generation in a conduction element
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
QVOL SID QVOL EID1 EID2 EID3 EID4 EID5
EID6 ...
Where:
SID Load set identification number
QVOL Power input per unit volume produced by a heat conduction element
EID# A list of heat conduction elements

September 18,
HOW TO DEFINE QVOL HEAT GENERATION IN HYPERMESH
1) Create Load Collector with no card image

2) In flux panel, generate volumetric flux loading on 2D/3D elements, with loading type QVOL
• QVOL is directly applied on structural elements
• Tip: heat generation is changed by the HGEN parameter in MAT4/5
• The value unit should be {power_unit}/{distance_unit}3. For example W/m3.
• Flux will be illustrated as arrows in the graphics area
32
September 18,
THERMAL LOADS – HEAT FLUX
Heat flux is the amount of heat transferred thru a given surface per unit area.
The total thermal energy which goes into an element is given by
Heat_in = (Effective_Area) * Q0
where Q0 is heat flux defined in QBDY1 card,
Effectiv_Area is calculated based on CHBDYE
definition
September 18,
THERMAL BULK DATA CARDS: CHBDYE PARAMETERS
The CHBDYE card defines a surface element for application of thermal boundary conditions
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
CHBDYE EID EID2 SIDE
Where:
EID Unique surface element identification number.
EID2 Identification number for the heat conduction element associated with this surface element.
SIDE Element side identification number

September 18,
THERMAL BULK DATA CARDS: QBDY1 PARAMETERS
The QBDY1 card defines a uniform heat flux applied to a CHBDYE surface
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
QBDY1 SID Q0 EID1 EID2 EID3 EID4 EID5 EID6
Where:
SID Load set identification number
Q0 Heat flux into element where positive values represent heat into the surface
EID# CHBDYE surface element identification numbers. With alternate format using “THRU” EID2 > EID1
Tip: A 1D element can have heat flux applied at each end and along its length. A 2D element can have heat
flux on its surface and along any edge. A 3D element can have heat flux applied on any face.
September 18,
HOW TO DEFINE HEAT FLUX IN HYPERMESH
To create CHBDYE thermal interface elements:

1. Create a new group of card image CONDUCTION
2. Add to this group the elements or elements faces that define the
interface used to apply the thermal loading.
This action will create new elements: the CHBDYE elements,

displayed as hollow rectangular or triangular shapes.
Notes about creating CHBDYE elements:

• CHBDYE elements are specific to thermal analysis
• They are used to apply flux and/or convection in thermal analysis
• They are not used for mechanical analysis
• CHBDYE elem configuration in HyperMesh is slave3 or slave4
• Due to their “non-physical” nature, they are not held in components
but in groups and can be selected using the “by group” selection
36
September 18,
HOW TO DEFINE HEAT FLUX IN HYPERMESH
To create a heat flux on CHBDYE thermal interface elements:

1. Create a load collector with no card image
2. Create flux loading on CHBDYE thermal elements with loading type QBDY1
When creating heat flux loading:

• In order to select CHBDYE thermal elements , use the by group selection option
• The value unit should be {power_unit}/{distance_unit}². For example W/m².
• Flux will be shown as arrows in the graphics area
37
September 18,
THERMAL BOUNDARY CONDITIONS – TEMPERATURE CONSTRAINTS
Temperature boundary conditions specify temperatures at grid points (GRID) associated with
conduction elements or ambient points (GRID or SPOINT).
• An SPC, SPC1 or SPCD can be used to define a fixed temperature for both steady state analysis or
transient analysis. The component number need to be blank or zero. Component number 1 can be
used if SPSYNTAX=mixed is specified.
September 18,
HOW TO DEFINE IMPOSED TEMPERATURES IN HYPERMESH
To apply a temperature of 60.0 degree to grids ID 101 and 102

$======$$======$$======$$======$$======$$======$$======$$======$
SPC 1 101 60.0
SPC 1 102 60.0
1. Select grids #101 and #102 and create SPC without selecting any dof in “constraints”
panel
2. Select SPCs and input D=60.0 in “card edit” panel

September 18,
THERMAL BOUNDARY CONDITIONS – FREE CONVECTION
In free convection, fluid motion is not generated by any external source, like pump, fan, etc,
but only by density differences in the fluid due to temperature gradients
• In OptiStruct, free convection allows thermal energy transfers between a surface and an
ambient environment (SPC/SPCD) through heat transfer coefficient (H) and a surface
element (CHBDYE)
• Heat exchange equation for free convection
q=H*(T-T_amb)
where:
H – free convection heat transfer coefficient defined in MAT4
T – surface temperature
T_amb – ambient/sink temperature
September 18,
THERMAL BULK DATA CARDS: PCONV PARAMETERS
The PCONV card defines a free convection boundary condition

