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TechInfo HC 100804e - 120131
TechInfo HC 100804e - 120131
DIN-Connectors
HI-CON®
rok-100805rev120131 / page 1-3
Ø As manufacturers move to one PCB with solder paste filled-in THR (Through Hole Reflow)
step solder process using reflow technology involves the following
techniques, normal through hole manufacturing steps:
components don't meet the
temperature demands required. Ø First, the solder paste is applied to
the PCB. This is done either with a
Ø Pancon is pleased to announce silk print process, a dispenser, or a
the introduction of our high solder preform.
temperatur DIN 41612 connector
series, THR (Through Hole Ø The SMD components are then
Reflow) placed onto the PCB. Finally, the
Connector pins are being
connectors are placed into the
Ø The connectors are designed to pressed-in holes, which are filled with solder
withstand reflow temperatures and paste.
be soldered in the same
production batch as other surface Ø In order to insure a quality reflow
mount components on the PCB. solder process, a uniform heat
This eliminates the need for distribution is necessary to all
additional solder operations like solder locations.
wave solder or press-fit.
Ø Although the connectors have a
Ø In the past, the SMT components higher volume and mass as other
had to be assembled and reflow SMT components, a longer solder
soldered, before in an additional time is not required. Pancon's
process step the connector had highttemperature THR connectors
been pressed into the PCB. Now are as completely reliably as
the male or female connectors are conventional wave solder
soldered fully automated with the connections. Additionally, all visual
other components in the standard inspection requirements of the
SMT process. Ready for soldering international standards are met.