LED Light Sources for Dynamic Lighting

Applications

Rajiv Pathak
Lumileds
Dynamic light distributions in general illumination

Configurable spaces Scene setting Functionality and performance

Shop windows and floors Hospitality Adjust to occupants / activity / traffic
Open plan offices Human centric lighting Improved uniformity
Exhibition spaces Multi-purpose rooms Reduced glare

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 Application requirements for dynamic light sources

Goal: provide the right light only where and when it is needed 1. The right light:
• Quantity (intensity/illuminance)
Space and occupant information • Spectrum

2. Where it is needed:
Lighting design
• High resolution spatial control
• High resolution angular control
Light source
3. When it is needed:
• Dynamic control of all light source parameters
Dynamic light source technology requires
• Individually addressable LED arrays with projection optics
• Resolution and form factor drives need for mini/micro-LEDs

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High luminance sources are a key element of directional lighting

Luminance Lv= d2φ / (dS dΩ cos θ)

Luminous flux from a given source area within a given solid angle

Lower source efficiency … … but higher optical delivery efficiency

due to droop (epi/die/phosphor) and package design through better optical control in secondary optics
1.00 20
Droop in pc white LED Standard
0.95
High luminance
0.90 15
0.85
Normalized EQE

0.80

cd/lm
0.75
Standard 10
0.70
0.65 5
0.60
0.55
0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 High luminance 0
Current density (A/mm2) -30 -27 -24 -21 -18 -15 -12 -9 -6 -3 0 3 6 9 12 15 18 21 24 27 30
Angle (°)

Next step in optical delivery efficiency: dynamic directional lighting

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 Source dimensions for high luminance sources
LED die size

≥1000 µm 100 µm Is there value in going to 10 µm?

State of the art directional
lighting
Improved directional Basic projection display High definition projection display
lighting High-precision dynamic
Dynamic beam shaping beam shaping
Low glare Walking directions,
Thin form factor emergency lighting
Better color mixing Information display

6°
18°
25°

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Spectral quality
“The right light”

Illumination requires broad spectrum with high color fidelity

Two options:
1. Phosphor-converted LED
Currently best efficacy but challenging for mini/micro-LED:
• Phosphor materials, small grain size or QD
• Phosphor integration process

2. Color-mixed LED
Direct emitter RGBA can achieve CRI>90, but:
• Combining different emitters, challenges in control and
color mixing
• Efficiency of green and amber needs improvement Roadmap from DOE Lighting RDO

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 Individually addressable arrays with projection optics
Light “where it is needed”

~0.5 mm
50 um

0.5 mm
0.5 mm

Optical system no longer requires pre-collimation

Optical system requires pre-collimation
• Close coupled pre-collimation optics are used to create
homogeneous headlighting
• Module of 3 rows of 84 discrete high-luminance LEDs
• Smallest package: Light emitting area and package
same as chip size
• Enable higher pixel count with more functionality
• Provide higher resolution
• Ease of array layout customization
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Towards high spatial and angular resolution
Digital headlighting roadmap

Basic ADB Matrix Advanced ADB Matrix HD Digital Beam

Audi A8 Matrix Light Daimler, Multibeam LED HL Daimler Digital Light

ADB Glare free high- ADB LED Matrix DIGITAL HL

beam
with horizontal beam additional vertical high resolution
segmentation segmentation

~10-25 LEDs ~100-200 LEDs ~ 1K -1M pixels

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 Automotive microLED Array Architecture

Design compromise between

• Pixel size vs light output/efficiency Pixel

• Optical contrast vs light output/efficiency

• Pixel count and resolution vs chip size and pixel size Phosphor
AlInGaN die
Phosphor coated pixels
Interconnect

CMOS Backplane

AlInGaN Challenges
Die • Thermal management

Interconnect • Yield (5N = 99.999%).

• Defect reduction efforts to
support large die (~50 mm2).
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Prototype addressable microLED array die on CMOS

1 Row Pixels turned on All Pixels turned on

1 Pixel turned on

Cu Pillars

LED Die

CMOS Die

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Light “where it is needed” requires further LED miniaturization
Challenges:
• As device dimensions shrink, perimeter to area ratio increases, device EQE decreases in both InGaN and AlInGaP
material systems.
• The reduction in EQE is especially pronounced for AlInGaP material system where surface recombination
velocities are an order of magnitude higher than for the InGaN material system.

ExE ExE
IQE IQE
1000um 100um 10um 1000um 100um 10um
VTF architecture is typically employed for larger devices. There
Reduction of EQE in Blue and Green devices is largely a result Is a discontinuity at ~ 100um die sizes where lateral architectures
of a drop in ExE. need to be employed. Any improvement to IQE will help EQE of
smaller devices.
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 Efficiency improvements for mini/micro LED’s
• ExE improvements – reflective contacts, surface texturing etc. to enhance light extraction
• IQE improvements – largely focused on surface treatments with dielectric sidewall passivation

Mathew S. Wong et al “Size independent peak efficiency of Mathew S. Wong et al “Improved performance of
III-nitride micro-light-emitting-diodes using chemical treatment AlInGaP red micro-light-emitting diodes with sidewall
and sidewall passivation” 2019 Appl. Phys. Express 12 097004 treatments” Optics Express

➢ Research is required to understand and mitigate the reduction in efficiency that arises from
die miniaturization through advances in processing (etch/dielectric), characterization and epi

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Summary

• Lighting is moving to higher levels of functionality and technology integration

• In automotive forward lighting, new technologies advance miniaturization and greater

functionality of compact ADB sources

• In general lighting, light-source technology can be further paired with electronic and optical
systems to extend the dynamic capability of the source

• High color quality will require novel pc-LED architectures or RGBA cm-LED systems

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