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Power MOSFET Stage For Boost Converters: VUM 33-05N
Power MOSFET Stage For Boost Converters: VUM 33-05N
Power MOSFET Stage For Boost Converters: VUM 33-05N
2 3 4
5 1 3 2 7 8 4 6 1
VRRM (Diode) VDSS Type
V V
600 500 VUM 33-05N
6 7 8
5
ID TS = 85°C 33 A
• Low package inductance for high
ID TS = 25°C 47 A
speed switching
IDM TS = 25°C, tp = ① 130 A
• Ultrafast boost diode
PD TS = 85°C 310 W • Kelvin source for easy drive
IS VGS = 0 V, TS = 25°C 33 A
ISM VGS = 0 V, TS = 25°C, tp = ① 130 A Applications
inverters
IFSM TVJ = 45°C, t = 10 ms (50 Hz) 300 A • Boost topology for SMPS including
t = 8.3 ms (60 Hz) 320 A 1~ rectifier bridge
TVJ = 150°C,t = 10 ms (50 Hz) 260 A • Power supply for welding equipment
t = 8.3 ms (60 Hz) 280 A
Advantages
P TS = 85°C 59 W
• 3 functions in one package
VRRM 1200 V • Output power up to 8 kW
Rectifier Diodes
IXYS reserves the right to change limits, test conditions and dimensions. 20070704a
100
gfs VDS = 15 V, IDS = 12 A 30 S
VDS IDS = 24 A, VGS = 0 V 1.5 V TVJ= 125°C
50
td(on) VDS = 250 V, IDS = 12 A, VGS = 10 V 100 ns
td(off) Zgen. = 1 Ω, L-load 220 ns 0
Ciss 8.5 nF 0.001 0.01 0.1 s 1
t
Coss VDS = 25 V, f = 1 MHz, VGS = 0 V 0.9 nF
Crss 0.3 nF Fig. 1 Non-repetitive peak surge
current (Rectifier Diodes)
Qg VDS = 250 V, ID = 12 A, VGS = 10 V 350 nC
RthJH with heat transfer paste 0.21 K/W
VF IF = 33 A; TVJ = 25°C 1.75 V 500
TVJ =150°C 1.5 V A2s
IR VR = 600 V, TVJ = 25°C 1.5 mA 400
Boost Diode
IXYS reserves the right to change limits, test conditions and dimensions. 20070704a
80 80 2.5
A 10 V A RDS(on) ID=18A
70 70
7V 2.0
60 60
6V
norm.
ID 50 ID 50
1.5
TVJ = 25°C
40 40
TVJ = 125°C
30 VGS= 5 V 30 1.0
20 20
0.5
10 10
0 0 0.0
0 2 4 6 8 V 10 2 3 4 5 6 V 7 -50 0 50 100 °C 150
VDS VGS TVJ
Fig. 3 Typ. output characteristic Fig. 4 Typ. transfer characteristics Fig. 5 Typ. normalized
ID = f (VDS) (MOSFET) ID = f (VGS) (MOSFET) RDS(on) = f (TVJ) (MOSFET)
1.4 12 100
BVDSS V nF
VGS(th)
10
1.2 VDS= 250 V
VGS(th) VDSS
ID = 18 A Ciss
8 10
1.0 VGS
IG = 10 mA C
norm.
6
0.8 Coss
4 1
0.6
2
Crss
0.4 0 0.1
-50 0 50 100 °C 150 0 100 200 300 nC 400 0 5 10 15 V 20
TVJ Qg VDS
Fig. 6 Typ. normalized BVDSS = f (TVJ) Fig. 7 Typ. turn-on gate charge Fig. 8 Typ. capacitances C = f (VDS),
VGS(th) = f (TVJ) (MOSFET) characteristics, VGS = f (Qg) (MOSFET) f = 1 MHz (MOSFET)
80 120 3.0
TVJ=100°C
s A μC
VR= 350 V
100 2.5
60 max.
typ.
0 0 0.0
0 20 40 60 80 A 100 0.5 1.0 1.5 2.0 V 2.5 10 100 A/μs 1000
ID VF -diF/dt
Fig. 9 Typ. transconductance, Fig. 10 Forward current versus Fig. 11 Recovery charge versus -diF/dt
gfs = f (ID) (MOSFET) voltage drop (Boost Diode) (Boost Diode)
IXYS reserves the right to change limits, test conditions and dimensions. 20070704a
40 1.4 0.6
TVJ=100°C TVJ=100°C
μs
A VR= 350 V max. VR= 350 V
0.5
1.2
30 Kt trr
IRM
IF = 37 A 0.4
IF = 74 A 1.0 max. IF = 37 A
IF = 37 A IF = 74 A
20 IRM 0.3
IF = 18.5 A IF = 37 A
0.8 IF = 18.5 A
0.2
10 Qr
0.6
typ. 0.1
typ.
0 0.4 0.0
0 100 200 300 400 A/μs
500 600 20 40 60 °C 160
80 100 120 140 0 100 200 300 400 A/μs 600
500
-diF/dt TVJ -diF/dt
Fig. 12 Peak reverse current versus Fig. 13 Dynamic parameters versus Fig. 14 Recovery time versus
-diF/dt (Boost Diode) junction temperature (Boost Diode) -diF/dt (Boost Diode)
18 12 10
V TS =85°C TS =85°C
kW kW
16
10
8
14 Vin = 230 V/50 Hz
VFR Pout Pout fc = 40 kHz
VFR 8
12
6
10 6
8 4
4
Vin = 115 V/60 Hz
6 fc = 80 kHz
tFR 2
2
4
2 0 0
0 100 200 300 400 A/μs
500 600 0 20 40 60 80 kHz 120
100 0 50 100 150 200
V 250
diF/dt fc Vin (RMS)
Fig. 15 Peak forward voltage versus Fig. 16 Output power versus carrier Fig. 17 Output power versus
-diF/dt (Boost Diode) frequency (Module) mains voltage
9 1.5
kW VUM 33
fc = 80 kHz K/W
8
Vin = 230 V/50 Hz
7 1.2
4
Vin = 115 V/60 Hz 0.6
3
2 0.3 MOSFET
1
0 0.0
40 60 80 100 °C 120 0.01 0.1 1 s 10
TS t
Fig. 18 Output power versus Fig. 19 Transient thermal impedance junction to case for all devices
heatsink temperature (Module)
IXYS reserves the right to change limits, test conditions and dimensions. 20070704a
Authorized Distributor
IXYS:
VUM33-05N