(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
PCONV PCONID MID FORM EXPF FTYPE H1
Where:
PCONID Convection property identification number of a PCONV card
MID Material property identification number of MAT4 card
FORM Types of formula used for free convection.
EXPF Free convection exponent
Convection Coefficient definition type

= 0: the Convection Coefficient is specified on the MAT4 Bulk Data Entry referenced on the MID field
FTYPE
= 3: the Convection Coefficient is specified in the H1 field. The Convection Coefficient on the MAT4 Bulk
Data Entry referenced in the MID field is ignored.
H1 Free Convection Coefficient for this particular PCONV if FTYPE=3

September 18,
THERMAL BULK DATA CARDS: CONV PARAMETERS
The CONV card defines a free convection boundary condition through connection to a surface
element
(1) (2) (3) (4) (5) (6) (7) (8) (9) (10)
CONV EID PCONID CNTRLND TA
Where:
EID CHBDYE surface element identification number
PCONID Convection property identification number of a PCONV card
CNTRLND Control node for time dependent convection coefficient
TA Ambient points used to specify ambient temperature

September 18,
HOW TO DEFINE CONVECTION IN HYPERMESH
In order to define convection in HyperMesh:

1. Create a new PCONV convection property
2. Edit the MID to point to a MAT4
September 18,
HOW TO DEFINE CONVECTION IN HYPERMESH
In order to define convection in HyperMesh:

3. Create CHBDYE surface elements for
convection
4. Assign ambient temperature node to surface

elements and ensure PCONID for the CONV
is set to the convection ID
September 18,
FREE CONVECTION: BULK CARDS REFERENCE OVERVIEW
The following is an illustration of the references between cards used in a free convection
setup in OptiStruct
MAT4 MID K CP RHO H HGEN

Global convection coeff.
PCONV PCONID MID FORM EXPF FTYPE H1

Allow multiple convection coeff.
CONV EID PCONID TA
CHBDYE EID EID2 SIDE
CTETRA EID PID

September 18,
GENERAL THERMAL RESULTS

September 18,
THERMAL RESULTS AS COMPARED TO STRUCTURAL RESULTS
Thermal analysis and structural analysis have analogous outputs

RESULTS
Mechanical Thermal Comments
In both case, those are the first results to be calculated, and those values will be used to calculate all other results.
- In mechanical analysis : stress, strain, energy…are calculated based on nodal displacements.
- In thermal analysis : gradients, fluxes, thermal energy…are calculated based on nodal temperatures.
Displacement Temperature
This is a nodal scalar result.
Units example : K or °C
This is used to obtain temperature variation in space along the different Axis (X, Y, Z).
Temperature
Strain
Gradient This is an elemental vector result.
Units example : K/m or K/mm (depending on unit used for distance)
Defines the thermal power passing through an unitary section perpendicular to a particular direction (X, Y, Z)
Stress Fluxes
This is an elemental vector result.
This result is not a library-based result, but is calculated by OptiStruct to represent some kind of energy absorbed by the part
during the thermal transfer (however, the unit is not consistent with an energy).
Thermal This response is mainly used for optimization, where optimizing thermal compliance improves the part conductivity.
Compliance
Compliance
This is a global scalar result.
Units example : W.K
September 18,
THERMAL RESULT – TEMPERATURES
Thermal (I/O control card)

• Request nodal temperature output
• Format
THERMAL (format_list, THRESH=thresh,
RTHRESH=rthresh, TOP=topn, RTOP=rtop)= option
Where, THRESH, RTHRESH, TOP, and RTOP provide
different thresholds for the temperature output.
September 18,
THERMAL RESULT – FLUX AND TEMPERATURE GRADIENT
Element flux can be calculated based on nodal temperatures,
[k] is the conductivity of the material

{∇T} is temperature gradient
Flux (I/O control card)

• Request temperature gradient and flux output
• Format
FLUX (format_list) = option
September 18,
THERMAL RESULT – THERMAL COMPLIANCE
Global measurement for heat transfer analysis
• Thermal compliance
TCOMP = 1 / 2 × TT P = 1 / 2 × TT [K + H ]T
• T – temperature vector
• P – power vector
• K – conduction matrix
• H – convection matrix
• Available in .out file for heat transfer analysis

Subcase Thermal Compliance
1 5.685534E+06
September 18,
QUESTION & ANSWER

END OF CHAPTER

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OPTISTRUCT FOR THERMAL v2019.

