Professional Documents
Culture Documents
Design and Optimization of Square SPI For Ultra-Wide Band Applications
Design and Optimization of Square SPI For Ultra-Wide Band Applications
Manjunatha Reddy H V
RF/Microwave Circuits Design
ICON Design and Automation Pvt. Ltd
Bangalore, India
E-mail: manjunatha_hv@rediffmail.com
Abstract: The design, simulation and implementation of microstrip square spiral inductors (SPI) for ultra-wideband applications. An accurate
analytical modeling was done by using the current sheet approximation (CSA) method. The simplified lumped equivalent circuit is used to
determine the physical dimension of the square SPI model. They are three different square turn SPI structures (1-turn, 2-turn, and 3-turns) are
electromagnetically (EM) simulate using physical dimensions. These physical dimensions help to achieve desired inductance values. The
implementation SPI structure in monolithic multilayer integrated circuit (MMIC) technique and operating frequency from 100MHz to 2000MHz
and calculate inductance and quality factor (Q-factor) at 950MHz for ultra-wide band applications. The SPI is model on RT/Duroid substrate and
measured with the network analyzer. The obtained results show that the average inductance of SPI (1-turn to 3-turn) increases by 74% and
quality factor decreases the average of 68%.The observed results show that average error of CSA v/s EM simulated = 5.66%, CSA v/s tested =
4% and EM simulated v/s measured = 6.87%. It is found that CSA, EM simulation and measured results are in close agreement with the smaller
average error. The analysis show that, increase in turns will influence to increases inductance value. The enhancement of the series resistance is
leading to deterioration of the Q-factor.
Keywords: SPI, Q-factor, Insertion Loss, Return Loss, CSA, Electromagnetic Simulation.
a suitable inductor model with multilayer substrate material and
I. INTRODUCTION
geometric calculation to improve Q-factor [6] [7] [8].
The development of compact and low cost printed circuit
board fabrication is important in a wireless communication The better efficiency of a spiral inductor is directly reflected
system. The miniaturization can be achieved either by by its Q-factor. The optimization of Q-factor depends on
compressing the size of individual components or by various physical parameters such as a number of turns (n),
integrating different functions within a single component. To conductor width (W), conductor length (L) space (S) between
attain the above needs, one can employ a unique technique the conductors, inner diameter (Di) and outer diameter (Dout).
called microwave multilayer integrated circuits (MMIC). The However, the number of turns used in SPI, which is dominated
MMIC is a simple technique, which is reliable in an electrical inductance value than other parameters (W, L, and S) because
and thermal performance of passive components. The MMIC smaller variation in number turns leads to significant changes
technology is widely used in ultra-wideband applications like in Q-factor and inductance. Therefore, in this work, we
radar [1], wireless communication [2] and remote sensing [3]. investigated the role of the number of turns on inductance value
and Q-factor of the square SPI structure. We varied the number
The MMIC has accomplished for accurate characterization of turns from one to three (n=1 to n=3) of a square spiral
of planar passive transmission lines [4]. The planar passive inductor for100MHz to 2000MHz operating frequency and
components such as SPI, inter digital capacitor (IDC) and these calculate the inductance and Q-factor at 950MHz.
are fabricated using MMIC technique. The choice of optimal
geometry of the planar passive components depends on II. BASICS OF SPIRAL INDUCTOR (SPI)
operating frequency. The planar circuit will experience a
The SPI is available in different structures such as straight
passive component effect while transmitting higher frequency
narrow racks, single loop, and multi-turn. In the multi-turn
signals are passing through it. The increase of passivity will
inductor of the circular and square structure are preferred for
deteriorate Q-factor. The Q-factor is a key parameter to
higher inductance value of passive components development.
