1301 RDH 102 75 3 RevE

Confidentiality Class External Confidentiality Label Document Type Page
Ericsson Internal Product Specification 1 (71)

Prepared By (Subject Responsible) Approved By (Document Responsibile) Checked
EGIARIC Gianluca Ricci BNEWKIK [Jon Ji] EZSONMI

Document Number Revision Date Reference
1301-RDH 102 75/3 Uen E 2020-02-23
25GBASE-LR SFP28
Given under confidence.

May not be distributed outside your company.
Contents
1 General ................................................................................................................................ 5
1.1 Laser Safety ............................................................................................................................................. 8
1.2 Self-Ignition/Flammability ....................................................................................................................... 8
1.3 Handling .................................................................................................................................................. 8
1.4 Material ................................................................................................................................................... 8
1.5 Quality Requirements ............................................................................................................................. 8
1.6 Supplier Responsibility for Changes Notification .................................................................................... 9
1.7 Cleanness of Fibre Optic Connectors ...................................................................................................... 9
2 Design ................................................................................................................................ 10
2.1 Mechanical Specifications ..................................................................................................................... 10
2.1.1 Module Dimensions .............................................................................................................................. 10
2.1.2 Cooling Surface ..................................................................................................................................... 11
2.1.3 IPF Module Durability and Card Edge Connector .................................................................................. 12
2.1.4 Bail Latch ............................................................................................................................................... 12
2.2 Interfaces .............................................................................................................................................. 13
2.2.1 Optical Interface.................................................................................................................................... 13
2.2.2 Electrical Interface ................................................................................................................................ 14
2.2.2.1 Module Connector ........................................................................................................................... 14
2.2.2.2 Host Connector ................................................................................................................................ 14
3 Specifications ..................................................................................................................... 16
3.1 Absolute Maximum Ratings .................................................................................................................. 16
3.2 Recommended Operating Conditions ................................................................................................... 16
3.3 Characteristic Values ............................................................................................................................. 17
3.3.1 Fibre Optic Link Characteristics ............................................................................................................. 18
3.3.2 Transmitter Optical Characteristics....................................................................................................... 19
3.3.3 Receiver Optical Characteristics ............................................................................................................ 20
3.3.3.1 Tx waveform @ 10G for Compatibility ............................................................................................ 21
3.3.4 Latency .................................................................................................................................................. 22
3.3.5 Jitter Characteristics .............................................................................................................................. 22
3.3.6 Electrical Characteristics ....................................................................................................................... 22
3.3.6.1 Slew Rate at 10G or lower rates ......................................................... Error! Bookmark not defined.
3.3.7 Electromagnetic Compatibility and Immunity ...................................................................................... 23
3.4 Functional Description .......................................................................................................................... 24
3.4.1 Options and other Requirements ......................................................................................................... 24
3.4.2 Receiver Loss of Signal (Rx_LOS) ........................................................................................................... 25
3.4.3 Soft Tx_DISABLE .................................................................................................................................... 25


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3.4.4 Tx_DISABLE State .................................................................................................................................. 25

3.4.5 Equalization/Emphasis Control ............................................................................................................. 26
3.4.6 Variable Receiver Decision Threshold Control ...................................................................................... 26
3.4.7 Page Selection ....................................................................................................................................... 27
3.4.8 Power Level Selection ........................................................................................................................... 28
3.4.9 Tx_FAULT Behavior ............................................................................................................................... 28
3.4.10 Control of CDRs ..................................................................................................................................... 30
3.4.10.1 Software-only Implementation...................................................................................................... 30
3.4.11 Transceiver Power Cycling .................................................................................................................... 31
3.4.12 Squelching Functionality ....................................................................................................................... 31
3.4.12.1 Tx Squelch ...................................................................................................................................... 31
3.4.12.2 Rx Squelch ...................................................................................................................................... 31
3.4.13 Service Disruption ................................................................................................................................. 31
3.4.14 Loopback Functionality ......................................................................................................................... 32
3.4.15 Protection Mechanism .......................................................................................................................... 33
3.4.16 Timing Specifications............................................................................................................................. 34
3.4.16.1 Timing Requirements of Control & Status I/O ............................................................................... 34
3.4.16.2 Timing Requirements of Software Control & Status I/O ................................................................ 35
3.5 Digital Diagnostic Memory Map ........................................................................................................... 36
3.5.1 Address A0h - Serial ID defined by SFP MSA .......................................................................................... 37
3.5.2 Address A0h - Vendor Specific ............................................................................................................... 43
3.5.3 Address A2h – Bytes 0-95 Area .............................................................................................................. 47
3.5.4 Address A2h - User Writable EEPROM................................................................................................... 47
3.5.4.1 CRC Algorithm .................................................................................................................................. 50
3.5.5 Json file for EEPROM check ................................................................................................................... 51
3.6 Digital Diagnostics ................................................................................................................................. 52
3.6.1 Digital Diagnostics Monitoring Accuracy............................................................................................... 52
3.6.2 Alarm and Warning Thresholds ............................................................................................................. 53
3.6.3 Alarm and Warning Flags ...................................................................................................................... 55
4 Product Quality .................................................................................................................. 57

4.1 Reliability and Lifetime .......................................................................................................................... 57
4.1.1 Continuous Operation (case temperature figures) ............................................................................... 57
4.2 Acceptance Criteria ............................................................................................................................... 58
4.3 Production Test Data ............................................................................................................................ 59
5 Labelling ............................................................................................................................ 60
5.1 Product Marking of the Component ..................................................................................................... 60
5.2 Product Package Marking ..................................................................................................................... 61
6 Ericsson Serialization .......................................................................................................... 62

7 Packing .............................................................................................................................. 63
8 References ......................................................................................................................... 64
9 Abbreviations and Acronyms .............................................................................................. 66
10 Product List ........................................................................................................................ 68
11 Document Revision ............................................................................................................ 69


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List of Figures
Figure 1 – Drawing of Dual-Fibre Working transceiver (dimensions are in millimetres) ....................... 10

Figure 2 – Module cooling surface .......................................................................................................... 11
Figure 3 – 25GBASE-R PMD block diagram ............................................................................................. 13
Figure 4 – Module contact assignment ................................................................................................... 14
Figure 5 – Host PCB pad assignment ....................................................................................................... 14
Figure 6 – Tx waveform definition .......................................................................................................... 21
Figure 7 – 2-wire Interface Fields ............................................................................................................ 36
Figure 8 – Layout of component label (text enclosed in angle brackets, “ABC1234567” and
“A12BC34D56” shall be replaced with the required information) ......................................................... 60
Figure 9 – Layout of package label (text enclosed in angle brackets, “ABC1234567” and
“YYYYMMDD” shall be replaced with the required information) ........................................................... 61
List of Tables
Table 1 – Data Rate and Standard............................................................................................................. 6

Table 2 – Module pin function definition ............................................................................................... 15
Table 3 - Absolute Maximum Ratings ..................................................................................................... 16
Table 4 - Operating Conditions ............................................................................................................... 16
Table 5 – Link Characteristics .................................................................................................................. 18
Table 6 – Transmitter Optical Characteristics ......................................................................................... 19
Table 7 – Receiver Optical Characteristics .............................................................................................. 20
Table 8 – Tx optical eye characteristics................................................................................................... 21
Table 9 – Latency..................................................................................................................................... 22
Table 10 – Electrical Characteristics........................................................................................................ 22
Table 11 – EMI, EMC and ESD requirements. ......................................................................................... 23
Table 12 – Laser status and Tx_FAULT during Start-Up .......................................................................... 28
Table 13 – Laser status and Tx_FAULT during normal operations (Tx_DISABLE Low)............................ 29
Table 14 – Tx_DISABLE effects ................................................................................................................ 29
Table 15 – CDRs control logic table ......................................................................................................... 30
Table 16 – Loopback control logic table ................................................................................................. 32
Table 17 – Timing Requirements ............................................................................................................ 34
Table 18 – Soft I/O Timing Requirement ................................................................................................ 35
Table 19 – Address A0h - Serial ID defined by SFP MSA ......................................................................... 42
Table 20 – Vendor Specific area value assignment ................................................................................. 46
Table 21 – Password entry fields ............................................................................................................ 47
Table 22 – User Writable area ................................................................................................................ 49
Table 23 – DDMs Accuracy ...................................................................................................................... 52
Table 24 – Alarm and Warning Thresholds ............................................................................................. 54


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Table 25 – Alarm and Warning Flags....................................................................................................... 56

Table 26 – Lifetime and Failure Rate....................................................................................................... 57
Table 27 – Acceptance criteria ................................................................................................................ 58
Table 28 – Package Material Classes....................................................................................................... 63
Table 29 – List of Products ...................................................................................................................... 68


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1 General
This Product Specification defines the requirements for two Multirate SFP28 (28 Gbit/s Enhanced Small
Form-factor Pluggable) transceiver modules which are required to support serial signals within the
range 1.0625 ÷ 25.78125 Gbit/s, over 10 km of single-mode fibre.
This Product Specification details the characteristics of the following product(s), as detailed in
Chapter 10:
 (Ericsson PN TBA) is the SFP28 module for the Commercial temperature range
(from -5 to 70 °C)
 RDH 102 75/3 is the SFP28 module for the Industrial temperature range
(from -40 to 85 °C).
The module is based on the SFP+ MSA form-factor, a hot-pluggable small footprint data-agnostic single
lane optical transceiver (electrical-to-optical device) pluggable into a cage. The module shall support an
optical receptacle with a duplex LC connector and an electrical connector mated with the printed circuit
board. The module has an EEPROM for identification information and digital diagnostics monitoring
(DDM) functions, accessible via the 2-wire serial interface.
These transceivers consist of a transmit side based on uncooled 1310 nm DFB laser, a limiting receiver
based on a PIN photodiode and a CDR in the transmitter and receiver paths.
A non-exhaustive list of main applications with their corresponding data rates that these components
shall support is in Table 1.


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Line Rate
Communication Standard | Variant Type/Application Code Link Length
[Gbit/s]
GbE 1000BASE-X |non-standard 1.25
10GbE 10GBASE-R |non-standard 10.3125
Ethernet
25GbE 25GBASE-LR (see [1]) 25.78125
1GFC 1.0625
2GFC 2.125
4GFC 4.25
Fibre Channel 8GFC none relevant 8.5
10GFC 10.51875
16GFC 14.025
OTU1 2.666
OTU2 10.709
none relevant
OTN OTU2e 11.095
OTU2f 11.32
SDR 2.5
DDR 5
up to 10 km
QDR none 10
InfiniBand
FDR 14.0625 (see §3.3.1)
EDR 25.78125
1G RP3-01 rate (2x) 1.536
OBSAI 3G RP3-01 rate (4x) none 3.0720
6G RP3-01 rate (8x) 6.1440
option 2 (2x) 1.2288
option 3 (4x) 2.4576
option 4 (5x) 3.0720
option 5 (8x) 4.9152
option 6 (10x) 6.1440
none
CPRI option 7A (16x) (1) 8.1101
option 7 (16x) 9.8304
option 8 (20x) (1) 10.1376
option 9 (24x) (1) 12.16512
option 10 (48x) (1) 24.33024
Table 1 – Data Rate and Standard
1. The line coding 64B/66B is used instead of 8B/10B.


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The component shall conform to the applicable requirements stated in IEEE Std 802.3-2018 [1], Ericsson
Specifications No. 105 63-2031 Uen [2] and No. 105 63-2037 Uen [3], CPRI Specification [4], Fibre
Channel Specifications [5]-[7], OBSAI Specification [8], InfiniBand Specification [9], ITU-T G.957 [10] and
ITU-T G.709 [11], SFF Committee Specifications [12] to [19], as well as to the specific requirements given
in this Product Specification.
All requirements stated in this document are valid throughout the specified product lifetime and
recommended operating conditions unless otherwise stated.
NOTE – Refer to Chapter 9 for acronyms and abbreviations.
NOTE – Hereafter the Supplier will be also referred to as Vendor. The SFP28 module will be also referred
to as SFP28, module, device, SFP28 transceiver or transceiver.
NOTE (reserved for Ericsson internal use) – This document has to be read in conjunction with the
technical Gap Analysis (compliance document) between Ericsson’s Product Specification and approved
Supplier’s device features (n/170 05 documents stored in PRIM). This because different design
implementations could reflect in differences on some parameters (FITs figure is a typical example).


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1.1 Laser Safety

The component shall conform to Class 1 laser requirements, in accordance with IEC and US regulatory
requirements as well as the Ericsson Specifications No. 105 63-2031 Uen and No. 105 63-2037 Uen.
1.2 Self-Ignition/Flammability
The component shall be fully compliant to the requirements of Ericsson Specifications No. 105 63-2031
Uen and No. 105 63-2037 Uen.
All included parts shall pass the IEC 60 695-2-2 [21] or UL-94 [22] at least V-0 and ISO 4589 [23] with
Oxygen index ≥ 28%. The dust plug is allowed an exemption to be UL-94 HB instead of V-0.
The Flammability Declaration of Conformity shall be issued and made available to Ericsson (see §4.2).
In this document the flame classification for all the used material shall be reported together with the
UL File Reference.
1.3 Handling
DANGER - The optical output is invisible laser radiation. Avoid direct exposure of eye to the light
beam.
The module is pluggable and shall not be used in any soldering process. It should be inserted after the
soldering process.
1.4 Material
The component shall be fully compliant to the requirements of Ericsson Specifications No. 105 63-2031
Uen and No. 105 63-2037 Uen.
A Material Declaration shall be issued and made available to Ericsson.
The component shall be RoHS compliant, including lead-free. A RoHS Declaration of Conformity shall be
issued and made available to Ericsson (see §4.2) according to European Directive 2011/65/EU [24] and
harmonised standard EN 50581:2012 [25].
1.5 Quality Requirements

The component shall meet the requirements stated in the Ericsson Specifications No. 105 63-2031 Uen
and No. 105 63-2037 Uen.


