HUAWEI BSC6000 Base Station Controller

BSC Product Description 3 BSC TDM Switching Subsystem

3 BSC TDM Switching Subsystem

About This Chapter

The Time Division Multiplexing (TDM) switching subsystem provides data exchange in the
circuit switched (CS) domain.

3.1 Physical Structure of the BSC TDM Switching Subsystem

This topic describes the physical components of the BSC TDM switching subsystem. These
components comprises the GTNU, GDPUC, interface boards, backplane in the subrack, and
inter-GTNU cables.
3.2 Logical Structure of the BSC TDM Switching Subsystem
This topic describes the logical components of the BSC TDM switching subsystem. These
components comprise the TDM switching unit, TDM access unit, and TDM processing unit.

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3 BSC TDM Switching Subsystem BSC Product Description

3.1 Physical Structure of the BSC TDM Switching

Subsystem
This topic describes the physical components of the BSC TDM switching subsystem. These
components comprises the GTNU, GDPUC, interface boards, backplane in the subrack, and
inter-GTNU cables.

Inter-Subrack TDM Interconnections

Inter-subrack TDM interconnections of the BSC comprise the TDM interconnection between
the GMPS and GEPS, as well as the TDM interconnection between the GTCSs.
l The TDM interconnections between the GMPS and the GEPS are established through inter-
GTNU cables, as shown in Figure 3-1.
l The TDM interconnections between the GTCSs are also established through inter-GTNU
cables, as shown in Figure 3-2.

Figure 3-1 TDM interconnections between GMPS and GEPS

GMPS GEPS

G G G G
T T T T
N N N N
U U U U

Active Standby Active Standby

Figure 3-2 TDM interconnections between GEPSs

GTCS GTCS
G G
G G G G
D D
T T T T
P P
N N N N
U U
U U U U
C C
Active Standby Active Standby

The GMPS (or GEPS) communicates with the GTCS on the Ater interface; therefore, there is
no inter-subrack TDM interconnections between them.

The BSC supports the TDM interconnections of up to four subracks. The combination of the
four subracks is as follows:

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l One GMPS and three GEPSs

l Four GTCSs

Intra-Subrack TDM Interconnections

Figure 3-3 shows the intra-subrack TDM interconnections of the GMPS (GEPS or GTCS).

Figure 3-3 Intra-subrack TDM interconnections

GMPS/GEPS/GTCS

Active GTNU Standby GTNU

Service board 1 Service board 2 …… Service board 24

In Figure 3-3, the GTNU works in active/standby mode. The other boards in the subrack connect
to the active GTNU and standby GTNU through backplane TDM paths.

3.2 Logical Structure of the BSC TDM Switching Subsystem

This topic describes the logical components of the BSC TDM switching subsystem. These
components comprise the TDM switching unit, TDM access unit, and TDM processing unit.

TDM switching unit

The functions of the TDM switching unit are performed by the GTNU. The TDM switching unit
supports 128K x 128K TDM switching. It provides CS data exchange links in the BSC to
implement the TDM switching of the timeslots between the GTNU and the backplane. Each
route of TDM switching has a bandwidth of 64 kbit/s.
Figure 3-4 shows the TDM switching in the GTNU.

Figure 3-4 TDM switching in the GTNU

TDM switching unit

Ports Ports on
on the panel the backplane
LVDS port 128K x 128K LVDS port

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NOTE

l The GTNU panel provides 12 Low Voltage Differential Signals (LVDS) high-speed serial ports. Every
two ports work in active/standby mode. Thus, six external ports are available on the GTNU panel.
There ports are named TDM0–TDM5.
l The GTNU also provides 24 LVCS high-speed serial ports for slots 00–03 and 08–27 in the backplane.
In other words, the GTNU provides one LVCS high-speed serial port for each slot except the slots
reserved for the GTNU and GSCU. Even these slots are not inserted with boards, the communication
between the empty slots and the GTNU is established.
LVDS is a signal interface level that supports high speed, anti-interference, and long transmission distance.

TDM Access Unit

The functions of the TDM access unit are performed by the GEIUB/GOIUB, GEIUP/GOIUP,
GEIUT/GOIUT, and GEIUA/GOIUA. The TDM access unit provides 16K x 16K timeslot
switching between the GEIUB/GOIUB, GEIUP/GOIUP, GEIUT/GOIUT, GEIUA/GOIUA, and
the backplane.
Figure 3-5 shows the TDM switching in an interface board.

Figure 3-5 TDM switching in an interface board

E1/T1
TDM
or STM-1 Ports on
switching module
subboard the backplane
LVDS port 32K x32K LVDS port

TDM Processing Unit

The functions of the TDM processing unit are performed by the GDPUC. It provides 16K x 16K
timeslot switching between the Digital Signal Processing (DSP) module and the backplane.
Figure 3-6 shows the TDM switching in the GTNU.

Figure 3-6 TDM switching in the GDPUC

TDM switching
DSP Ports on the
module
backplane
LVDS port 16K x 16K LVDS port

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Logical Structure of the GMPS/GEPS TDM Switching Subsystem

Figure 3-7 shows the logical structure of the GMPS/GEPS TDM switching subsystem.

Figure 3-7 Logical structure of the GMPS/GEPS TDM switching subsystem

GMPS/GEPS

TDM access unit TDM switching unit

GEPS

TDM access unit TDM switching unit

Inter-GTNU cable
TDM path of the
backplane

Figure 3-7 shows that, in the GMPS (or GEPS), the TDM access unit and the TDM switching
unit are linked through the TDM path of the backplane. The TDM switching units between the
GMPS and GEPS are linked through an inter-GTNU cables.

Logical Structure of the GTCS TDM Switching Subsystem

Figure 3-8 shows the logical structure of the GTCS TDM switching subsystem.

Figure 3-8 Logical Structure of the GTCS TDM Switching Subsystem

GTCS

TDM
processing unit
TDM switching unit
TDM
access unit

GTCS

TDM
processing unit
TDM switching unit
TDM
access unit

TDM path of the

backplane

Inter-GTNU cable

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Figure 3-8 shows that, in the GTCS, the TDM processing unit and the TDM switching unit, as
well as the TDM access unit and the TDM switching unit, are linked through the TDM path of
the backplane. The TDM switching units between the GTCSs are linked through an inter-GTNU
cables.

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