MSCM20XM10T3XG: Three Phase Leg MOSFET Power Module

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MSCM20XM10T3XG

VDSS = 200V
Three phase leg RDSon = 9.7m max @ Tj = 25°C
MOSFET Power Module ID = 108A @ Tc = 25°C

Application
 Motor control

Features
 MOSFET
- Low RDSon
- Low input and Miller capacitance
- Low gate charge
- Fast intrinsic reverse diode
- Avalanche energy rated
- Very rugged

 Low stray inductance


 High level of integration
 Internal thermistor for temperature monitoring

Benefits
 Stable temperature behavior
 Very rugged
 Direct mounting to heatsink (isolated package)
 Low junction to case thermal resistance
 Low profile
 RoHS Compliant

All multiple inputs and outputs must be shorted together


Example: 21/22/23 ; 25/26/27/28/29 … …

All ratings @ Tj = 25°C unless otherwise specified

Absolute maximum ratings (Per switch)


Symbol Parameter Max ratings Unit
VDSS Drain - Source Voltage 200 V
Tc = 25°C 108
ID Continuous Drain Current
Tc = 80°C 83 A
IDM Pulsed Drain current 430
VGS Gate - Source Voltage ±20 V
MSCM20XM10T3XG – Rev 0 October, 2018

RDSon Drain - Source ON Resistance 9.7 m


PD Power Dissipation Tc = 25°C 341 W
EAS Single Pulse Avalanche Energy 760 mJ

These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.

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MSCM20XM10T3XG

Electrical Characteristics (Per switch)


Symbol Characteristic Test Conditions Min Typ Max Unit
IDSS Zero Gate Voltage Drain Current VGS = 0V,VDS = 200V 50 µA
RDS(on) Drain – Source on Resistance VGS = 10V ; ID = 81A 8 9.7 m
VGS(th) Gate Threshold Voltage VGS = VDS, ID = 250µA 3 5 V
IGSS Gate – Source Leakage Current VGS = ±20 V, VDS = 0V ±140 nA

Dynamic Characteristics (Per switch)


Symbol Characteristic Test Conditions Min Typ Max Unit
Ciss Input Capacitance VGS = 0V 10.7
Coss Output Capacitance VDS = 50V 0.81 nF
Crss Reverse Transfer Capacitance f = 1 MHz 0.16
Qg Total gate Charge 161
VGS = 10V
Qgs Gate – Source Charge VBus = 100V 54 nC
Qgd Gate – Drain Charge ID = 75A 52
Td(on) Turn-on Delay Time 41
VGS = 10V
Tr Rise Time VBus = 130V 105
ns
Td(off) Turn-off Delay Time ID = 75A 64
RG = 2.7
Tf Fall Time 75
RthJC Junction to Case Thermal Resistance 0.44 °C/W

Source - Drain diode ratings and characteristics (Per switch)


Symbol Characteristic Test Conditions Min Typ Max Unit
VSD Diode Forward Voltage VGS = 0V, IS = 81A 1.3 V
Tj = 25°C 130
trr Reverse Recovery Time IS = 75A ns
Tj = 125°C 155
VR = 100V
diS/dt = 100A/µs Tj = 25°C 633
Qrr Reverse Recovery Charge nC
Tj = 125°C 944

Temperature sensor NTC


Symbol Characteristic Min Typ Max Unit
R25 Resistance @ 25°C 22 k
R25/R25 Resistance tolerance 5
%
B/B Beta tolerance 3
B 25/100 T25 = 298.16 K 3980 K
R25
RT 
  1 1  T: Thermistor temperature
MSCM20XM10T3XG – Rev 0 October, 2018

exp  B25 / 100    RT: Thermistor value at T


  25
T T 

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MSCM20XM10T3XG

Thermal and package characteristics


Symbol Characteristic Min Max Unit
VISOL RMS Isolation Voltage, any terminal to case t =1 min, 50/60Hz 4000 V
TJ Operating junction temperature range -40 175
TJOP Recommended junction temperature under switching conditions -40 TJmax -25
°C
TSTG Storage Temperature Range -40 125
TC Operating Case Temperature -40 125
Torque Mounting torque To heatsink M4 2 3 N.m
Wt Package Weight 120 g

Package outline (dimensions in mm)

MSCM20XM10T3XG – Rev 0 October, 2018

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MSCM20XM10T3XG

Typical Performance Curve


Maxim um thermal impedance
ZTHJC (°C/W)

0.1

1 2 3 4 5 6 7
Ri (°C/W) 0.014 0.061 0.014 0.223 0.010 0.076 0.042
taui (s) 0.011 0.004 0.016 0.056 0.039 0.015 0.043
0.01
0.001 0.01 0.1 1
tim e (s)

Low Voltage Output Characteristics Drain Source On state resistance


160
TJ=25°C 3
140 VGS = 10& 15V
VGS = 10V
RDS(on) (norm aliezd)
ID, Drain Current (A)

120 2.5
I D=75A

100
80 2
60
8V 7V
40 1.5

20
1
0
25 50 75 100 125 150 175
0 0.5 1 1.5 2 2.5 3
V DS , Drain to Source Voltage (V) TJ (°C)

Capacitance vs Drain to Source Voltage Gate Charge vs Gate to Source Voltage


100000 10
V GS , Gate to Source Voltage (V)

VDS=100V
Ciss I D=75A
8 TJ=25°C
C, Capacitance (pF)

10000

6
Coss
1000
4

100 2
Crss
MSCM20XM10T3XG – Rev 0 October, 2018

10 0
0 12.5 25 37.5 50 0 20 40 60 80 100 120 140 160

V DS , Drain to Source Voltage (V) Gate Charge (nC)

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MSCM20XM10T3XG

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Microsemi in writing signed by an officer of Microsemi.

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without any notice. This product has been subject to limited testing and should not be used in conjunction with life-
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Buyer alternative solutions to meet Buyer application specification based on Sellers sales conditions applicable for the
new proposed specific part.
MSCM20XM10T3XG – Rev 0 October, 2018

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