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1.6 Supplier Responsibility for Changes Notification

The Supplier is responsible for promptly notifying Ericsson of changes affecting the components listed
in this Product Specification. All changes to the transceiver (e.g., hardware part, firmware/software,
calibration process and memory map) shall be previously agreed and then submitted prior to any
implementation using the required Ericsson PCN (Product Change Notification) process.
1.7 Cleanness of Fibre Optic Connectors

To guarantee the cleanness of receptacle transceiver’s optical ports on delivery, the Supplier is required
to inspect and take pictures of the optical connectors just before packing the module to Ericsson. The
photographs shall be stored by the Supplier for at least two years and made available to Ericsson upon
request.


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2 Design
2.1 Mechanical Specifications

The module shall meet the requirements stated in SFF-8432 that defines the mechanical specifications
for the IPF (Improved Pluggable Form-factor).
The module shall be delivered with dust cover inserted into the optical receptacle.
2.1.1 Module Dimensions

The complete mechanical dimensions of the IPF transceiver module shall be according to SFF-8432.
Figure 1 is a schematic drawing (not drawn to scale) and it is shown for reference only.
10,00 47,50
2,10
14,00
8,55
1,40
13,55
TX optical out
RX optical in
Electrical interface (PCB), to mate into the board connector
Figure 1 – Drawing of Dual-Fibre Working transceiver (dimensions are in millimetres)



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2.1.2 Cooling Surface

The top of the module may be in direct contact with cooling devices such as heat sinks, for this reason
the SFP design should maximize heat transfer from internal components to the top surface. In order to
reduce contact thermal resistance, the top surface of the SFP+ shall be flat and clear (without recesses,
labels etc.), with contact surface area dimensions shown in Figure 2 and the following mechanical
characteristics.
 Surface flatness: 0.075 mm
 Surface roughness: Ra=6.3
Figure 2 – Module cooling surface



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2.1.3 IPF Module Durability and Card Edge Connector

The module electrical connector shall be able to withstand a minimum of 100 insertion cycles (exception
to the 50 insertions required by SFF-8432). To implement a pluggable transceiver solution using a 0.8
mm card edge connector the reference document is the SFF-8083 [20] Specification.
2.1.4 Bail Latch

The module shall be provided with a bail latch (as latching and release mechanism) that shall be such
that a module may be removed from a host board without the need for special tools. Insertion and
extraction forces for a nominal cage shall comply with SFF-8432.
The bail is explicitly required by Ericsson to stand without deformation or damages to an extraction
force up to 60N at horizontal orientation.
Latching device dimensions shall be included within the dimension “D” (14.00 mm maximum) as
reported in SFF-8432.
Release mechanism shall have a colour-coded moulded top (refer to Section 10) and it will preferably
include markings to identify input and output ports.


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2.2 Interfaces
The transceiver has both optical and electrical interfaces. The duplex receptacle is used to interface
between the module and a fibre plant whereas the electrical connector is used to interface between
the module and the host board.
2.2.1 Optical Interface
Item Description
Connector Type LC single-mode
Receptacle active device with LC duplex adapter
Plug Orientation latch uppermost (left-hand Tx, right-hand Rx)
The optical interface shall conform to applicable requirements stated in IEC 61754-20 [26], as standard
interface IEC 61754-20-6: Duplex Active Device Receptacle Interface. The interface shall fulfil the
requirements for simplex adaptor type SC for single-mode fibre as stated in IEC 60874-14-3 [27]. This
standard is used as reference for this product since there is no other relevant document written for
fibre optic adaptor - type LC.
The module shall fulfil the IEEE Std 802.3-2018 [1] requirements at the reference points TP2 (transmitter
side) and TP3 (receiver side), as shown in the figure below, if the optical interface is mated with a LC
connector that conforms to IEC 61754-20-1: Simplex Plug Connector Interface - PC or to IEC 61754-20-
4: Duplex Plug Connector Interface - PC. The optical transmit signal is defined at the output end of a
patch cord (TP2), between 2 and 5 meters in length, of a fibre type consistent with the link type
connected to the transmitter. The optical receive signal is defined at the output of the fibre optic cabling
(TP3) connected to the receiver.
Figure 3 – 25GBASE-R PMD block diagram



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2.2.2 Electrical Interface

The module is hot-pluggable. Hot pluggable refers to plugging in or unplugging a module while the host
board is powered.
2.2.2.1 Module Connector

The 20-contact electrical connector shall be compliant with the SFF-8419. The contacts are intended for
high and low speed signals, power and ground connections. The module signal ground contacts VeeR
and VeeT should be isolated from module case.
Figure 4 – Module contact assignment
2.2.2.2 Host Connector

The host connector is a 0.8 mm pitch 20 position improved connector specified by SFF-8083, or stacked
connector with equivalent electrical performance. Host PCB contact assignment is shown in Figure 5
and contact definitions are given in Table 2.
Figure 5 – Host PCB pad assignment



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Table 2 – Module pin function definition



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3 Specifications
3.1 Absolute Maximum Ratings

The transmitter optical output shall not exceed the Class 1 limit even when operating with the following
stress conditions applied individually or in combination.
Item Parameter Min Max Unit Condition

Power Supply Voltage Range -0.3 4.0 V w.r.t. VeeT,R
High Speed Input Voltage |single-ended -0.3 4.0 V w.r.t. VeeT
High Speed Input Voltage |differential 2.4 V peak-to-peak
Storage Case Temperature Range -40 85 °C -
Storage Relative Humidity 95 % -
Average Receive Power 5 dBm -
Table 3 - Absolute Maximum Ratings
NOTE – Optical and electrical stress beyond of any of these values may cause permanent damage to the
device. Exposure to conditions outside the product ratings for other than a short period of time may
affect device reliability.
3.2 Recommended Operating Conditions

Recommended Operating Conditions are those values for which functional performance and device
reliability is implied.
Item Parameter Min Max Unit Condition

Power Supply Voltage Range 3.135 3.465 V w.r.t. VeeT,R
Operating Case C-temp -5 70 (2)
°C see footnotes
Temperature Range I-temp -40 (1) 85 (3)
Operating Relative Humidity (4) 85 % non-condensing
1.0625 14.0625 bypass mode
Nominal Line Rate Range Gbit/s
24.33024 25.78125 CDR engaged
Table 4 - Operating Conditions
1. -40 °C as ambient temperature. In any case the module shall start-up correctly at -40 °C even if it
stays turned off at this temperature for a long time.
2. Even if performance above 70 °C are not guaranteed, it is required that the device will continue to
operate at least up to 80 °C. See §3.4.15.
3. Even if performance above 85 °C are not guaranteed, it is required that the device will continue to
operate at least up to 95 °C. See §3.4.15.


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4. The component shall meet humidity-related UNC-conditions in Telcordia GR-468-CORE [28] (e.g.,
Cyclic Moisture Resistance Test).
3.3 Characteristic Values

The transceiver is required to support and work properly with the line rates and the link length listed in
Table 1.
As already stated in Chapter 1, all the requirements for this component are specified in this Product
Specification that makes reference mainly to the IEEE Std 802.3-2018 [1]. The aim of this Product
Specification is to specify a component in conformity with the IEEE 25GBASE-LR PHY once released. In
case of difference between this Product Specification and the requirements stated in the applicable
standards, the former shall prevail.
Optical and electrical requirements reported in this Chapter shall be met:

 over the recommended operating conditions (refer to §3.2)
 with the Receiver Decision Threshold set to 50% (refer to §3.4.6)
 over the entire lifetime of the product (refer to §4.1)
 over all polarization states
 referring to the IEEE Std 802.3-2018 test-points when applicable (refer to Figure 3).


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3.3.1 Fibre Optic Link Characteristics
Item Parameter Condition Value Unit

Fiber Type - ITU-T G.65x (1) -
Operating Distance (2) - 10 km
up to 14G |BER = 1E-12
Available Power Budget 0 ÷ 7.3
up to 25G |BER = 5E-5 dB
Range (3), (4)
up to 25G |BER = 1E-12 0 ÷ 4.3(6)
Channel Insertion Loss 0 ÷ 6.3
up to 25G |BER = 5E-5 dB
Range (3), (5)
up to 25G |BER = 1E-12 0÷ 3.3(6)
Margin - 0 dB
Table 5 – Link Characteristics
1. ITU-T G.652, 653, 654, 655, 657 A1/A2 and the corresponding IEC/TIA SM fibre.
2. To be guaranteed over the specified fibre types.
3. The receiver shall operate with the required maximum BER when operating on a transmitter that
meets the performance specified in §3.3.2.
4. The available power budget has both a minimum and maximum value. The maximum power budget
is the difference between the minimum “OMA Launch Power” of the transmitter (see 3.3.2.8) and
the maximum “OMA Receive Sensitivity” required at receiver to operate with the specified
maximum BER (see 3.3.3.7 and 3.3.3.9). The minimum power budget - allocated to prevent receiver
overload - is the difference between the maximum “OMA Launch Power” of the transmitter (see
3.3.2.8) and the maximum OMA input power required at receiver to operate with the specified
maximum BER (see 3.3.3.5).
5. The loss budget is the amount of loss that a cable plant should have. It is calculated by adding the
average losses of all the components used in the cable plant to get the total estimated end-to-end
loss. In this Specification the loss budget is calculated by subtracting the maximum “OMA Receive
Sensitivity” (OMA_Rx) required at receiver to operate with the specified maximum BER (see 3.3.3.7
and 3.3.3.9), plus a possible margin (M), from the minimum “OMA Launch Power minus TDP”
(OMA_Tx-TDP, see 3.3.2.9). The formula is: (OMA_Tx-TDP) – OMA_Rx – M.
6. This budget is not enough to reach a distance of 10 km.


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3.3.2 Transmitter Optical Characteristics
Item Parameter Min. Max. Unit

3.3.2.1 Nominal Signaling Rate Range 1.0625 25.78125 Gbit/s
3.3.2.2 Signaling Rate Variation from Nominal -100 100 ppm
3.3.2.3 Center Wavelength Range 1295 1325 nm
3.3.2.4 Spectral Width |-20 dB 1 nm
3.3.2.5 Side Mode Suppression Ratio 30 dB
3.3.2.6 Average Launch Power Range -5.0 2.0 dBm
3.3.2.7 BOL -3.5
OMA Launch Power Range 2.2 dBm
3.3.2.8 EOL -4.0
3.3.2.9 OMA Launch Power minus TDP -5.0 dBm
3.3.2.10 up to 14G |BER = 1E-12
Transmitter and 3.0
3.3.2.11 up to 25G |BER = 5E-5 dB
Dispersion Penalty
3.3.2.12 up to 25G |BER = 1E-12 3.0
3.3.2.13 Average Launch Power |OFF Transmitter -30 dBm
3.3.2.14 BOL 3.5
Extinction Ratio dB
3.3.2.15 EOL 3.0
3.3.2.16 RIN20OMA -130 dB/Hz
3.3.2.17 Optical Return Loss Tolerance 12 dB
3.3.2.18 Transmitter Reflectance -27 dB
{0.31, 0.4, 0.45, 0.34, 0.38, 0.4}
Definition & Template
{X1, X2, X3, Y1, Y2, Y3}
3.3.2.19 Transmitter Eye Mask see [1]
Hit Ratio 5x10-5 -

Margin 5 %
Table 6 – Transmitter Optical Characteristics


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3.3.3 Receiver Optical Characteristics
Item Parameter Min. Max. Unit

3.3.3.1 Nominal Signaling Rate Range 1.0625 25.78125 Gbit/s
3.3.3.2 Signaling Rate Variation from Nominal -100 100 ppm
3.3.3.3 Wavelength Range 1260 1620 nm
3.3.3.4 Average Receive Power Range (1), (2) -12.5 2.0 dBm
3.3.3.5 OMA Receiver Overload 2.2 dBm
3.3.3.6 up to 14G |BER = 1E-12 BOL -12.3
OMA Receiver up to 25G |BER = 5E-5
3.3.3.7 EOL -11.3 dBm
Sensitivity (1), (3)
3.3.3.8 BOL -9.3
3.3.3.9 EOL -8.3
3.3.3.10 OMA SRS (4) | BER = 5E-5 -9.0 dBm
3.3.3.11 Receiver Reflectance -27 dB
3.3.3.12 Assert -30
dBm
3.3.3.13 Rx_LOS De-Assert -15
3.3.3.14 Hysteresis Range 0.5 5.0 dB
Table 7 – Receiver Optical Characteristics
1. With a transmitter that meets requirements specified in §3.3.2 and a test pattern PRBS31.
2. The receiver shall operate with a maximum BER of 5x10-5 when the optical input power falls within
the specified average received power range and when driven with a data-stream that fits the eye-
diagram mask specified in {3.3.2.19}. Average receive power (min) is informative.
3. The receiver shall operate with the maximum required BER when the optical input power is driven
with a data stream that fits the eye-diagram mask specified in {3.3.2.19}.
4. Conditions as per IEEE 802.3 and a test pattern PRBS31.