improve circuit efficiency [5]. Many researchers have designed
The square SPI structure is widely used due to its less
𝜇𝑛2 𝑑𝑎𝑣𝑔 𝐶1 𝐶2
𝐿𝑔𝑚𝑑 = ln + 𝐶3 𝜌 + 𝐶4 𝜌2 (3)
2 𝜌
INDUCTANCE_SIM
50
L_SRL2(2) (nH)
SPI_N1_Sim
40 L_SRL2(2) (nH)
SPI_N2_Sim
L_SRL2(2) (nH)
30 SPI_N3_Sim
2 20
10
Figure3.a. Two Turn SPI 2D Structure
0
100 600 1100 1600 2000
Frequency (MHz)
Figure5.a.SIM Inductance
QUALITY FACTORS_SIM
250
Q_IN2(2)
SPI_N1_Sim
Q_IN2(2)
200 SPI_N2_Sim
Q_IN2(2)
SPI_N3_Sim
150
100
50
Figure3.b.Two Turn SPI 2D Structure
0
100 600 1100 1600 2000
The 2D and 3D layout structure of SPI is designed by using Frequency (MHz)
SPI_TURNS_S11_SIM
0
-5
-10
-15 DB(|S(1,1)|)
SPI_N1_Sim
-20 DB(|S(1,1)|)
SPI_N2_Sim
-25 DB(|S(1,1)|) Figure8.Tested andSIM Insertion Loss of 1 to 3 Turns
SPI_N3_Sim
-30
100 600 1100 1600 2000
Frequency (MHz) The figure 8 and 9, show comparative results of EM
simulated and tested S-parameters such asS11 and S21 of
Figure6.a.SIM Return Loss
square SPI. There is a smaller deviation between simulated and
SPI_TURNS_S21_SIM tested results because of an addition of SMA connector and
0
soldering material. The observed EM simulated S-parameters
are better agreement with the tested structure of n = 1 to n = 3.
-5
The observed results at 950MHz are tabulated in table 1.
DB(|S(2,1)|)
SPI_N1_Sim Table1.Best results
-10 DB(|S(2,1)|) Turns (n) S11SIM S11Test( S21SIM S21Test
SPI_N2_Sim
DB(|S(2,1)|)
(dB) dB) (dB) (dB)
-15
SPI_N3_Sim SPI_1=1 -10.7 -10.49 -0.406 -0.424
100 600 1100 1600 2000
Frequency (MHz)
SPI_2=2 -5.58 -6.29 -1.447 -1.204
SPI_3=2 -2.11 -2.19 -4.252 -4.132
Figure6.b.SIM Insertion Loss
V. RESULTS AND DISCUSSION
For ultra-wideband applications, we consider 950 MHz to
calculate the inductance and Q-factor of SPI. The S-parameters
of SPI and tested results of desired frequency shown in table 1.
The S11 and S21 of simulated results are well matched with
tested results. From the simulated results of S-parameters are
used to calculate the inductance and Q-factor of a tested
structure using equation (1) and (2). The theoretically
calculated inductance value using CSA with proposed
geometric scale for design SPI model.
The smaller deviation can be observed by comparing CSA,
EM simulated and tested results. The deviation is due to the
reactance of the input/output connector and soldering material,
which leads error compare between simulated and tested. The
average inductance error of EM simulated with CSA is 5.66%,
CSA with tested is 4% and EM simulated with tested is 6.87%
Figure7.Tested andSIM Return Loss1 to 3 Turns
as shown in table 2. The error percentage is negligible and it is
almost less than 7% with we achieve 93% matched
performance of designed and fabricated SPI models.
To reduce the resistive loss of a conductor is to reduce the better Q-factor we need to know the operating frequency and
conductor width to minimize the substrate loss and which is physical scaling of SPI.
