NALLA MALLA REDDY ENGINEERING COLLEGE

DEPARTMENT OF MECHANICAL ENGINEERING

COURSE DESCRIPTION FORM

Course Title MEMS: DESIGN AND MANUFACTRING (PROFESSIONAL ELECTIVE-IV)

Course Code MEPE
Regulation R19-JNTUH
Course Structure Lectures Tutorials Practical’s Credits
3 - - 3
Name of Faculty Dr. Asit Kumar Parida, Associate Professor

I. COURSE OVERVIEW:

II. PREREQUISITE(S):

Level Credits Periods / Week Prerequisites

Electronic circuit, Basic knowledge in material science
PG 3 4

III. MARKS DISTRIBUTION:

Sessional Marks (25) University Total

End Exam Marks
Marks
Continuous Assessment Tests (Midterm examinations):
There shall be 2 midterm examinations. Each midterm examination consists of one objective
paper, one subjective paper and two assignments. The objective paper is for 10 marks and
subjective paper is for 10 marks, with duration of 1 hour 20 minutes (20 minutes for objective and
60 minutes for subjective paper). Objective paper is set for 20 bits of – multiple choice questions,
fill-in the blanks, 10 marks. Subjective paper contains of 4 full questions (one from each unit) of
which, the student has to answer 2 questions, each question carrying 5 marks. 75 100
First midterm examination shall be conducted for 2.5 units of syllabus and second midterm
examination shall be conducted for another 2.5 units. 5 marks are allocated for Assignment. The
total marks secured by the student in each
Midterm examination is evaluated for 25 marks.
 IV. EVALUATION SCHEME:

S. No. Component Duration Marks

1 I Mid Examination 80 Minutes 20
2 I Assignment 5
TOTAL 25
3 II Mid Examination 80 Minutes 20
4 II Assignment 5
TOTAL 25
5 EXTERNAL Examination 3 hours 75
GRAND TOTAL 100

V. COURSE OBJECTIVES:

The objectives of the course are to enable the student;

I. To make students to gain basic knowledge on overview of MEMS (Micro electro
Mechanical System) and various fabrication techniques.
II. To design, analysis, fabrication and testing the MEMS based components
III. To introduce the students various opportunities in the emerging field of MEMS

VI. COURSE OUTCOMES:

On successful completion of the course, the student will be able to

1. Synthesize and characterize nanomaterials for engineering applications.
2. Design and analyze methods and tools for micro and nano manufacturing.
3. Improve the quality of MEMS by analyzing the variables of the underlying micro and nano manufacturing
method.
4. Select appropriate industrially-viable process, equipment’s and tools for a specific product.
II. HOW COURSE OUTCOMES ARE ASSESSED:

Proficiency
Program Outcomes Level
assessed by
PO1 Engineering knowledge: Capability to apply the knowledge of Mathematics, Science Assignments
and Engineering in the field of Mechanical Engineering. Midterm and
H
University
examinations
PO2 Problem analysis: An ability to analyze complex engineering problems to arrive at Assignments
relevant conclusions using knowledge of Mathematics, Science and Engineering. Midterm and
H
University
examinations
PO3 Design/development of solutions: Competence to design a system, component or process Assignments
to meet societal needs within realistic constraints. Midterm and
S
University
examinations
PO4 Conduct investigations of complex problems: To design and conduct research
oriented experiments as well as to analyze and implement data using research S Projects
methodologies.
O5 Modern tool usage: An ability to formulate, solve complex engineering problems using
modern engineering and Information Technology tools. S Mini Projects

PO6 The engineer and society: To utilize the Engineering practices, Techniques, skills to
H Assignment
meet needs of the health, safety, legal, cultural and societal issues.

PO7 Environment and sustainability: To understand impact of Engineering

Solutions in the societal context and demonstrate the knowledge for sustainable N --
development.
PO8 Ethics: An understanding and Implementation of professional and Ethical
H Guest Lecture
Responsibilities.

PO9 Individual and teamwork: To function as an effective individual and as a member or

leader in Multi-disciplinary environment and adopt in diverse teams. N --

PO10 Communication: An ability to assimilate, comprehends, communicate, give

And receive instructions to present effectively with engineering community and society. S Mini Project

PO11 Project management and finance: An ability to provide leadership in managing

complex engineering projects at Multidisciplinary environment and to become a N --
professional engineer.
PO12 Life-long learning: Recognition of the need and an ability to engage in life- long
learning to keep abreast with technological changes. S Guest Lecture
III. HOW PROGRAM SPECIFIC OUTCOMES ARE ASSESSED:

