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SSM07N70CP,R-A

N-channel Enhancement-mode Power MOSFET

Dynamic dv/dt rating BVDSS 675V


D
Repetitive Avalanche Rated R DS(ON) 1.2Ω
Fast Switching I D 7A
Simple Drive Requirement G
S

DESCRIPTION
The SSM07N70C series is specially designed as a main switching device
for universal 90~265VAC off-line AC/DC converter applications.
Both TO-220 and TO-262 type provide high blocking voltage to overcome G
D TO-220 (P)
voltage surge and sag in the toughest power system with the best S
combination of fast switching,ruggedized design and cost-effectiveness.

The TO-220 and TO-262 packages are widely preferred for all commercial
and industrial applications. The device is well suited for switch-mode
power supplies, AC-DC converters and high-current high-speed switching
circuits. G
D
S TO-262 (R)
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Rating Units
VDS Drain-Source Voltage 675 V
VGS Gate-Source Voltage ± 30 V
ID @ TC=25°C Continuous Drain Current, VGS @ 10V 7 A
ID @ TC=100°C Continuous Drain Current, VGS @ 10V 4.4 A
1
IDM Pulsed Drain Current 18 A
PD @ TC=25°C Total Power Dissipation 89 W
Linear Derating Factor 0.7 W/°C
2
EAS Single Pulse Avalanche Energy 140 mJ
IAR Avalanche Current 7 A
EAR Repetitive Avalanche Energy 7 mJ
TSTG Storage Temperature Range -55 to 150 °C
TJ Operating Junction Temperature Range -55 to 150 °C

THERMAL DATA
Symbol Parameter Value Unit
Rthj-c Thermal Resistance Junction-case Max. 1.4 °C/W
Rthj-a Thermal Resistance Junction-ambient Max. 62 °C/W

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SSM07N70CP,R-A
Electrical Characteristics@Tj=25oC(unless otherwise specified)
Symbol Parameter Test Conditions Min. Typ. Max. Units
BVDSS Drain-Source Breakdown Voltage VGS=0V, ID=1mA 675 - - V
∆ BV DSS/∆ Tj Breakdown Voltage Temperature Coefficient Reference to 25°C, ID=1mA - 0.6 - V/°C
RDS(ON) Static Drain-Source On-Resistance VGS=10V, ID=3.5A - - 1.2 Ω
VGS(th) Gate Threshold Voltage VDS=VGS, ID=250uA 2 - 4 V
gfs Forward Transconductance VDS=10V, ID=3.5A - 4.5 - S
o
IDSS Drain-Source Leakage Current (Tj=25 C) VDS=675V, VGS=0V - - 10 uA
o
Drain-Source Leakage Current (Tj=150 C) VDS=480V, VGS=0V - - 100 uA
IGSS Gate-Source Leakage VGS= ± 30V - - ±100 nA
3
Qg Total Gate Charge ID=7A - 32 - nC
Qgs Gate-Source Charge VDS=480V - 8.6 - nC
Qgd Gate-Drain ("Miller") Charge VGS=10V - 9 - nC
3
td(on) Turn-on Delay Time VDD=300V - 17 - ns
tr Rise Time ID=7A - 15 - ns
td(off) Turn-off Delay Time RG=10Ω, VGS=10V - 35 - ns
tf Fall Time RD=43Ω - 18 - ns
Ciss Input Capacitance VGS=0V - 2075 - pF
Coss Output Capacitance VDS=25V - 120 - pF
Crss Reverse Transfer Capacitance f=1.0MHz - 8 - pF

Source-Drain Diode
Symbol Parameter Test Conditions Min. Typ. Max. Units
IS Continuous Source Current ( Body Diode ) VD=VG=0V , VS=1.5V - - 7 A
1
ISM Pulsed Source Current ( Body Diode ) - - 18 A
3
VSD Forward On Voltage Tj=25°C, IS=7A, VGS=0V - - 1.5 V

Notes:
1.Pulse width limited by safe operating area.
2.Starting Tj=25oC , VDD=50V , L=5mH , RG=25Ω , IAS=7A.
3.Pulse width <300us , duty cycle <2%.