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3.3.3.1 Tx waveform @ 10G for Compatibility

Every SFP28 receiver shall be able to fully interoperate with any others SFP28 module transmitting
@10G even if some Lasers have overshoots, undershoots and ringing on the optical waveforms within
the limits defined in Table 8.
This means that the receiver performance shall meet the specifications defined in Table 7 while the
transmitter operating at 10 Gbit/s meets the following conditions:
 customized waveform as depicted in Figure 6

 Bitrate: 10.3125Gbps
 Pattern: PRBS31
 Without 4th-order Bessel-Thomson filter, 32 GHz sampling bandwidth
Item Parameter Min. Max.

3.3.3.1.1 Overshoot - OMA*160%
3.3.3.1.2 Crosspoint OMA*48% OMA*60%
3.3.3.1.3 Upper Ring back OMA*60% -
3.3.3.1.4 Lower Ring back - OMA*30%
Table 8 – Tx optical eye characteristics
Figure 6 – Tx waveform definition



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3.3.4 Latency
The component shall meet the requirements listed in the table below:
Item Parameter Value Unit

3.3.4.1 Rx Latency <5 ns
3.3.4.2 Tx Latency <5 ns
Table 9 – Latency
3.3.5 Jitter Characteristics

The module shall meet jitter requirements as specified in IEEE Std 802.3-2018 [1], Fibre Channel
Specifications and CPRI Specification.
3.3.6 Electrical Characteristics

3.3.6.1 steady-state (2) see footnote < 432
3.3.6.2 Power Supply Current (1) sustained (4) all conditions < 500 mA
3.3.6.3 instantaneous duration < 50 µs < 600
3.3.6.4 Module Power Consumption all conditions < 1.5 W
3.3.6.5 High Speed Input Swing |differential peak-to-peak as per IEEE 802.3 mV
3.3.6.6 High Speed Output Swing |differential peak-to-peak as per IEEE 802.3 mV
3.3.6.7 High Speed Output Voltage (max) |differential peak-to-peak ≤ 900 mV
3.3.6.8 Receiver Electrical Upper Cutoff |-3dB as per IEEE 802.3 ≤ 31 GHz
3.3.6.9 TRise
Receiver Data Output (3) as per IEEE 802.3 ≥ 12 ps
3.3.6.10 TFall
3.3.6.11 Transmitter Data Input (5) TRise
as per IEEE 802.3 ≥ 10 ps
3.3.6.12 (all rates) TFall
Table 10 – Electrical Characteristics
1. Apply to the current through inductors of the host board supply filter network as per SFF 8419.
2. Limit value is calculated considering a power supply voltage of 3.47 V. It is informative; module
power consumption is the key parameter.
3. 20%-80% response time.
4. The maximum current is the sum of currents for each power supply rail (VccT and VccR). In any case,
the transceiver shall complete the start-up process within the required time.
5. Required also @ 10G and lower rates (this is an exception to IEEE 802.3 and SFF-8418, Table 16)


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3.3.7 Electromagnetic Compatibility and Immunity

The module shall be compliant with the requirements listed in the table below when installed in the
host equipment.

8 (CD)
3.3.7.1 ESD Immunity as per IEC 61000-4-2 (1), (3) kV
15 (AD)
as per IEC 61000-4-3
10 V/m
[80  6000 MHz] (2), (3)
3.3.7.2 EMC Immunity
as per Telcordia GR-1089-CORE
8.5 V/m
[1  10 GHz] Pulse Modulated (4)
SFP/SFP+ and High-
1
Speed Contacts
ESD (HBM as per JEDEC
3.3.7.3 kV
model) JESD22-A114-B SFP/SFP+ and all Host
Contacts (no High- 2
Speed Contacts)
according to FCC Part 15, §§15.109 and 30 MHz-5th harmonic of the
15.33 - Test Standard FCC Part 15, highest generated fundamental
§15.109 (3) frequency, FCC Class B -6dB
according to FCC Part 22, §22.917 - Test 30 MHz-10th harmonic of the
Standard FCC Part 22, §22.917 highest generated fundamental
Measurement method ANSI 63.4 (3) frequency, -13 dBm ERP
3.3.7.4 EMI Emission
30 MHz  6 GHz
according to EN 55032 [29]
EN55032 Class B -6dB
Table 11 – EMI, EMC and ESD requirements.
1. Criterion A, normal performance, no bit errors. CD = Contact Discharge, AD = Air Discharge.

2. Criterion A, normal performance, no bit errors.
3. Measurements shall be done as open box. Bare-board with the transceiver cage only.
4. The transceiver is mounted as recommended in SFF-8432, which gives requirements for example
host board layout, bezel design and cage.


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3.4 Functional Description
3.4.1 Options and other Requirements

Hereafter are listed functionalities and options as well as extended module Control & Status functions
that shall be implemented in the SFP28 transceiver, as stated in SFF-8472.
Some functionalities/options implemented shall be specified in the EEPROM Map, Address A0 h - Bytes
64, 65, 92 and 93 (refer to §3.5.1).
 Data ready monitoring - Data_Ready_Bar (Address A2h – Byte 110 – bit 0)
 Receive Loss of Signal (Rx_LOS) as per SFP MSA
 Soft Rx_LOS – Loss of Signal monitoring (Address A2h – Byte 110 – bit 1)
 Tx_DISABLE
 Soft Tx_DISABLE control (Address A2h – Byte 110 – bit 6)
 Tx_DISABLE monitoring (Address A2h – Byte 110 – bit 7)
 Tx_FAULT signal
 Soft Tx_FAULT monitoring (Address A2h – Byte 110 – bit 2)
 Tx Equalization/Rx Emphasis control (Address A2h – Bytes 114 and 115), see also §3.4.5
 Receiver Decision Threshold (refer to §3.4.6)
 Paging (refer to §3.4.7)
 Conventional Limiting Receiver Output (Address A0h – Byte 64 – bit 0)
 Power Level 2 Declaration (Address A0h – Byte 64 – bit 1)
 Power Level Select control and monitoring (Address A2h – Byte 118 – bits 0 and 1), refer
to §3.4.8
 Uncooled laser (Address A0h – Byte 64 – bit 2)
 Tx and Rx CDRs integrated (Address A0h – Byte 64 – bit 3)
 Tx and Rx CDRs status monitoring (Address A2h – Byte 119 – bits 0 and 1)
 Digital Diagnostic Monitoring (DDM) - (Address A0h – Byte 92 – bit 6)
 Internal Calibration (Address A0h – Byte 92 – bit 5)
 Received Power Measurement as Average Power (Address A0h – Byte 92 – bit 3)
 Timing Requirements (refer to §3.4.16)
 Alarm/Warning Flags for all monitored quantities (refer to §3.6.3)
The following are Ericsson specific requirements, instead:

 Tx_FAULT Behavior (refer to §3.4.9)
 Control of CDRs (refer to §3.4.10)
 Transceiver Power Cycling (refer to §3.4.11)
 Squelching - not to implement (refer to §3.4.12)
 Service Disruption (refer to §3.4.13)
 Loopback (refer to §3.4.14)
 Protection Mechanism (refer to §3.4.15)


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3.4.2 Receiver Loss of Signal (Rx_LOS)

The Rx_LOS alarm and low speed contact shall indicate:
 loss of receive power when the Rx CDR is in bypass mode

 unlocking of the Rx CDR when the CDR is enabled.
The loss of receive power is based on the monitoring of the amplitude of the incoming optical signal
detected by a proper loss-of-signal circuitry. The signal amplitude, used to detect the LOS, is required
to be proportional to the receiver peak-to-peak optical power (defined as “AC_LOS”).
With the Rx CDR in bypass mode, assertion of Rx_LOS alarm shall indicate:
 amplitude of incoming serial optical signal is less than the LOS preset threshold
 unmodulated incoming optical signal
 disconnected or broken fibre, or a transmitter at the far end that is disabled, broken, or
powered off.
Alarm shall be cleared when the level of the modulated incoming signal exceeds the LOS preset
threshold (plus a hysteresis to control chatter at the LOS output). Refer to 3.3.3.12 - 3.3.3.14 for the
Rx_LOS upper/lower bounds and the hysteresis range allowed.
NOTE – In case of no incoming optical power at the input (e.g., optical plug disconnected, broken fibre,
etc.) the noise level at the receiver shall never clear the Rx_LOS alarm.
With the Rx CDR enabled, assertion of Rx_LOS alarm is based upon the status of CDR and it is related to
an excessive jitter or noise at the data input, incorrect frequency, or loss of input data.
3.4.3 Soft Tx_DISABLE

The module shall support Soft Tx_DISABLE control (Address A2h – Byte 110 – bit 6). If the feature is not
implemented the transmitter output power level shall not be affected whatever is the state of control
bit.
When the transmitter is disabled, by means of Tx Disable pin or by Soft Tx_DISABLE control, related
A/W flags shall be asserted (see note (1)).
3.4.4 Tx_DISABLE State

As per SFF-8472, the Tx_DISABLE State (Address A2h – Byte 110 – bit 7) must monitor only the status of
the Tx_DISABLE input pin and shall not be affected by the Soft Tx_DISABLE bit (Address A2h – Byte 110
– bit 6).


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3.4.5 Equalization/Emphasis Control

To improve link performance equalization and emphasis adjustment shall be allowed for the high-speed
module data input/output. Tx input equalization control shall be accessed through 2-wire serial
interface at Address A2h - Byte 114. Rx output emphasis control shall be accessed through 2-wire serial
interface at Address A2h - Byte 115.
By default, the component shall be set with:
Item Parameter Setting Value Unit

Tx input equalization
3.4.5.1 0 dB
control RATE=HIGH
Byte 114 = 0x00
Tx input equalization
3.4.5.2 0 dB
control RATE=LOW
RX output emphasis
3.4.5.3 0 dB
control RATE=HIGH
Byte 115 = 0x00
RX output emphasis
3.4.5.4 0 dB
control RATE=LOW
Note: SFF-8472 defines bits 114.7-4 and 115.7-4 for RATE = HIGH, and bits 114.3-0 and 115.3-0 for
RATE = LOW. It’s explicitly required here to only use the “HIGH” ones (bits 114.7-4 and 115.7-4),
considering the “LOW” ones (bits 114.3-0 and 115.3-0) as ineffective. This means that they (the LOW)
can in case be not-writable, and/or any actions on them shall have no effects.
3.4.6 Variable Receiver Decision Threshold Control

Byte 131 of page 02h is used to control the variable receiver decision threshold function. The availability
of this function is indicated in Address A0h – Byte 65 – bit 7 in the serial ID section. Byte 131 is a 2’s
complement 7-bit value. The decision threshold is given by:
<Decision Threshold = 50% + [value of Byte 131]/256*100%>
The value of Byte 131 shall be ‘0’ as the default on start-up. This corresponds to a Decision Threshold
of 50%.


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3.4.7 Page Selection

In order to provide memory space for CDR control functions and for other potential extensions, multiple
pages shall be available for the upper half of the A2h address space.
The value of A2h - Byte 127 shall be 00h as the default on start-up, which points to the 120-bytes User
Writable EEPROM.
User Writable pages 00h and 01h are expected to be the same or mirrored. Mirrored means that any
changes to any part of one of them must automatically be reflected to the other.
Pages 02h, 03h and 80h shall be available as independent pages (i.e., no mirroring). When a page value
is written to Byte 127, subsequent reads and writes to Bytes 128-255 shall be made to the relevant
page. Writing the value of a non-supported Page shall not be accepted by the transceiver. The Page
Select byte shall revert to 0 and read/write operations shall be to the unpaged A2h memory map (i.e.
Page 00h/01h). To avoid any confusions, see the following table:
Displayed value
Input value Displayed values
in A2h byte127
in A2h byte127 in A2h Upper 128 bytes Note
(Page Select)
(Page Select) (A2h bytes128 to 255)
after input
Mirrored with A2h page 01h
Upper Page 00h/01h Read without password and
00h 00h
bytes 128 to 255 Write with write-protect
password (non-volatile)
Mirrored with A2h page 00h
Upper Page 00h/01h Read without password and
01h 01h
bytes 128 to 255 Write with write-protect
password (non-volatile)
Upper Page 02h Independent page
02h 02h bytes 128 to 255 Read and Write
(control functions) without any password
Upper Page 03h Independent page
03h 03h
bytes 128 to 255 Read only
04h to 7Fh Upper Page 00h/01h
00h Not implemented
(SFF-8472 reserved) bytes 128 to 255
Independent page
Upper Page 80h
Read and Write
80h 80h bytes 128 to 255
without any password
(User Writable EEPROM)
(non-volatile)
81h to FFh Upper Page 00h/01h
00h Not implemented
(vendor specific) bytes 128 to 255
The memory map at factory shipment shall comply with the json file requirements (see §3.5.5).


