This document outlines three patterns (PTN) for a DIY BGA reball station: PTN 0 for desoldering a BGA chip, PTN 1 for reballing with Sn63Pb37 solder, and PTN 2 for reballing with Sn96.5Ag3Cu0.5 solder. Each pattern lists the resistance (R), inductance (L), and duration (D) settings for six steps (1-6) of the reballing process.
This document outlines three patterns (PTN) for a DIY BGA reball station: PTN 0 for desoldering a BGA chip, PTN 1 for reballing with Sn63Pb37 solder, and PTN 2 for reballing with Sn96.5Ag3Cu0.5 solder. Each pattern lists the resistance (R), inductance (L), and duration (D) settings for six steps (1-6) of the reballing process.
This document outlines three patterns (PTN) for a DIY BGA reball station: PTN 0 for desoldering a BGA chip, PTN 1 for reballing with Sn63Pb37 solder, and PTN 2 for reballing with Sn96.5Ag3Cu0.5 solder. Each pattern lists the resistance (R), inductance (L), and duration (D) settings for six steps (1-6) of the reballing process.