more dominant than the resistive loss for large inductor
VI. CONCLUSION
structure [23]. Figure 7 shows inductance versus the number of
turns and average error percentage of a square spiral inductor. The 1-turn to 3-turn spiral inductors are designed with
The inductance of an SPI increase by increase in turns. The constant conductor width, inner diameter, and space between
measured inductance value of 1-turn to 2-turn increases by 42% the conductors. The systematic characterization of square SPI
and 2-turn to 3-turn is 56%. The observed tested results show on RT/Duroid substrate using NI/AWR software. The
that increase turn will result to increase inductance value performance of Square SPI is analyzed with the variation of the
linearly with average 15% in each turn (1-turn to 2-turn and 2- number of turns. By increasing the number of turns from 1 to 3,
turn to 3-turn) and 74% from 1-turn to 3-turn with respect to the inductance value is improved by 75% and the Q-factor falls
proposed geometric scale. down 68%. The fabricated structures results are well matched
The Q-factor is one of a figure of merit to justify SPI with EM simulated and designed results. The observed results
efficiency. We use the conventional definition of the Q-factor, show that increase in turns will influence to increases
being the ratio of the stored to dissipated total energy in the inductance of square SPI. This work helps to design specified
component. The desired magnetic and parasitic capacitive value of inductance with desired operating frequency for
energy of the components are considered in this definition. This RF/Microwave component modeling and development for
is in contrast to other definitions of a Q-factor that relate to the ultra-wide band applications.
stored magnetic energy only [24-25]. In RF circuit design, ACKnowledgment
however, consideration of the total energy stored in the
The authors would like to thank ICON design Automation
component and the total loss is relevant.
Pvt Ltd Bangalore, for their help and guidance to carry out this
QF_Sim QF_Tested work at their R&D lab.
160
References
Q-Factor
120
[1] W. Wertgen and R. H. Jansen, "Efficient direct and iterative
80
electro-dynamic analysis of geometrically complex MIC and
40 MMIC structures," International Journals Numerical Modeling,
0 Electronic networks and Devices, vol. 2, pp. 153-186, Sept-
1989.
1 2 3
[2] K Hamaguchi, H Ogawa, T Kobayashi, and R Kohno,
Turns
“Development of Ultra-Wideband Short-Range Impulse Radar
Figure9.Turns V/S Q-factor
System for Vehicular Applications,” Vol.E88–C, NO.10 IEEE
Transactions on Microwave Theory and Techniques 52(9), Octr-
The Q-factor = XL/RS (XL =L), for the perfect inductor
2005.
the series resistance is nearly equal to zero then Q-factor will
[3] J. D Mckinney, D Peroulis, A. M. Weiner, “Dispersion
be infinity. However, in practical circuits, the series resistance Limitations of Ultra-Wideband Wireless Links and Their
affects to decrease the Q-factor and increases the dissipation. Compensation Via Photonically Enabled Arbitrary Waveform
Figure 6 shows the Q-factor versus the number of turns. The Generation," IEEE Transaction on Microwave Theory and
EM simulated and tested structures give better quality factor at Techniques Vol. 56, NO, Mar-2008.
desired operating band. The observed EM simulated Q-factor [4] Thomas G. Livernois and Pisti B. Katehi “A Simple Method for
decreases with increase in turns. This shown that increase SPI Characterizing Planar Transmission Line Discontinuities on
turns increases inductance and decreases Q-factor. To achieve Dissipative Substrates,” IEEE Transactions on Microwave
Theory and Techniques, Vol. 39, No. 2, Feb-1991.
[5] Inder Bahl, “Lumped Elements for RF and Microwave Circuits,” [21] E. B. Rosa, "Calculation of the Self-Inductance of Single Layer
Book, Artech House Boston, London. ISBN 1-58053-309-4. Coils," Bull. Bureau Standards, vol. 2, no. 2, pp. 161–187, 1906.
[6] Sundararajan S. Mohan, Maria Del Mar Hershenson, Stephen P. [22] Rogers Corporation. TMM Thermoset Microwave Materials
Boyd, and Thomas H. Lee, "Simple Accurate Expressions for (datasheet).
Planar Spiral Inductances," IEEE Journal of Solid-State Circuits, [23] Choon BengSia , Wei Meng Lim, Beng Hwee Ong, Ah Fatt
Vol. 34, No. 10, Oct-1999. Tong, and Kiat Seng Yeo, "Modeling and Layout Optimization
[7] Jinglin Shi and et al, “The Enhancement of Q Factor for Techniques for Silicon-Based Symmetrical Spiral Inductors,"
Patterned Ground Shield Inductors at High Temperatures,” IEEE Progress In Electromagnetic Research, Vol. 143, pp.1-18,
Transaction on Magnetics, vol. 42, n. 7, 2006. Oct.2013.