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3.4.8 Power Level Selection

The transceiver specified in this Product Specification is required to be maximum Power Level 2 optical
module.
On start-up the module shall operate at Power Level 2 (i.e., A2h - bit 118.0 shall be set to ‘1’ by default).
The host shall be allowed to enable Power Level 1 at any time.
It is required the transmitter is powered off when the module is put in Power Level 1 while the MCU,
I/O stages and I2C interface shall be powered and available.
Important: entering in / exiting from Power Level 1 shall have no effects on other settings such as CDR
state, Equalization or Amplitude values, etc. In other words, such operations are not (and mustn’t be
confused with) SW reset.
3.4.9 Tx_FAULT Behavior

Tx_FAULT signal shall comply with SFF-8419 and with SFF-8472, in addition it shall behave as below.
At start-up Tx_FAULT pin and bit (A2h - byte 110, bit 2) shall be high until, and both de-asserted when,
the module is ready to be fully operational (i.e. ready to switch on the laser and operate according to
all specifications) independently from Tx_DISABLE status; which means that during this initial period
the laser is off despite in case Tx_DISABLE low. As soon as Tx_FAULT is de-asserted, the laser status is
controlled as usual by Tx_DISABLE (see Table 12).
Laser not ready to switch-on Laser ready to switch-on
Laser Off/Pin high Laser Off/Pin low

Tx_DISABLE High
bit 110.2 = 1 bit 110.2 = 0
Laser Off/Pin high Laser On/Pin low
Tx_DISABLE Low
bit 110.2 = 1 bit 110.2 = 0
Table 12 – Laser status and Tx_FAULT during Start-Up
During normal operations the detection of a module fault condition presented by Tx_FAULT - related to
the transceiver operating state – will switch off the laser. The module shall recover from the fault
condition without external actions, as soon as the fault cause has ceased, unless an optical safety
related issue is still present (see Table 13). Recovering from the fault condition means restarting the
laser and de-asserting the pin. The Tx_FAULT alarm bit (A2h - byte 110, bit 2) instead shall be latched
until the reading of its value.


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In any case, it shall be possible to recover the module from the fault condition and clear Tx_FAULT pin
and bit by toggling the Tx_DISABLE (via Hardware or Software) and following the module fault recovery
protocol as described in SFF-8419.
Fault Condition
Fault Condition On No fault condition
Recovered
Laser Off/ Pin high Laser On/ Pin low Laser On/ Pin low
bit 110.2 = 1 bit 110.2 = 1 (latched) bit 110.2 = 0
Table 13 – Laser status and Tx_FAULT during normal operations (Tx_DISABLE Low)
Asserting the Tx_DISABLE pin and/or bit after device ready shall switch off the laser but shall never
cause the Tx_FAULT (no Tx_FAULT condition/alarm in this case. See Table 14).
No fault condition
Laser Off/ Pin low
Tx_DISABLE High
bit 110.2 = 0
Laser On/ Pin low
Tx_DISABLE Low
bit 110.2 = 0
Table 14 – Tx_DISABLE effects



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3.4.10 Control of CDRs

The host shall be capable to enable (to support the higher data rates) or to bypass (to run at the lower
data rates or to save the thermal power) the CDRs in the module through the I2C interface and the rate
select pins.
The CDRs are controlled following the logical disjunction (OR) of the hardware Rate Select (RS0 – pin #7
and RS1 – pin #9) pins and the corresponding software bits (Soft RS(0) – Address A2h - bit 110.3 and Soft
RS(1) – Address A2h - bit 118.3), according to the logic Table 15
By default, RS(0) and RS(1) bits shall be set to ‘1’.
Pin status Bit status Mode of Operation

0 0 Rx CDR bypassed
0 1
RS0
1 0 Rx CDR engaged
1 1
0 0 Tx CDR bypassed
0 1
RS1
1 0 Tx CDR engaged
1 1
Table 15 – CDRs control logic table
3.4.10.1 Software-only Implementation

To neglect the hardware status (i.e., not considering the state of RS0 and RS1 pins) for ensuring the
correct behaviour of the SFP28 CDRs selecting mode the logic OR of the RSx pins and RS(x) bits shall be
allowed or not thorough the 2-wire serial interface. Writing logic ‘1’ to A2h - bit 118.7 disables OR on
pins and bits and therefore the control of CDRs mode is only by means of RS(x) bits (i.e., bit 110.3 and
bit 118.3). By default, A2h - bit 118.7 shall be ‘0’ (OR operation enabled).
NOTE – This is an Ericsson customization, not a rule in the SFF standards, and is implemented in all
SFP28 in (and only in) the Ericsson portfolio.


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3.4.11 Transceiver Power Cycling

The transceiver shall be completely off and its digital circuitry shall be able to subsequently correctly
restart if the power supply goes ≤ 0.8 V for a period ≥ 300 ms.
3.4.12 Squelching Functionality
3.4.12.1 Tx Squelch
At the transmitter side, when an electrical input data signal is absent or not sufficiently strong, the
transceiver shall maintain switched on the laser and the average output optical power shall remain the
same even if the optical signal is unmodulated. This means that output squelch for loss of electrical
input signal has not to be implemented.
3.4.12.2 Rx Squelch
At the receiver side, in the event of the optical signal on the channel becoming equal to or less than the
level required to assert Rx_LOS, then the receiver data output shall not be squelched or disabled. This
means that output squelch for loss of optical input signal has not to be implemented.
3.4.13 Service Disruption

The module is used in Ericsson’s products within protected networks with a maximum switching time
of 50 ms. In order to meet this requirement, the transceiver module shall be able to recover a traffic
disruption within a maximum window (t_SD):
t_SD  5 ms.
A specific test to evaluate the CDRs lock time shall be performed in order to measure the Service
Disruption time. This recovery time may be measured with the optical transmitter and receiver looped
back and generating a traffic disruption with a variable duration (T int): 0.1, 1, 10 and 20 ms. The
maximum recovery time shall be lower than Tint + t_SD.


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3.4.14 Loopback Functionality

The module shall support two different internal loopback modes which may be useful for diagnostics
needs:
 optical side retimed loopback
 electrical side retimed loopback.
The first mode is an optical-to-optical loopback. In this mode, which is enabled by a control bit as
described in the table below, data from the optical receiver shall be retimed and outputted on the
optical transmitter. The control bit shall be reset to 0 at power up resulting in normal operation (default
condition).
The second of these modes is an electrical loopback. In this mode, which is enabled by a control bit as
described in the table below, data input on the 25GAUI Tx pins shall be retimed and outputted on the
Rx pins. The control bit shall be reset to 0 at power up resulting in normal operation (default condition).
The optical output shall be still driven when either loopback mode is enabled.
A2h – Byte 111 – A2h – Byte 111 –

Mode of Operation
bit 0 bit 2
0 0 normal operation
CDRs 1 0 electrical loopback
engaged 0 1 optical loopback
1 1 both optical and electrical loopback (1)
0 0 normal operation
CDRs 1 0 non-retimed electrical loopback
bypassed 0 1 non-retimed optical loopback
1 1 both optical and electrical loopback (1)
Table 16 – Loopback control logic table
1. Optional implementation. If not supported the SFP28 shall work in normal operation and the
deviation granted by Ericsson.


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3.4.15 Protection Mechanism

Operating temperature range is defined up to 70 °C for C-Temp and 85 °C for I-Temp. At higher
temperatures performance are not guaranteed, but the module is not expected to shut-off, but in case
to have limited bias current.
This is mandatory for temperatures up to max operating range plus 10 °C. This means that the only
protection mechanism high temperature related possible to activate below 80 °C (C-Temp) or 95 °C (I-
Temp) is current limiting (anyhow the High Temp Warning and Alarm are expected to raise respectively
at 73 °C and 78 °C for C-Temp, and at 88 °C and 93 °C for I-Temp).
At temperatures higher than max operating range plus 10 °C (i.e. higher than 80 °C for C-Temp, and
higher than 95 °C for I-Temp), the device can be switched-off only in presence of optical safety related
issues.


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3.4.16 Timing Specifications

In the following Subsections are reported the timing requirements as per SFF-8419 and SFF-8472.
3.4.16.1 Timing Requirements of Control & Status I/O
Item Parameter Symbol Value Condition
Tx_DISABLE ≤ 100 Rising edge of Tx_DISABLE to fall of
3.4.16.1.1 t_off
Assert Time µs output signal below 10% of nominal
Falling edge of Tx_DISABLE to rise of
Tx_DISABLE output signal above 90% of nominal. This
3.4.16.1.2 t_on ≤ 2 ms
Negate Time only applies in normal operation, not
during start up or fault recovery
Time to Initialize ≤ 300
3.4.16.1.3 t_2w_start_up From power on or hot plug
2-wire interface ms
From power on or hot plug or Tx disable
negated during power up, or Tx_FAULT
≤ 300 recovery, until non-cooled power level I
3.4.16.1.4 Time to Initialize t_start_up
ms part (or non-cooled power level II part
already enabled at power level II for
Tx_FAULT recovery) is fully operational
From stop bit low-to-high SDA transition
Time to Power ≤ 300
3.4.16.1.5 t_power_level2 enabling power level II until non-cooled
Up from Level II ms
module is fully operational
Time to Power From stop bit low-to-high SDA transition
≤ 300
3.4.16.1.6 Down from t_power_down disabling power level II until module is
ms
Level II within power level I requirements
From occurrence of fault to assertion of
3.4.16.1.7 Tx_FAULT Assert Tx_fault_on ≤ 1 ms
Tx_FAULT
Time Tx_DISABLE shall be held high to
3.4.16.1.8 Tx_FAULT Reset t_reset ≥ 10 µs
reset Tx_FAULT
RS0, RS1 rate
3.4.16.1.9 select timing for t_RS0, t_RS1 ≤ 24 ms From assertion till stable output
non FC
Rx_LOS Assert ≤ 100 From occurrence of loss of signal to
3.4.16.1.10 t_los_on
Time µs assertion of Rx_LOS
Rx_LOS Negate ≤ 100 From occurrence of presence of signal to
3.4.16.1.11 t_los_off
Time µs negation of Rx_LOS
Table 17 – Timing Requirements


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3.4.16.2 Timing Requirements of Software Control & Status I/O
Item Parameter Symbol Value Condition

Time from Tx_DISABLE bit set until
3.4.16.2.1 Tx_DISABLE Assert Time t_off ≤ 100 ms optical output falls below 10% of
nominal
Time from Tx_DISABLE bit cleared
Tx_DISABLE De-Assert
3.4.16.2.2 t_on ≤ 100 ms until optical output rises above 90%
Time
of nominal
Time to initialize, Time from power on or negation of
3.4.16.2.3 including reset of t_init ≤ 300 ms Tx_FAULT using Tx_DISABLE until
Tx_FAULT transmitter output is stable
3.4.16.2.4 Tx_FAULT Assert Time t_fault ≤ 100 ms Time from fault to Tx_FAULT bit set
Time from LOS state to Rx_LOS bit
3.4.16.2.5 Rx_LOS Assert Time t_loss_on ≤ 100 ms
set
Time from non-LOS state to Rx_LOS
3.4.16.2.6 Rx_LOS De-Assert Time t_loss_off ≤ 100 ms
bit cleared
Time from change of Rate Select bit
Rate Select Change until receiver bandwidth is in
3.4.16.2.7 t_rate_select ≤ 100 ms
Time conformance with appropriate
specification
This is an exception to SFF-8472.
Module shall operate with
f_serial_clock up to 100 kHz without
Two-wire serial ≤ 400
3.4.16.2.8 f_serial_clock requiring clock stretching. The
interface Clock rate kHz
module may clock stretch with
f_serial_clock greater than 100 kHz
and up to 400 kHz
Two-wire serial
≤ 1000 From power on to data ready, bit 0
3.4.16.2.9 interface Diagnostic t_data
ms of Byte 110 set
data ready Time
Two-wire serial Time from power on until module is
3.4.16.2.10 interface Bus hardware t_serial ≤ 300 ms ready for data transmission over
ready Time the two wire serial bus
Time from High Power Level enable
High Power Level Assert bit set until module operation is
3.4.16.2.11 t_hpower_level ≤ 300 ms
Time stable. See Table 10-1 of SFF-8472
for control bit
Table 18 – Soft I/O Timing Requirement


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3.5 Digital Diagnostic Memory Map

The device shall be provided with a management interface (2-wire serial interface) between host board
controlling device and the optical module itself.
The communication protocol and the common memory map supported by the device are described in
the SFF-8472 Specification. The structure of the memory map is shown below.
It is required (unless otherwise specified) that all bits that are unallocated or reserved for SFF-8472 shall
be set to zero as well as if optional features for SFF-8472 are not implemented, state bits shall be set to
zero.
Device properties, features, supported functionalities and implemented options are defined in Address
A0h – Bytes 0 to 127. Any granted deviations - in the module properties - from the original specifications
shall be reported in the relevant device memory map fields.
See §3.4.7 for Paging details.
Figure 7 – 2-wire Interface Fields