Proficiency
Program Specific Outcomes Level
assessed by
PSO1 Professional Skills: To produce engineering professional capable of synthesizing and Practical’s,
analyzing mechanical systems including allied engineering streams. Midterm and
H
University
examinations,
PSO2 Design/Analysis: An ability to adopt and integrate current technologies in the design and
manufacturing domain to enhance the employability. H Projects

PSO3 Successful Career and Entrepreneurship: To build the nation, by imparting

technological inputs and managerial skills to become Technocrat. S Guest Lectures
 SYLLABUS:

UNIT-I
Overview and working principles of MEMS and Microsystems:

MEMS & Microsystems, Evolution of Micro fabrication, Microsystems &

Microelectronics, Microsystems & miniaturization, Applications of MEMS in
Industries, Micro sensors, Micro actuation, MEMS with Micro Actuators Micro
accelerometers, Micro fluidics
.
UNIT-II
Engineering Science for Microsystems Design and Fabrication:

Atomic structure of Matter, Ions and Ionization, Molecular Theory of Matter and
Intermolecular Forces, Doping of Semiconductors, The Diffusion Process, Plasma
Physics, Electrochemistry, Quantum Physics.

UNIT-III
Engineering Mechanics for Microsystems Design:

Static Bending of Thin plates, Mechanical Vibration, Thermo-mechanics, Fracture

Mechanics, Thin- Film Mechanics, Overview of Finite Element Stress Analysis.

UNIT-IV
Thermo Fluid Engineering & Microsystems Design:
Overview of Basics of Fluid Mechanics in Macro and Mesoscales, Basic equations in
Continum Fluid Dynamics, Laminar Fluid Flow in Circular Conduits, Computational
Fluid Dynamics, Incompressible Fluid Flow in Micro conduits, Fluid flow in Sub
micrometer and Nano scale, Overview of Heat conduction in Solids, Heat Conduction
in Multilayered Thin films and in solids in sub micrometer scale, Design
Considerations, Process Design Mechanical Design, Mechanical design using FEM,
Design of a Silicon Die for a Micro pressure sensor.

UNIT-V
Materials for MEMS & Microsystems and their fabrication:

Substrates and Wafers, Active substrate materials, Silicon as a substrate material,

Silicon compounds, Silicon Piezoresistors, Gallium Arsenide, Quartz, Piezoelectric
Crystals and Polymers, Photolithography, Ion implantation, Diffusion and oxidation,
Chemical and Physical vapor deposition, etching, Bulk micro manufacturing, Surface
Micromachining, The LIGA Process.

TEXT BOOKS:

1. Tia-Ran Hsu, MEMS & Microsystems. Design & Manufacturing, TMH 2002.
2. Foundation of MEMS/Chang Liu/Person, 2012.

REFERENCES:
1. An Introduction to Microelectromechanical Systems Engineering by Malluf, M., Artech
House, Boston 2000.
2. Micro robots and Micromechanical Systems by Trimmer, W.S.N, Sensors & Actuators,
Vol 19, 1989.
3. Applied Partial Differential Equations by Trim., D. W., PWS-Kent Publishing, Boston,
 1990.
4. Microsystem Design by Stephen D. Senturia, Springer Publishers

COURSE PLAN:

Course Title MEMS: DESIGN AND MANUFACTRING (PROFESSIONAL ELECTIVE-IV)

Course Code MEPE
Regulation R19-JNTUH
Course Structure Lectures Lectures Practical’s Credits
3 3 - 3
Name of Faculty Dr. Asit Kumar Parida, Associate Professor
.
Lecture
Course Learning Outcomes Topics to be covered Reference
No.
UNIT-I
1 Introduction T1:1.1, T1:1.2
How small are MEMS devices?

2 MEMS MEMS=A pioneer technology for T1:1.4

miniaturization
Miniaturization-The principal driving force for
the 21st century Industrial Technology
3 Miniaturization makes engineering sense, T1:1.5
Enabling Technologies for Miniaturization,
The lucrative revenue prospects for
Typical microsystems products
miniaturized industrial products
4 MEMS products, Evolution of T1:2.2
Microfabrication,
5 Micro sensors, Micro actuation, Micro T1:2.4,2.9
accelerometer, Micro fluids
6 Applications Applications of MEMS and Microsystems in T1:3.1,T1:4.5
Aerospace, Biomedical and
Telecommunication Industry
7 Tool feed mechanism, Abrasive slurry, Liquid T1:10.2,T1:11.2
Mechanism and process capability media,
8 Process Parameters, Process Capabilities, T1:11.5,T1:12.1
9 Application Advantages and disadvantages, Application T1:16