OPTISTRUCT FOR THERMAL ANALYSIS - AGENDA

1. Introduction to Heat Transfer Basics

INTRODUCTION TO HEAT TRANSFER BASICS: DETAILED OVERVIEW

Introduction to Heat Transfer Basics

• Introduction To Heat Transfer

• Thermal Conduction Elements And Surface Elements

• Specifying Thermal Materials In Optistruct

• Temperature-Dependent Structural Analysis Materials

• Thermal Loads And Boundary Conditions

• General Thermal Results

INTRODUCTION TO HEAT TRANSFER

INTRODUCTION TO HEAT TRANSFER MECHANISMS

Heat transfer is the exchange of thermal energy between physical systems

There are three fundamental physical heat transfer modes

HEAT TRANSFER SOLUTIONS AVAILABLE IN OPTISTRUCT

There are many heat transfer solutions supported in OptiStruct

THERMAL CONDUCTION ELEMENTS AND SURFACE ELEMENTS

THERMAL CONDUCTION ELEMENTS

SPECIFYING THERMAL MATERIALS IN OPTISTRUCT

MATERIALS FOR THERMAL ANALYSIS IN OPTISTRUCT

THERMAL MATERIALS SUMMARY TABLE

Bulk Data Entry Element Type Material Type or Modeling Specialty

THERMAL BULK DATA CARDS: MAT4 PARAMETERS

MID Material identification number.

CP Heat capacity per unit mass (specific heat)

H Free convection heat transfer coefficient

THERMAL BULK DATA CARDS: MAT5 PARAMETERS

MID Material identification number.

Kij Thermal conductivity matrix values

CP Heat capacity per unit mass (specific heat)

THERMAL BULK DATA CARDS: MATS1 PARAMETERS

The MATS1 card defines stress-dependent and temperature-dependent material properties

MATS1 MID TID TYPE H YF HR LIMIT1

THERMAL BULK DATA CARDS: MATS1 PARAMETERS

The MATS1 card defines stress-dependent and temperature-dependent material properties

MATS1 MID TID TYPE H YF HR LIMIT1

TEMPERATURE-DEPENDENT STRUCTURAL ANALYSIS MATERIALS

TEMPERATURE-DEPENDENT MATERIALS FOR COUPLED ANALYSIS

THERMAL BULK DATA CARDS: MATT1 PARAMETERS

MATT1 MID T(E) T(G) T(NU) T(RHO) T(A) T(GE)

T(ST) T(SC) T(SS)

THERMAL BULK DATA CARDS: MATT2 PARAMETERS

MATT2 MID T(G11) T(G12) T(G13) T(G22) T(G23) T(G33) T(RHO)

T(A1) T(A2) T(A3) T(GE) T(ST) T(SC) T(SS)

THERMAL BULK DATA CARDS: MATT3 PARAMETERS

MATT3 MID T(EX) T(ETH) T(EZ) T(NUTXTH) T(NUTHZ) T(NUZX) T(RHO)

T(GZX) T(AX) T(ATH) T(AZ) T(TREF) T(GE)

THERMAL BULK DATA CARDS: MATT4 PARAMETERS

THERMAL BULK DATA CARDS: MATT8 PARAMETERS

MATT8 MID T(E1) T(E2) T(NU12) T(G12) T(G1Z) T(G2Z) T(RHO)

T(A1) T(A2) T(Xt) T(Xc) T(Yt) T(Yc) T(S)

THERMAL BULK DATA CARDS: MATT8 PARAMETERS

MATT8 MID T(E1) T(E2) T(NU12) T(G12) T(G1Z) T(G2Z) T(RHO)

T(A1) T(A2) T(Xt) T(Xc) T(Yt) T(Yc) T(S)

THERMAL BULK DATA CARDS: MATT9 PARAMETERS

MATT9 MID T(G11) T(G12) T(G13) T(G14) T(G15) T(G16) T(G22)

T(G23) T(G24) T(G25) T(G26) T(G33) T(G34) T(G35) T(G36)

T(G44) T(G45) T(G46) T(G55) T(G56) T(G66) T(RHO) T(A1)

T(A2) T(A3) T(A4) T(A5) T(A6) T(GE)

MID Material property identification number

THERMAL BULK DATA CARDS: MATT9OR PARAMETERS

MATT9OR MID T(E1) T(E2) T(E3) T(NU12) T(NU23) T(NU31) T(RHO)