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3.5.1 Address A0h - Serial ID defined by SFP MSA
Address A0h Assigned Value

Name of Field Meaning/Description
[Dec] [Hex] [Bin]
SFP28
0 Identifier 03 00000011
<Type of transceiver>
2-wire interface
1 Extended Identifier 04 00000100 <Extended identifier of type
of transceiver>
LC
2 Connector 07 00000111
<Code for connector type>
3 00 00000000
4 00 00000000
5 00 00000000
6 00 00000000 See Byte #36
Transceiver <Code for electronic or
7 00 00000000 optical compatibility>
8 00 00000000
9 00 00000000
10 00 00000000
64B/66B
11 Encoding 06 00000110 <Code for high speed serial
encoding algorithm>
Rate > 25.0 Gbit/s (see Byte
#66)
12 BR, nominal FF 11111111
<Nominal bit rate, units of
100 MBits/sec>
Unspecified
13 Rate Identifier 00 00000000 <Type of rate select
functionality>
10 km
<Link length supported for
14 Length (SMF, km) 0A 00001010
Single Mode Fiber,
units of km>
10 km
15 Length (SMF) 64 01100100
Single Mode Fiber,
units of 100 m>


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[Dec] [Hex] [Bin]
No MMF supported
16 Length (50 µm) 00 00000000
50 um OM2 fibre,
units of 10 m>
No MMF supported
17 Length (62.5 µm) 00 00000000
62.5 um OM1 fibre,
units of 10 m>
No MMF supported
18 Length (OM4 or copper cable) 00 00000000
50um OM4 fibre,
units of 10m>
No MMF supported
19 Length (OM3) 00 00000000
50 um OM3 fibre,
units of 10 m>
20 45 01000101 E
21 52 01010010 R
22 49 01001001 I
23 43 01000011 C
24 53 01010011 S
25 53 01010011 S
26 4F 01001111 O
27 4E 01001110 N
Vendor Name
28 20 00100000 Space
29 20 00100000 Space
30 20 00100000 Space
31 20 00100000 Space
32 20 00100000 Space
33 20 00100000 Space
34 20 00100000 Space
35 20 00100000 Space
25GBASE-LR
(as per SFF-8024)
36 Transceiver 03 00000011
<Code for electronic or
optical compatibility>


1301-RDH 102 75/3 Uen E 2020-02-23

[Dec] [Hex] [Bin]
37 na na Vendor dependent
38 Vendor OUI (0) na na <SFP vendor IEEE company
39 na na ID>
40 na na
41 na na
42 na na
43 na na
44 na na
45 na na
46 na na
Vendor PN (2) <Part number provided by
48 na na transceiver vendor (ASCII)>
49 na na
50 na na
51 na na
52 na na
53 na na
54 na na
55 na na
57 na na <Revision level for part
Vendor Rev. (3)
58 na na number provided by vendor
59 na na (ASCII)>
60 05 00000101 1310 nm
Wavelength
61 1E 00011110 <Laser wavelength>
62 Unallocated 00 00000000 -
Vendor dependent
63 CC_BASE na na <Check code for Base ID
Fields (addresses 0 to 62)>
Options Unallocated 64.7 0 -
Refer to Unallocated 64.6 0 -
64 §3.4.1 High Power Level 1A Standard Power Level 2
<Indicates 64.5 0
Declaration as indicated by bit 1
which Paging indicator 64.4 1 Paging implemented


1301-RDH 102 75/3 Uen E 2020-02-23

[Dec] [Hex] [Bin]
optional CDR indicator 64.3 1 Internal CDR present
transceiver Cooled Module Uncooled laser
signals are 64.2 0
Declaration implementation
implemented
Power Level
> 64.1 1 Power Level 2
Declaration
Linear Receiver Not implemented (limiting
64.0 0
Output implemented)
Receiver
Receiver decision threshold
decision 65.7 1
implemented
threshold
Tunable
65.6 0 Not tunable
transmitter
RATE_SELECT
65.5 1 Implemented
functionality
65 TX_DISABLE BA 65.4 1 Implemented
TX_FAULT signal 65.3 1 Implemented
Inverted LOS
65.2 0 Not implemented
(Signal Detect)
Standard LOS
65.1 1 Implemented
(Rx_LOS)
Unallocated 65.0 0 -
25.78125 Gbit/s
66 BR, max 67 01100111 <Nominal bit rate, units of
250 MBits/sec>
67 BR, min 00 00000000 Not specified
68 na na
69 na na
70 na na
71 na na
73 Vendor SN na na <Serial number provided by
74 na na vendor (ASCII)>
75 na na
76 na na
77 na na
78 na na


1301-RDH 102 75/3 Uen E 2020-02-23

[Dec] [Hex] [Bin]
79 na na
80 na na
81 na na
82 na na
83 na na
84 Y na na
85 Y na na
86 M na na
87 M na na Vendor dependent
Date Code <Vendor’s manufacturing
88 D na na date code>
89 D na na
90 Lot na na
91 Lot na na
Reserved for legacy 92.7 0 Not used
DDM implementation 92.6 1 Implemented
Internal Calibration 92.5 1 Implemented
Diagnostic External Calibration 92.4 0 Not implemented
92 Monitoring 68
Type
Rx power meas. type 92.3 1 Average Rx Power monitored
Address change req. 92.2 0 Not requested
Optional
Alarm/warning 93.7 1 Implemented
flags
Enhanced Optional soft
Options 93.6 1 Implemented
TX_DISABLE
<Indicates Optional soft
which 93.5 1 Implemented
TX_FAULT
93 optional F8
enhanced Optional soft
93.4 1 Implemented
features are RX_LOS
implemented Optional soft 93.3 1 Implemented
> RATE_SELECT
Optional
Application 93.2 0 Not implemented
Select


1301-RDH 102 75/3 Uen E 2020-02-23

[Dec] [Hex] [Bin]
Optional soft
93.1 0 Not implemented
Rate Select
08h=Includes functionality
described in Rev. 12.3 of
SFF-8472
94 SFF-8472 Compliance 08 00001000
<Indicates which revision of
SFF-8472 the transceiver
complies with>
Vendor dependent
95 CC_EXT na na <Check code for the
Extended ID Fields>
Table 19 – Address A0h - Serial ID defined by SFP MSA
1. OUI shall be specified, 00h is not acceptable. Note that despite Vendor Name (Address A0h - Bytes
20 to 35) is reported as “Ericsson”; Vendor OUI, Vendor PN, and Vendor Revision are instead kept
as per the Manufacturer data.
2. In order to fit memory locations, the Module Part Number shall be maximum 16-character in length.
The same vendor PN shall be used onto the component/box labels and in the relevant product
documents, no exception is allowed.
3. Vendor Revision Number, in the format xx.yy, contains ASCII characters defining the Vendor’s
product revision. Note that the revision number shall manage all hardware, firmware/software,
calibration process and memory map changes. In addition, Ericsson requires that Vendor Revision
Number keeps track of the possible variant of the same PN (e.g., combination of various TOSA/ROSA
Manufacturers); if more variants are available each of them shall have its own revision number to
be reported in the Gap Analysis.


1301-RDH 102 75/3 Uen E 2020-02-23
3.5.2 Address A0h - Vendor Specific

In order to qualify, integrate and uniquely identify SFP/SFP+/SFP28 transceivers in Ericsson’s product
portfolio a customisation of the 32 bytes in the Vendor Specific area (Address A0 h - Bytes 96 to 127) is
required as per the Ericsson Specification 1056-FCP 121 0786/1 [30].
This customisation shall be write-protected (reading shall be allowed without password). Moreover,
such customisation shall be made exclusively for Ericsson and may be extended to third parties only
after specific written authorisation by Ericsson itself.

Name of Field Description
[Dec] [Hex] [Bin]
Corresponding to "M"
96 4D 01001101
letter in ASCII code
Corresponding to "O"
97 4F 01001111
Ericsson Logo
Corresponding to "N"
98 4E 01001110
Corresponding to "I" letter
99 49 01001001
in ASCII code
100.7 0
Laser Classification Class 1 laser
100.6 0
100.5 0
Transmitter Type Optical (SLM laser)
100.4 1
I-temp 18
Temperature Range 100.3 1 Extended/Industrial
100.2 0 Grey Optics (Single
Application Types
100.1 0 Channel)
SFP Housing Connector 100.0 0 Dual Fiber Working
100
Id. 100.7 0
Laser Classification Class 1 laser
100.6 0
100.5 0
Transmitter Type Optical (SLM laser)
C- 100.4 1
10
temp Temperature Range 100.3 0 Commercial
100.2 0 Grey Optics (Single
Application Types
100.1 0 Channel)
Housing Connector 100.0 0 Dual Fiber Working
SDH/SONET 101.7 0
101 For Future Use 00 Set to 00 as default
and OTN Id. 101.6 0


1301-RDH 102 75/3 Uen E 2020-02-23

[Dec] [Hex] [Bin]
(Compliant OTU2 101.5 0 Not supported
to Data and STM-64/OC192 101.4 0 Not supported
Interface
OTU1 Supported 101.3 0 Not supported
Standards)
STM-16/OC-48 101.2 0 Not supported
102 SDH/SONET and OTN App. Code 00 00000000 Reserved
103 SDH/SONET and OTN Environment 00 00000000 Not Used
1 GbE 104.7 0 Not supported
FC 1 Gb/s 104.6 0 Not supported
Data Id. FICON 104.5 0 Not supported
(Compliant DVB 104.4 0 Not supported
104 to Data and 00
Interface ESCON 104.3 0 Not supported
Standards) FE 100 Mb/s 104.2 0 Not supported
FDDI 104.1 0 Not supported
FE 10 Mb/s 104.0 0 Not supported
For Future Use 105.7 0 Set to 0 as default
10 GbE 105.6 0 Not supported
Data Id. FC 10 Gb/s 105.5 0 Not supported
(Compliant FC 8 Gb/s 105.4 0 Not supported
105 to Data and 00
Interface FEC FC 5 Gb/s 105.3 0 Not supported
Standards) FC 4 Gb/s 105.2 0 Not supported
InfiniBand 105.1 0 Not supported
FC 2 Gb/s 105.0 0 Not supported
106 Single Data App. Code FE 11111110 Reference to Byte 107
107 Multiple Data App. Code 6F 01101111 25GBASE-LR
108.7 0
For Future Use Set to 00 as default
Further 108.6 0
Rates OTU2 108.5 1 Supported
Supported STM-64/OC192 108.4 1 Supported
108 (Not 3C
Standard OTU1 Supported 108.3 1 Supported
Compliance STM-16/OC-48 108.2 1 Supported
guaranteed) STM-4/OC-12 108.1 0 Not supported


1301-RDH 102 75/3 Uen E 2020-02-23

[Dec] [Hex] [Bin]
1 GbE Supported (bit
109.7 1 Supported
#7)
FC 1 Gb/s 109.6 1 Supported
FICON 109.5 0 Not supported
109 DVB C0 109.4 0 Not supported
ESCON 109.3 0 Not supported
FDDI 109.1 0 Not supported
For Future Use 110.7 0 Set to 0 as default
10 GbE 110.6 1 Supported
110 75
FEC FC 5 Gb/s 110.3 0 Not supported
InfiniBand 110.1 0 Not supported
111.7 0
111.6 0
For Future Use Set to 0000 as default
111.5 0
111.4 0
111 SFP+ Char. Passive SFP+ (Cable 03 111.3 0 No
attached directly)
SFP+ Linear Interface 111.2 0 No
SFP+ Limiting 111.1 1 Limiting with Tx & Rx
Interface
111.0 1 retimers
Characteristics
112 2F 00101111 /
TBD TBD TBD (C-temp)
113
33 00110011 3 (I-temp)
114 Ericsson ID2 – RDH code 20 00100000 Space
115 20 00100000 Space
116 20 00100000 Space
117 20 00100000 Space


1301-RDH 102 75/3 Uen E 2020-02-23

[Dec] [Hex] [Bin]
118 R-State Number 01 00000001 01h → 1
119 R-State Letter 01 00000001 01h → A
120 52 01010010 R
121 44 01000100 D
122 48 01001000 H
123 31 00110001 1
124 30 00110000 0
Ericsson ID1 – RDH code
125 32 00110010 2
126
37 00110111 7 (I-temp)
127
35 00110101 5 (I-temp)
Table 20 – Vendor Specific area value assignment


1301-RDH 102 75/3 Uen E 2020-02-23
3.5.3 Address A2h – Bytes 0-95 Area

The host shall be prevented from writing in this memory area (Alarm and Warning Thresholds as well
as Calibration Constants).
3.5.4 Address A2h - User Writable EEPROM

The content of User Writable Address A2h - Bytes 128 to 247 shall be programmed in compliance to
Table 22 as described in [31] and shall be non-volatile write-protected (reading shall be allowed without
password). For write access of this 120-byte memory location the host shall enter a 4-byte password as
per Table 21. Any values written to these password bytes are retained until power cycling, reset or
rewritten by the host. At start-up the password shall be initialized to 0xFFFFFFFF. In any case an attempt
to read Password Entry bytes shall get 0x00 or 0xFF. It shall not be possible to change customized
password.
Such a customisation shall be made exclusively for Ericsson and may be extended to third parties only
after specific written authorisation by Ericsson itself.