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SSM07N70CP,R-A

12

T C =25 o C V G =10V T C =150 o C


8
V G =10V
10
V G =6.0V V G =6.0V
V G =5.5V V G =5.5V

ID , Drain Current (A)


ID , Drain Current (A)

8 6

V G =5.0V
6
V G =5.0V 4

2
V G =4.0V
2

V G =4.0V
0 0
0 5 10 15 20 25 0 10 20 30 40

V DS , Drain-to-Source Voltage (V) V DS , Drain-to-Source Voltage (V)

Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics

1.2 3

I D =3.5A

2.5 V G =10V

1.1
Normalized BVDSS (V)

2
Normalized R DS(ON)

1 1.5

0.9

0.5

0.8 0
-50 0 50 100 150 -50 0 50 100 150

T j , Junction Temperature ( o C) T j , Junction Temperature ( o C)

Fig 3. Normalized BVDSS vs. Junction Fig 4. Normalized On-Resistance


Temperature vs. Junction Temperature

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SSM07N70CP,R-A

8 100

80
6
ID , Drain Current (A)

5
60

PD (W)
4

40
3

20

0
0
25 50 75 100 125 150 0 50 100 150

o o
T c , Case Temperature ( C) Tc , Case Temperature( C)

Fig 5. Maximum Drain Current vs. Fig 6. Typical Power Dissipation


Case Temperature

1
100

DUTY=0.5
Normalized Thermal Response (R thjc)

0.2
10

10us 0.1
ID (A)

0.1

100us 0.05

PDM

1 0.02 SINGLE PULSE t


T
1ms 0.01

o
T c =25 C Duty factor = t/T

Single Pluse 10ms Peak Tj = P DM x Rthjc + TC

100ms
0 0.01
1 10 100 1000 10000 0.00001 0.0001 0.001 0.01 0.1 1 10

V DS (V) t , Pulse Width (s)

Fig 7. Maximum Safe Operating Area Fig 8. Effective Transient Thermal Impedance

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SSM07N70CP,R-A

f=1.0MHz
16 10000

14 I D =7A
Ciss
VGS , Gate to Source Voltage (V)

12
V DS =320V
V DS =400V
10
V DS =480V
Coss

C (pF)
8 100

Crss
2

0 1
0 5 10 15 20 25 30 35 40 45 50 1 5 9 13 17 21 25 29

Q G , Total Gate Charge (nC) V DS (V)

Fig 9. Gate Charge Characteristics Fig 10. Typical Capacitance Characteristics

100 5

10

T j = 150 o C T j = 25 o C
3
VGS(th) (V)
IS (A)

0.1
1

0.01 0
0.1 0.3 0.5 0.7 0.9 1.1 1.3 1.5 -50 0 50 100 150

V SD (V) T j , Junction Temperature ( o C)

Fig 11. Forward Characteristic of Fig 12. Gate Threshold Voltage vs.
Reverse Diode Junction Temperature

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SSM07N70CP,R-A

VDS
RD 90%

VDS TO THE
D OSCILLOSCOPE

0.5x RATED VDS


RG G

10%
+ S
10 V
VGS
VGS
-

td(on) tr td(off) tf

Fig 13. Switching Time Circuit Fig 14. Switching Time Waveform

VG

VDS

TO THE QG
D OSCILLOSCOPE
10V
0.8 x RATED VDS
G QGS QGD

S VGS
+
1~ 3 mA
-
IG ID

Charge Q

Fig 15. Gate Charge Circuit Fig 16. Gate Charge Waveform

Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no
guarantee or warranty, express or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no
responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its
use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including
without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to
the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of
Silicon Standard Corporation or any third parties.

3/21/2005 Rev.2.01 www.SiliconStandard.com 6 of 6

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