10 Derivation of material removal rate T1: 17,

11 Mechanics of cutting in Ultrasonic Grain throwing model T1:19

Machining
12 Grain hammering model T2:2.2

13 Effect of amplitude on MRR, Effect of T1:22.2

frequency on MRR, Effect of slurry, tool and
work material
14
Machining characteristics of USM T1:22.2, T1:22.5.
Effect of abrasive grain size, Effect of applied
static force, Effect of hardness ratio of the
tool and the workpiece
15 1. Contouring using USM T1:23.2, T1:23.3
Recent development in USM. 2. Rotary USM
3. US assisted ECM
UNIT-II
16 Introduction: T1:7, T1:8
Equipment’s and process parameters,
Abrasive Jet Machining (AJM) and
working principle

17 Characteristics, Machining characteristics of AJM T1:2.2

1. Effect of water pressure on the depth of
cut
2. Effect of abrasive flow rate on DoC for
various work materials
3. Effect of stand-off distance on the DoC
18 1. Effect of abrasive flow rate on DoC for T2:2.4, R2.2:3
various abrasive materials
2. Effect of traverse rate on the area of
penetration
3. Effect of variation of DoC with a change
in the number of passes
19 Application. Advantages, Disadvantages and Applications T2:2.5, R2:2.3

20 Water Jet Machining (WJM) and Process, Application, Advantages and T2:2.5, R2:2.3
Abrasive Water Jet Machining disadvantages.
(AWJM)
21 Electro chemical machining Fundamentals of electro chemical machining, T2:2.5, R2:2.3
Working Principle, Electrolytes and Process
Parameters

22 Process Parameters Process parameters that affect MRR, surface T2:2.5, R2:2.3
finish and over-cut, ECM Process
characteristics: MRR, surface finish
23 Process Capabilities Estimation of MRR, Advantages and T2:2.6, R2:2.5
disadvantages
UNIT-III
24 EDM General Principle and Basic requirement of
EDM Process, Equipment’s
25 Mechanics of Metal Removal,

26 Types of Generator, Electrode Materials

27 Choice of dielectric fluid, EDM tool design

28 Machining characteristics,

29 Process Capabilities 1. Independent controlled parameters

2. Dependent controlled parameters
30 Characteristics of spark eroded surfaces,
Application, advantages and disadvantages of
Electric Discharge Machining,
31 Factors for selection of EDM machine tool
design, Analysis of RC type relaxation EDM
generator
32 Electro discharge grinding

33 Electrode (Tool) wear rate, Flushing, EDM

Accessories
34 Solving numerical problems

35 Wire electro discharge machining

UNIT-IV
36 Electron Beam Machining (EBM) Theory of Electron Beam Machining,
Equipment’s
37 Mathematics of Electron Beam Machining,
Mechanics of EBM
38 Process Parameters,

39 Applications, advantages and disadvantages of

EBM
40 Comparison between thermal and non-thermal
process
41 Solving numerical problems

42 Laser Beam Machining (LBM) Introduction

43 Lasing action and population inversion

44 Mechanics and Inversion Methods to achieve population inversion and

types of laser
45 Mechanics of Material Removal and Process
Capabilities
46 Application, Advantages and Disadvantages

UNIT-IV
47 Plasma Arc Machining (PAM) Introduction and Generation of Plasma

48 Process and Equipment’s 1. Power Supply 2. Gas Supply 3. Cooling

water system
Modes of operations of DC plasma torches
49 Methods to Stabilize Arcs Methods to Stabilize Arcs

50 Parameters that influence PAM Parameters associated with design and

performance operation of the torch
Parameters associated with environment in
which work is performed
51 Process capabilities Application, Advantages and Disadvantages

52 Safety Safety precautions to be taken in PAM and

discussing Q & A.
IV. MAPPING COURSE OBJECTIVES LEADING TO THE ACHIEVEMENT OF PROGRAM
OUTCOMES AND PROGRAM SPECIFIC OUTCOMES:
 Program Specific
Program Outcomes
Course Outcomes
Objectives PO PO PO PO PO PO PO PO PO PO PO PO PSO PSO PSO
1 2 3 4 5 6 7 8 9 10 11 12 1 2 3
I H S S H S S H S
II H H S S H H
III H S S H S H
IV H S H S S H S
V S H S H S
S =Supportive H=Highly Related

V. MAPPING COURSE OUTCOMES LEADING TO THE ACHIEVEMENT OF PROGRAM

OUTCOMES:

Program Specific
Program Outcomes Outcomes
Course
Outcomes PO PO PO PO PO PO PO PO PO PO PO PO PSO PSO PSO
1 2 3 4 5 6 7 8 9 10 11 12 1 2 3
1 H S S H S S H S
2 H S S H S S H
3 S S H S S H
4 S S S S S S S H
5 S H S S
6 H S S S H
7 S H S S H
8 S H S S H
9 S H S H S S H
10 H S S H S S
S =Supportive H=Highly Related

Prepared By:
Dr. Asit Kumar Parida, Associate Professor