Meaning
[Dec] [Hex] [Bin]
123 5E 01011110 1st byte password entry
124 C0 11000000 2nd byte password entry
125 CC 11001100 3rd byte password entry
126 10 00010000 4th byte password entry
Table 21 – Password entry fields
Note: A2h Upper Pages 02h and 80h shall be Read/Write accessible without any password (see §3.4.7).


1301-RDH 102 75/3 Uen E 2020-02-23

Name of Field Meaning
[Dec] [Hex] [Bin]
128 Prefix 52 01010010 R
129 Version 00 00000000 NUL
TBA TBA TBA (C-temp)
130
43 C C (I-temp)
131
52 R R (I-temp)
132
54 T T (I-temp)
133
55 U U (I-temp)
134
41 A A (I-temp)
CLEI Code (1)
135
47 G G (I-temp)
136
4C L L (I-temp)
137
4C L L (I-temp)
138
41 A A (I-temp)
139
41 A A (I-temp)
140 52 01010010 R
141 44 01000100 D
142 48 01001000 H
143 31 00110001 1
144 30 00110000 0
145 Ericsson Product Number 32 00110010 2
146
37 00110111 7 (I-temp)
147
35 00110101 5 (I-temp)
148 2F 00101111 /


1301-RDH 102 75/3 Uen E 2020-02-23

Name of Field Meaning
[Dec] [Hex] [Bin]
149
33 00110011 3 (I-temp)
150 20 00100000 Space
151 20 00100000 Space
152 20 00100000 Space
153 20 00100000 Space
154 20 00100000 Space
155 20 00100000 Space
156 R-State Number (2) 01 00000001 01h → 1
157 R-State Letter (2) 00 00000000 00h → A
158 00 00000000 FFU
159 00 00000000 FFU
160 00 00000000 FFU
161 00 00000000 FFU
Pad
162 00 00000000 FFU
163 00 00000000 FFU
164 00 00000000 FFU
165 00 00000000 FFU
TBC TBC TBC (C-temp)
166 CRC High (3)
EC 11101100 CRC-16 1st byte
TBC TBC TBC (C-temp)
167 CRC Low (3)
E3 11100011 CRC-16 2nd byte
Table 22 – User Writable area
1. CLEI is a 10-character alphanumeric code. Only numbers and uppercase characters are allowed.
2. According to the Ericsson Specification No. 1/190 89-RDH 102 Uen [31].
3. See §3.5.4.1.


1301-RDH 102 75/3 Uen E 2020-02-23
3.5.4.1 CRC Algorithm

A 16-bit CRC shall be applied to the given data block of 38-byte in length (Address A2h - Bytes 128 to
165). In particular shall be implemented the CRC-16-GENIbus type with the following specifications:
 width = 16 bit
 polynomial = 0x1021
 initial value = 0xFFFF
 input data is NOT reflected
 output CRC is NOT reflected
 final XOR = 0xFFFF.
The CRC calculation shall be based on the algorithm as per the source code shown below:


1301-RDH 102 75/3 Uen E 2020-02-23
3.5.5 Json file for EEPROM check

The device EEPROM content, already defined in the rest of this document, is also reported in the
attached .json file (including the complete EEPROM map of addresses A0h and A2h with upper pages
00h, 01h, 02h, 03h, 80h) for easy check and implementation.
Important notes:
 All statically defined values, valid for any vendors, are exactly reported (hex)
 Vendor dependent or not static values are reported as follows:
- Letter X can be any value, i.e. in between 0x00 to 0xFF
- Letter Y only values in the interval 0x20 to 0xFE are admitted
- Letter W only the two values 0x00 or 0xFF are admitted
- Letter Z only values in the interval 0x30 to 0x39 are admitted
A file showing the positive comparison check result shall be provided to make the product approved,
demonstrating the correct implementation.


1301-RDH 102 75/3 Uen E 2020-02-23
3.6 Digital Diagnostics

2-wire serial bus address 1010001X (A2h) is used to access measurements of:
 transceiver case temperature
 transceiver supply voltage
 laser bias current
 transmitter coupled output power
 received optical power.
NOTE - The monitored average current should be representative of laser degradation.
The module shall meet the following requirements:

 when the transmitter is shut down (via Hw/Sw Tx_DISABLE control) the monitor of
transmitted output power shall indicate a stable value less than -30 dBm and relevant
Low Tx Power A/W flags shall be asserted (see §3.6.3)
 when Rx_LOS flag is asserted to ‘1’ it is required that received power monitoring shall be
maintained to a stable value to prevent Rx_LOS indicator from flickering
 when no optical power is present at the photodiode the monitor of received optical
power shall indicate a value less than the LOS threshold (see §3.4.2).
3.6.1 Digital Diagnostics Monitoring Accuracy

The accuracy on digital monitoring shall be compliant to SFF-8472 or better where otherwise specified
(as per Table 23), over specified operating temperature and power supply voltage. The module is
required to support internal calibration, thus Address A0 h - Byte 92 – bits 5 and 6 shall be set to ‘1’. As
far as temperature monitoring is concerned, reference shall be the case temperature of the transceiver
module.
Address A2h Parameter Accuracy Value

Item
Byte # [Dec] [Description] [Measurement Range]
3.6.1.1 96 to 97 Case Temperature ±3 C

[transceiver case temperature] [in the temperature range -40/+95 °C]
Power Supply Voltage ±3%
3.6.1.2 98 to 99
[transceiver supply voltage] [over voltage alarms range (see §3.6.2)]
Tx Bias ±10%
3.6.1.3 100 to 101
[Tx Bias current in uA] [over Tx bias alarms range (see §3.6.2)]
Tx Power ±2 dB
3.6.1.4 102 to 103
[Tx Output Power in mW] [over Tx power alarms range (see §3.6.2)]
Rx Power ±2 dB
3.6.1.5 104 to 105
[Rx Received Power in mW] [over Rx power alarms range (see §3.6.2)]
Table 23 – DDMs Accuracy


1301-RDH 102 75/3 Uen E 2020-02-23
3.6.2 Alarm and Warning Thresholds

The values programmed in EEPROM memory map and the meaning of Alarms and Warnings shall be in
full compliance with statements contained in SFF-8472.
If any temperature compensation is necessary on monitored parameters, this must be applied to actual
readings and not to Alarm or Warning threshold values.
To avoid causing the alarm and warning flags to flicker, due to the random fluctuation in the
corresponding A/D quantities, an appropriate hysteresis shall be set. The hysteresis settings have to be
defined to ensure the proper functioning of the alarm and warning flags while keeping as little as
possible the value of hysteresis.
Address A2h
High and Low A/W Thresholds Setting
Item Byte # [Dec] Name
[Starting Values]
[Dec]
ΔT = +8 °C
3.6.2.1 00 to 01 High Temperature Alarm w.r.t. max Operating Case Temperature
(see 3.2.2)
ΔT = +3 °C
3.6.2.2 04 to 05 High Temperature Warning w.r.t. max Operating Case Temperature
(see 3.2.2)
ΔT = -3 °C
3.6.2.3 06 to 07 Low Temperature Warning w.r.t. min Operating Case Temperature
(see 3.2.2)
ΔT = -8 °C
3.6.2.4 02 to 03 Low Temperature Alarm w.r.t. min Operating Case Temperature
(see 3.2.2)
ΔV = +10%
3.6.2.5 08 to 09 High Voltage Alarm
w.r.t. Nominal Power Supply Voltage (i.e., 3.3 V)
ΔV = +6%
3.6.2.6 12 to 13 High Voltage Warning
ΔV = -6%
3.6.2.7 14 to 15 Low Voltage Warning
ΔV = -10%
3.6.2.8 10 to 11 Low Voltage Alarm
vendor specific
3.6.2.9 16 to 17 High Tx Bias Alarm (1)
see footnote (2)
ΔI = -10%
3.6.2.10 20 to 21 High Tx Bias Warning (1)
w.r.t. High Tx Bias Alarm
ΔI = +50%
3.6.2.11 22 to 23 Low Tx Bias Warning (1)
w.r.t. Low Tx Bias Alarm


1301-RDH 102 75/3 Uen E 2020-02-23
Address A2h
High and Low A/W Thresholds Setting
Item Byte # [Dec] Name
[Starting Values]
[Dec]
vendor specific
3.6.2.12 18 to 19 Low Tx Bias Alarm (1)
see footnote (2)
ΔPTx = +2 dB
3.6.2.13 24 to 25 High Tx Power Alarm
w.r.t. max Av. Launch Power (see 3.3.2.6)
ΔPTx = +1 dB
3.6.2.14 28 to 29 High Tx Power Warning
w.r.t. max Av. Launch Power (see 3.3.2.6)
ΔPTx = -1 dB
3.6.2.15 30 to 31 Low Tx Power Warning
w.r.t. min Av. Launch Power (see 3.3.2.6)
ΔPTx = -2 dB
3.6.2.16 26 to 27 Low Tx Power Alarm
w.r.t. min Av. Launch Power (see 3.3.2.6)
ΔPRx = +2 dB
3.6.2.17 32 to 33 High Rx Power Alarm
w.r.t. max Av. Receive Power (see 3.3.3.4)
ΔPRx = +1 dB
3.6.2.18 36 to 37 High Rx Power Warning
w.r.t. max Av. Receive Power (see 3.3.3.4)
ΔPRx = -1 dB
3.6.2.19 38 to 39 Low Rx Power Warning
w.r.t. min Av. Receive Power (see 3.3.3.4)
ΔPRx = -2 dB
3.6.2.20 34 to 35 Low Rx Power Alarm
w.r.t. min Av. Receive Power (see 3.3.3.4)
Table 24 – Alarm and Warning Thresholds
1. Ericsson intends to monitor bias current for the purpose of correlating such measurements with the
High/Low Warning thresholds to schedule replacements of transceivers in field before link
performance is impacted.
2. High Alarm should be set considering components absolute ratings such as max LD forward current
and max LDD bias current. Low Alarm should be set considering the laser current threshold.
Thresholds equal to zero are not allowed.


1301-RDH 102 75/3 Uen E 2020-02-23
3.6.3 Alarm and Warning Flags

Address A2h – Bytes 112 to 117 contain a set of alarm and warning flags. The flags are required to be
non-latched. Two flag types are defined:
 alarm flags indicate conditions likely to be associated with a non-operational link and
cause for immediate action
 warning flags indicate conditions outside the normally guaranteed bounds but not
necessarily cause of immediate link failures.
NOTE - In the event that the transceiver operating parameters are outside the operating conditions,
alarm and warning flags shall be asserted regardless the accuracy of the DDM measurements.
Address A2h
Item Name Description
[Dec]
Set when internal temperature
3.6.3.1 112.7 High Temperature Alarm
exceeds high alarm level
Set when internal temperature is
3.6.3.2 112.6 Low Temperature Alarm
below low alarm level
Set when internal supply voltage
3.6.3.3 112.5 High Voltage Alarm
exceeds high alarm level
Set when internal supply voltage is
3.6.3.4 112.4 Low Voltage Alarm
below low alarm level
Set when Tx Bias current exceeds
3.6.3.5 112.3 High Tx Bias Alarm
high alarm level
Set when Tx Bias current is below low
3.6.3.6 112.2 Low Tx Bias Alarm (1)
alarm level
Set when Tx output power exceeds
3.6.3.7 112.1 High Tx Power Alarm
high alarm level
Set when Tx output power is below
3.6.3.8 112.0 Low Tx Power Alarm (1)
low alarm level
Set when Rx Power exceeds high
3.6.3.9 113.7 High Rx Power Alarm
alarm level
Set when Rx Power is below low
3.6.3.10 113.6 Low Rx Power Alarm
alarm level
Set when internal temperature
3.6.3.11 116.7 High Temperature Warning
exceeds high warning level
Set when internal temperature is
3.6.3.12 116.6 Low Temperature Warning
below low warning level


1301-RDH 102 75/3 Uen E 2020-02-23
Address A2h
Item Name Description
[Dec]
Set when internal supply voltage
3.6.3.13 116.5 High Voltage Warning
exceeds high warning level
Set when internal supply voltage is
3.6.3.14 116.4 Low Voltage Warning
below low warning level
Set when Tx Bias current exceeds
3.6.3.15 116.3 High Tx Bias Warning
high warning level
Set when Tx Bias current is below low
3.6.3.16 116.2 Low Tx Bias Warning (1)
warning level
Set when Tx output power exceeds
3.6.3.17 116.1 High Tx Power Warning
high warning level
Set when Tx output power is below
3.6.3.18 116.0 Low Tx Power Warning (1)
low warning level
Set when Rx Power exceeds high
3.6.3.19 117.7 High Rx Power Warning
warning level
Set when Rx Power is below low
3.6.3.20 117.6 Low Rx Power Warning
warning level
Table 25 – Alarm and Warning Flags
1. When transmitter is disabled by means of Tx Disable pin or by Soft Tx_DISABLE control these flags
shall be asserted.