[8] Ban-Leong Ooi, Dao-Xian Xu, “Detailed Analysis of High- [24] R. Groves, K. Stein, D. Harame, and D. Jadus, "Temperature
Quality Symmetrical Octagonal Spiral Inductors on Si Dependence of Q in Spiral Inductors Fabricated in a Silicon-
Substrate,” Published online in Wiley Inter-Science, 2005. Germanium BiCMOS Technology," in Proceedings,
[9] H. C. Lu, T. B. Chan, C. C-P. Chen, C-M Liu et al, "LTCC Bipolar/BiCMOS Circuit and Technology Meeting, pp. 153–
Spiral Inductor Synthesis and Optimization with Measurement 156, 1996.
Verification,” IEEE Transaction Advance, The package, vol. 33, [25] K. K. O., “Estimation Methods for Quality Factors of Inductors
no. 1, pp 160-168. Feb 2010. Fabricated in Silicon Integrated Circuit Process Technologies,”
[10] Siamak Salimy, Antoine Goullet, Ahmed Rhallabi, Fatiha IEEE, Solid State Circuits, vol. 33, pp. 1249–1252, Aug-1998.
Challali, Serge Toutain and Jean Claude Saubat, “A Unified [26] .
Analytical and Scalable Lumped Model of RF CMOS Spiral [27] .
Inductors Based on Electromagnetic Effects and Circuit [28] .
Analysis,” Elsevier, Solid state electronics, 2011. [29] .
[11] C. P.Yueet al., “A physical model for planar spiral inductors on [30] .
silicon,” IEDM Tech. Dig., pp. 155–158, Dec. 1996. [31] .
[12] R. B. Merrill, T. W. Lee, H. You, R. Rasmussen, and L. AS. [32] .
Moberly, “Optimization of high Q integrated inductors for [33] .
multilevel metal CMOS,” IEEE Proceding International [34] .
Conference, Electron Devices Meeting, Washington, pp. 38.7.1– [35] .
38.7.4, 1995, [36] .
[13] Ivan C. H. Lai and Minoru Fujishima, “A New On-Chip [37] .
Substrate-Coupled Inductor Model Implemented With Scalable [38] .
Expressions,” IEEE Journal of Solid-State Circuits, vol. 41, n. [39] .
11, 2006. [40] .
[14] I. J. Bahl, "High-performance inductors," IEEE Transaction [41] .
Microwave Theory Technology, vol. 49, no. 4,pp. 654- 664, [42] .
Apr-2001. [43] .
[15] Pan, S. J., L. W. Li, and W. Y. Yin, “Performance Trends of on- [44] .
Chip Spiral Inductors for RFICs,” Progress in Electromagnetic [45] .
Research, Vol. 45, 123–151, 2004. [46] .
[16] J. R. Long and M. A. Copeland. "The Modeling [47] .
Characterization, and Design of Monolithic Inductors for Silicon [48] .
RFIC's," IEEE Solid-State Circuits, vol. 32, pp. 357-369, Mar- [49] .
1997. [50] .
[17] W. T. Weeks, L. L. Wu, M. F. McAllister, and A. Singh. [51] .
"Resistive and Inductive Skin Effect in Rectangular [52] .
Conductors." IBMJ Research Development, vol. 23, pp. 6S2, [53] .
Nov-1979. [54] .
[18] J, C Maxwell, “A Treatise on Electricity and Magnetism,” [55] .
Oxford Clarendon Press, 1873. [56] .
[19] F. W. Grover, "Inductance Calculations," Van Nostrand, [57] .
Princeton, N. J., 1946; reprinted by Dover Publications. New [58] .
York, N.Y, 1962. [59] .
[20] Andrea Sani, John Dunn, Vladimir Veremey, "Using EM Planar [60] .
Simulators for Estimating the Q of Spiral Inductors," AWR [61]
Corporation, a National Instruments Company.