1301-RDH 102 75/3 Uen E 2020-02-23
4 Product Quality
The component shall be compliant to the requirements of Ericsson Specifications No. 105 63-2031 Uen
and No. 105 63-2037 Uen, unless otherwise specified in this document.
4.1 Reliability and Lifetime

Reliability qualification plan and related documentation shall be compliant to Telcordia GR-468-CORE
[28]. Calculation shall be based on Telcordia SR-332 [30]. This shall comprise FIT figures at 40, 60, 70
and 85 °C as well as for intermittent operation, for both wear-out and random failure modes and the
related activation energy estimations, demonstrating specification compliance.
4.1.1 Continuous Operation (case temperature figures)
Item Temperature Parameter Value Unit

4.1.1.1 Oper. Range Lifetime (1) ≥ 10 year
4.1.1.2 40 °C ≤ 300
4.1.1.3 60 °C ≤ 500
Reliability |Failure Rate (2) FITs (3)
4.1.1.4 70 °C ≤ 700
4.1.1.5 85 °C (4) ≤ 1100
4.1.1.6 40 °C 381
4.1.1.7 60 °C 228
MTBF (5) years
4.1.1.8 70 °C 163
4.1.1.9 85 °C (4) 104
Table 26 – Lifetime and Failure Rate
1. The period for which all requirements shall be fulfilled.

2. This parameter includes wear-out and random failure. It is defined at the listed case temperatures
and 10 years of operation at a confidence level of 90%. The actual failure rate shall NOT exceed the
stated value at any single time throughout the entire lifetime of the product. Any value outside
bounds, as defined in this specification, is to be treated as a failure.
3. Failures per billion device hours.
4. For RDH 102 75/3 only.
5. MTBF |year = 109 x (FITs x 24 x 365)-1.


1301-RDH 102 75/3 Uen E 2020-02-23
4.2 Acceptance Criteria

All the documents listed in the table below shall be provided.
Type of Document Note

it shall include:
- list of non-conformances with counterproposal
- relevant Product Specification in force
- list of relevant Supplier Module Part Number(s)
- list of key components Manufacturers, e.g.
o TOSA/TO-Can/Laser Manufacturers
Product Specification Acceptance o ROSA/TO-Can/Photodiode Manufacturers
document (a.k.a. Gap Analysis) o CDRs
o Microcontroller
o Laser Driver
o Limiting Amplifier
- laser bias current threshold values
- jpeg images of labelling
- full EEPROM content dump file
Datasheet only of standard product(s)
DVT report -
Qualification/Reliability report as per Telcordia GR-468-CORE
Failure Rate calculation report as per Telcordia SR-332
EMI/EMC/ESD test report refer to §0
according to European Directive 2004/108/EC and
EMC Directive DoC
harmonised standard EN 300386
according to European Directive 2006/95/EC and
Low Voltage Directive-Safety DoC
harmonized standard EN 60950-1
as per IEC standards including IECEE CB Scheme. UL and
AUS/NZ national variations are required
Optical Safety DoC
as per CDRH regulations, including FDA accession
number and letter
General Safety DoC as per Ericsson Specifications [2], [3]
Flammability DoC as per Ericsson Specifications [2], [3]
RoHS2 DoC refer to §1.4
#6 samples as per Supplier’s production testing method
Test Report of (1)
#2 samples as per Ericsson’ SCTR template [33]
Table 27 – Acceptance criteria
1. Supplier shall random select - from the mass production line - a few samples which have been
manufactured and calibrated/tested to fully comply with the Product Specification in force. No


1301-RDH 102 75/3 Uen E 2020-02-23
minor/major Hardware or Software changes on the modules subject of testing are allowed without
a prior Ericsson’s approval. Set of samples tested and later supplied to Ericsson shall be
representative of the whole mass production (it shall include all the potential combinations of
different third-party components).
4.3 Production Test Data

Each component has to be combined with Production Test Data in digital format (e-data file) as per the
relevant Ericsson document No. 1/1013-RDH 102 75/3 [34].


1301-RDH 102 75/3 Uen E 2020-02-23
5 Labelling
The component shall be compliant to the requirements of Ericsson Specifications No. 105 63-2031 Uen
[2], 105 63-2037 Uen [3], 102 01-101 Uen [35], and No. 102 01-3153 Uen [36].
5.1 Product Marking of the Component

The component label shall be placed on the bottom side of the SFP28 device, facing up when the
transceiver is placed with the receptacle on the left.
The labelling may not cover or partially hide any other relevant marker, including safety label. Label
legibility shall not be impaired by repeated insertion of the device into a cage assembly. The labelling
shall not interfere with the mechanical, thermal or EMI features.
The label placed on the SFP28 module shall contain the following mandatory fields:
 Ericsson Logotype
 Product Serial Number (exactly the same characters sequence shall be used on the labels,
in the Barcodes and in the EEPROM)
[human readable and 1D Barcode (Code 128 – mode A)]
 Supplier Part Number
 Ericsson Product Number and R-State (as per Chapter 10)
 CLEI Code (as per Chapter 10)
[human readable and 2D Barcode (Micro PDF417)]
 Marking Text/Description (as per Chapter 10)
 Made in (i.e., Country of Origin)
 Supplier Regulatory Information (for example, Laser Class o UL marking)
 Factory Code
 Manufacturing Date (as YYYYMMDD)
Figure 8 – Layout of component label (text enclosed in angle brackets, “ABC1234567” and
“A12BC34D56” shall be replaced with the required information)
The content of not applicable fields shall be left blank.



1301-RDH 102 75/3 Uen E 2020-02-23
5.2 Product Package Marking

The content of not applicable fields shall be left blank. The information reported in 1D barcode need to
have minimum x-dimension 0.25 mm and minimum height 5 mm. Also, 2D barcode (compact PDF417)
shall be present on the label.
The label placed on the package shall contain the following mandatory fields:
 Ericsson Logotype
 Product Serial Number
 Supplier Part Number
 Ericsson Product Number (as per Chapter 10)
 Ericsson R-State (as per Chapter 10)
 Marking Text/Description (as per Chapter 10)
 Made in (i.e., Country of Origin)
 Manufacturing Date (as YYYYMMDD)
 Quantity
 Factory Code
 CLEI/ECI Codes (as per Chapter 10)
Figure 9 – Layout of package label (text enclosed in angle brackets, “ABC1234567” and “YYYYMMDD”
shall be replaced with the required information)


1301-RDH 102 75/3 Uen E 2020-02-23
6 Ericsson Serialization
The Product serial number shall conform to Ericsson standard 0012-101 Uen “Product
Traceability Numbers” [38].
The Ericsson serial number frame consists of 10 alphanumeric characters, starting with
three-characters factory code and followed by 7 characters sequence number.
Character set is the letters A-Z with the exception of O and I and digits 0-9.
The Product serial number shall be up-loaded to the Ericsson Tracy system using the B-
Records as per Ericsson specifications 155 19-FEA 104 701 “Tracy Interface Description”
[39], and BCT/I/ATT-00:0001 “Record Description” [40].
The same Serial Number characters sequence shall be used on the labels, in the Barcodes
and in the EEPROM as Product serial number.
In order to initiate the tracing process of the new product, the Supplier has to contact the
Tracy Support, tracy.helpdesk@ericsson.com, to receive all necessary information and
documentation, and to send sample data records to test Tracy first so that the new S/N can
be validated.
Please look at this page for any details http://tracy.ericsson.net/instructions/index.html



1301-RDH 102 75/3 Uen E 2020-02-23
7 Packing
The package shall be made of a conductive or dissipative material as per IEC 61340-5-1 [37].
Material Surface Resistivity [Ohm/square]

Conductive 1x103  1x105
Dissipative 1x105  1x1011
Table 28 – Package Material Classes
The packaging material and the product material shall be of a combination to minimize the triboelectric
charging.
Each module shall be sealed in a single shaped plastic transparent box (e.g., clamshell package) along
with a security (anti-tamper) adhesive label, unless otherwise requested with specific purchase
agreement. The text on the label (Font Type = Arial, Font Style = Regular, Font Height = 2 mm) shall be
as follows:
The quality and cleanness of this

product are guaranteed with this seal


1301-RDH 102 75/3 Uen E 2020-02-23
8 References
NOTE – This Product Specification, at the time of its issue, makes reference to the revision in force of
each document listed below. In any case, it is required to use the newest available revision of each
specification. In the case of conflicts between the requirements of this Product Specification and those
of other relevant specifications, the former shall prevail. To fetch the internal documents Ericsson
personnel shall get access to PRIM (Product Information Management), the common catalogue within
Ericsson for managing products and documents stored in GASK or in EriDoc.
[1] IEEE 802.3-2018, IEEE Standard for Ethernet
[2] Ericsson 105 63-2031 Uen, Rev. V, General Quality Requirements on Components
(access only for Ericsson personnel)
[3] Ericsson 105 63-2037 Uen, Rev. D, Quality Requirements for Fibre Optic Components
(access only for Ericsson personnel)
[4] CPRI, Ver. 7.0, Common Public Radio Interface; Interface Specification
[5] INCITS/ANSI, Rev. 3.10, Fibre Channel – Physical Interface-6 (FC-PI-6)
[6] INCITS/ANSI, Rev. 6.10, Fibre Channel – Physical Interface-5 (FC-PI-5)
[7] INCITS/ANSI, Rev. 3.5, Fibre Channel 10 Gigabit (FC-10GFC)
[8] OBSAI, Ver. 4.2, Reference Point 3 Specification
[9] InfiniBand, Release 1.3.1, Architecture Specification Volume 2
[10] ITU-T G.957, 03/2006, Optical Interfaces for Equipments and Systems Relating to the
Synchronous Digital Hierarchy
[11] ITU-T G.709/Y.1331, 06/2016, Interfaces for the optical transport network
[12] SFF-8402, Rev. 1.1, SFP+ 1X 28 Gb/s Pluggable Transceiver Solution (SFP28)
[13] SFF-8419, Rev. 1.3, Specification for SFP+ Power and Low Speed Interface
[14] SFF-8432, Rev. 5.2a, Specification for Improved Pluggable Formfactor
[15] SFF-8472, Rev. 12.3, Management Interface for SFP+
[16] SFF-8024, Rev. 4.7, SFF Module Management Reference Code Tables
[17] SFF-8071, Rev. 1.10, SFP+ 1X 0.8mm Card Edge Connector
[18] SFF-8433, Rev. 0.7, SFP+ Ganged Cage Footprints and Bezel Openings
[19] SFF-8079, Rev. 1.7, SFP Rate and Application Selection
[20] SFF-8083, Rev. 3.1, SFP+ 1X 10 Gb/s Pluggable Transceiver Solution (SFP10)
[21] IEC 60695-2-2, Ed. No. 2.0, Fire hazard testing – Part 2: Test Methods – Section 2
Needle-flame test
[22] UL-94, Ed. No. 6, Standard for Tests for Flammability of Plastic Materials for Parts in
Devices and Appliances


1301-RDH 102 75/3 Uen E 2020-02-23
[23] ISO 4589, Ed. 1996, Plastics - Determination of burning behaviour by oxygen index
[24] Directive 2011/65/EU of the European Parliament and of the Council, Restriction of the
use of certain hazardous substances (RoHS), amended by EU Directive 2015/863
[25] EN 50581:2012, Technical documentation for the assessment of electrical and
electronic products with respect to the restriction of hazardous substances
[26] IEC 61754-20, Ed. No. 2.0, Fibre optic interconnecting devices and passive components -
Fibre optic connector interfaces Part 20: Type LC connector family
[27] IEC 60874-14-3, Ed. No. 1.0, Connectors for optical fibres and cables - Part 14-3: Detail
specification for fibre optic adaptor (simplex) type SC for single-mode fibre
[28] Telcordia GR-468-CORE, Issue No. 2, Generic Reliability Assurance Requirements for
Optoelectronic Devices Used in Telecommunications Equipment
[29] EN 55032, Electromagnetic compatibility of multimedia equipment - Emission
requirements
[30] Ericsson 1056-FCP 1210786/1, Rev. U, Ericsson MONI tagged SFP Vendor Specific
EEPROM Programming Requirements (access only for Ericsson personnel)
[31] Ericsson 1/190 89-RDH 102 Uen, Rev. D, ERICSSON EEPROM Requirement for CLEI Code
definition (access only for Ericsson personnel)
[32] Telcordia SR-332, Issue No. 3, Reliability Prediction Procedure for Electronic Equipment
[33] Ericsson 15241-RDH 102 75/3, SCTR Template for 25GBASE-LR SFP28 (access only for
Ericsson personnel)
[34] Ericsson 1/1013-RDH 102 75/3, Rev. B, E-Data Specification for RDH10275/3 (access
only for Ericsson personnel)
[35] Ericsson 102 01-101, Rev. X, Ericsson Product Identity Marking (access only for Ericsson
personnel)
[36] Ericsson 102 01-3153 Uen, Rev. F, Marking of Optical Components (access only for
Ericsson personnel)
[37] IEC 61340-5-1, Ed. No. 1.0, Electrostatics - Part 5-1: Protection of electronic devices
from electrostatic phenomena - General requirements
[38] Ericsson 0012-101Uen, Rev. U, Product Traceability Numbers (access only for Ericsson
personnel)
[39] Ericsson 15519-FEA104701Uen, Rev. B, Tracy Interface Description (access only for
Ericsson personnel)
[40] Ericsson BCT/I/ATT-00:0001, Record Description (access only for Ericsson personnel)


1301-RDH 102 75/3 Uen E 2020-02-23
9 Abbreviations and Acronyms

This Specification uses the following abbreviations and acronyms:
25GAUI – 25 Gbit/s Attachment Unit Interface
ASCII - American Standard Code for Information Interchange
BER - Bit Error Rate
BOL - Beginning of Life
CLEI - Common Language Equipment Identification
CPRI - Common Public Radio Interface
DFB - Distributed Feedback Laser
ECI - Equipment Catalogue Item
DWDM - Dense Wavelength Division Multiplexing
EEPROM - Electrically Erasable Programmable Read-Only Memory
EMC - Electromagnetic Compatibility
EMI - Electromagnetic Interference
EOL - End of Life
ESD - Electro-Static Discharge
ETS - European Telecommunications Standards (Institute)
FC - Fibre Channel
FE - Fast Ethernet
FFU – For Future Use
FIT - Failures in Time
10GbE – 10 Gigabit Ethernet
GbE - Gigabit Ethernet
GBIC - Gigabit Interface Converter
GND - Electrical Ground
HBM - Human Body Model
IEC - International Electrotechnical Commission
IEEE - Institute of Electrical and Electronic Engineers
IPF - Improved Pluggable Formfactor
ITU-T - International Telecommunication Union – Telecommunication Standardization Bureau
LC - Lucent Connector/Little Connector
LOS - Loss of Signal
MSA - Multi-Source Agreement
OBSAI - Open Base Station Architecture Initiative
OC - Optical Carrier
PMD - Physical Medium Dependent
PRIM - Product Information Management
RIN - Relative Intensity Noise
RoHS - Restriction of Hazardous Substances
Rx - Receiver
SDH - Synchronous Digital Hierarchy
SFF - Small Form Factor


1301-RDH 102 75/3 Uen E 2020-02-23
SFI - SFP+ high speed serial electrical interface

SFP - Small Form-factor Pluggable
SFP+ - Enhanced Small Form-factor Pluggable
SFP28 - 28 Gbit/s Enhanced Small Form-factor Pluggable
SLM - Single Longitudinal Mode
SMF - Single-Mode Fiber
SONET - Synchronous Optical NETworking
STM - Synchronous Transport Module
TBA – To Be Assigned
TBD – To Be Decided
TEC – Thermoelectric Cooler
TIA - Telecommunications Industry Association
TP - Test Point
Tx - Transmitter


1301-RDH 102 75/3 Uen E 2020-02-23
10 Product List
Below is shown the list of all products (Ericsson Product Number) included in this specification, plus any
information for each product.
Item Description Note

RDH 102 xx/x (TBD) C-temp
Ericsson Product No.
RDH 102 75/3 I-temp
R-State R1A -
25GBASE-LR C-Temp SFP28 C-temp
Product Description
25GBASE-LR I-Temp SFP28 I-temp
Bail Color BLUE -
ECI No. = TBA
C-temp
CLEI Code = TBA
Other Information
ECI No. = 198644
I-temp
CLEI Code = CRTUAGLLAA
Table 29 – List of Products


1301-RDH 102 75/3 Uen E 2020-02-23
11 Document Revision
Date
Revision Remarks Author
(YYYY-MM-DD)
Stefano Carli
PA1 2016-12-07 First Draft
(ESTCARL)
Stefano Carli
PA2 2016-12-19 New Draft
(ESTCARL)
New Draft. List of changes:
- Section 0 Control of CDRs (reviewed content of
control table, default bits and added software-only
mode)
- Section 3.4.14 (reviewed loopback control modes)
- Section 10 (added ECI No. & CLEI Code for I-temp
module)
- Section 3.5.4 (calculated CRC bytes for I-temp Stefano Carli
PA3 2017-02-24 module)
(ESTCARL)
- Section 3.2 (added a footnote for -40 °C operation)
- Section 3.3.3 (relaxed Rx_LOS De-Assert)
- Section 3.3.6 (changed max value of steady-state
only for reference)
- Section 0 (EN55022 replaced by EN55032:2012)
- Section 3.6.3 (added a note for A/W behaviour)
- Section 3.4.9 (toggling of Tx_DISABLE pin).
New Draft. List of changes:
- reviewed content of Section 3.4.2 (Rx_LOS)
- added Section 3.4.3 (Soft Tx_DISABLE) Stefano Carli
PA4 2017-03-27 - added Section 3.4.13 (Service Disruption) (ESTCARL)
- Modified Section 0 (restored control of CDRs as rev.
PA2)
- Modified Section 3.5.1 (changed content of Byte 13)
- Splitted in Table 6 TD spec as follows:
3.3.2.1 up to 14G |BER = 1E-12
Transmitter and 3.0
3.3.2.2 up to 25G |BER = 5E-5 dB
Dispersion Penalty
3.3.2.3 up to 25G |BER = 1E-12 3.0 Gianluca Ricci
A 2017-06-09
(EGIARIC)
- Defined in Table 6 Transmitter Eye Mask Hit Ratio
5x10-5, Margin 5%
- Changed in Table 7 Rx_LOS De-Assert to -15dBm
- Added requirements for module top cooling surface
characteristics and dimensions (see 2.1)
- Modified 3.3.2.16 (was RIN12OMA, becomes Gianluca Ricci
PB1 2017-12-15 RIN20OMA)
- Modified Reflectance 3.3.2.18 and 3.3.3.11 (was -35
(EGIARIC)
dB, becomes -27 dB)
- Added Latency requirements (see3.3.4)


1301-RDH 102 75/3 Uen E 2020-02-23
Date
(YYYY-MM-DD)
- Added Tx Equalization and Rx Emphasis default
values (see 3.4.5)
- Replaced chapter 4.1 - Reliability and Lifetime
- Added requirement for full EEPROM map embedded
into Gap Analysis (see Table 27)
- Added clarification in 5.1 about Product Serial
Number that must use exactly the same characters
sequence on the labels, in the Barcodes and in the
EEPROM
- Added §3.3.3.1 (Tx waveform @ ≤ 10.3Gbps)
- Added note in §3.4.8 about no actions on other
parameters exiting from/entering in Power Level 1
- Added statement about Tx_DISABLE not causing
Tx_FAULT in §3.4.9
- A0h Byte 64-65 (Options) made explicit in §3.5.1 Gianluca Ricci
B 2018-09-12 - Date Code made explicit in §3.5.1 (EGIARIC)
- Changed range for Case Temperature Accuracy in
§3.6.1.1
- Changed statement about “temperature
compensation” in §3.6.2
- Added Microcontroller, Laser Driver, and Limiting
Amplifier in Gap Analysis required data (see §4.2)
Warning: changes applied in rev. C of this
document are not applicable to products previously
already qualified. They are anyhow to apply in case
of PCNs
- Amended Note 1 of Table 1
- Renewed Figure 2
- Bail latch extraction force required 60N in §2.1.4
- Modified notes about protection mechanism in §3.2
- Updated Extinction Ratio values in Table 6
- Re-organized and re-ordered the whole chapter 3.4
(Functional Description)
- Modified §3.4.7 (Page Selection) - 00h and 01h
Gianluca Ricci
C 2019-11-05
mirrored, 02h and 03h not mirrored. (EGIARIC)
- Rephrased/added §3.4.3
- Rephrased §3.4.9, added Table 13, Table 12
- Removed RS0, RS1 rate select timing for FC in Table
17
- Modified 3.4.16.2.8 (f_serial_clock ≤ 400 kHz) in
Table 18
- Added §3.4.15 (Protection Mechanism)
- Modified A0h Bytes 20-35 (Vendor Name) in Table 19
- Amended field name/meaning of Bit 64.0 in Table 19
- Split at bit level Byte 92 in Table 19
- Amended Note 1 in §3.5.1


1301-RDH 102 75/3 Uen E 2020-02-23
Date
(YYYY-MM-DD)
- Added reference to document in §3.5.4
- Amended Note in §3.4.10.1 (SW-only)
- Added §3.5.5 (Json file for EEPROM check)
- Added missing reference to Note 1 to 3.6.3.6 (Low Tx
Bias Alarm) and 3.6.3.16 (Low Tx Bias Warning)
- Included complete version (with explicit MTBF
values) of Table 26
- Excluded Supplier Name/Trademark from §5.1
- Modified text in brackets for Supplier Regulatory
Information in §5.1
- Added chapter 6 (Ericsson Serialization)
- Updated chapter 8 (References)
- Minor editorial changes
- Added the clarification “at horizontal orientation” in
§2.1.4 (Bail Latch)
- Amended/rephrased §3.4.9 (Tx_FAULT Behaviour)
- Amended A0h Byte 111 (03h, because of Rx and Tx
retimers present) in §3.5.2
- Replaced json file with new Rev02 in §3.5.5 Gianluca Ricci
D 2020-01-17 - Updated SFF-8024 reference [16] (Published Rev 4.7
January 8, 2020)
(EGIARIC)
- Updated SFF-8071 reference [17] (Published Rev 1.10
December 13, 2019)
- Updated 1056-FCP 1210786/1 reference [30] (Issued
Rev. U 2019-12-11)
- Updated RoHS reference [24]
- Added Transmitter Data Input requirements 3.3.6.11
and 3.3.6.12
- Modified and completed §3.4.7 (Page Selection)
Gianluca Ricci
E 2020-02-20 - Added reference to §3.4.7 (Page Selection) in §3.5
(EGIARIC)
- Added note to §3.5.4 (no password for 02h and 80h)
- Replaced json file with new Rev03 in §3.5.5
(corrected typo in A2h Bytes 148-149)

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Confidentiality Class External Confidentiality Label Document Type Page

Ericsson Internal Product Specification 1 (71)

EGIARIC Gianluca Ricci BNEWKIK [Jon Ji] EZSONMI

1301-RDH 102 75/3 Uen E 2020-02-23

Given under confidence.

Ericsson Internal Product Specification 2 (71)

EGIARIC Gianluca Ricci BNEWKIK [Jon Ji] EZSONMI

1301-RDH 102 75/3 Uen E 2020-02-23

3.4.4 Tx_DISABLE State .................................................................................................................................. 25

4 Product Quality .................................................................................................................. 57

6 Ericsson Serialization .......................................................................................................... 62

Ericsson Internal Product Specification 3 (71)

EGIARIC Gianluca Ricci BNEWKIK [Jon Ji] EZSONMI

1301-RDH 102 75/3 Uen E 2020-02-23

Figure 1 – Drawing of Dual-Fibre Working transceiver (dimensions are in millimetres) ....................... 10

Table 1 – Data Rate and Standard............................................................................................................. 6

Ericsson Internal Product Specification 4 (71)

EGIARIC Gianluca Ricci BNEWKIK [Jon Ji] EZSONMI

1301-RDH 102 75/3 Uen E 2020-02-23

Table 25 – Alarm and Warning Flags....................................................................................................... 56

Ericsson Internal Product Specification 5 (71)

EGIARIC Gianluca Ricci BNEWKIK [Jon Ji] EZSONMI

1301-RDH 102 75/3 Uen E 2020-02-23

Ericsson Internal Product Specification 6 (71)

EGIARIC Gianluca Ricci BNEWKIK [Jon Ji] EZSONMI

1301-RDH 102 75/3 Uen E 2020-02-23

Ericsson Internal Product Specification 7 (71)

EGIARIC Gianluca Ricci BNEWKIK [Jon Ji] EZSONMI

1301-RDH 102 75/3 Uen E 2020-02-23

NOTE – Refer to Chapter 9 for acronyms and abbreviations.

Ericsson Internal Product Specification 8 (71)

EGIARIC Gianluca Ricci BNEWKIK [Jon Ji] EZSONMI

1301-RDH 102 75/3 Uen E 2020-02-23

1.1 Laser Safety

A Material Declaration shall be issued and made available to Ericsson.

1.5 Quality Requirements

Ericsson Internal Product Specification 9 (71)

EGIARIC Gianluca Ricci BNEWKIK [Jon Ji] EZSONMI

1301-RDH 102 75/3 Uen E 2020-02-23

1.6 Supplier Responsibility for Changes Notification

1.7 Cleanness of Fibre Optic Connectors

Ericsson Internal Product Specification 10 (71)

EGIARIC Gianluca Ricci BNEWKIK [Jon Ji] EZSONMI

1301-RDH 102 75/3 Uen E 2020-02-23

2.1 Mechanical Specifications

2.1.1 Module Dimensions

Electrical interface (PCB), to mate into the board connector

Figure 1 – Drawing of Dual-Fibre Working transceiver (dimensions are in millimetres)

Ericsson Internal Product Specification 11 (71)

EGIARIC Gianluca Ricci BNEWKIK [Jon Ji] EZSONMI

1301-RDH 102 75/3 Uen E 2020-02-23

2.1.2 Cooling Surface

Figure 2 – Module cooling surface

Ericsson Internal Product Specification 12 (71)

EGIARIC Gianluca Ricci BNEWKIK [Jon Ji] EZSONMI

1301-RDH 102 75/3 Uen E 2020-02-23

2.1.3 IPF Module Durability and Card Edge Connector