Professional Documents
Culture Documents
Tareas MFI
Tareas MFI
Tareas MFI
Metodología
El siguiente plan de trabajo será implementado para alcanzar los objetivos específicos
descritos en la sección 1.3. El plan de trabajo está dividido en tareas y subtareas (T), hitos
(H) y entregables (E).
This is the basic work required to assure the successful completion of the project. It
encompasses such internal activities as meetings, monitoring actions, relationships with
suppliers, etc., as well as relationships with the management bodies of the University;
document management with the department and the university, and preparing the follow-
up reports requested for the yearly administrative settlement. According to the internal
guidelines of our research group, there will also be a final documentation work to organize,
consolidate and record the results of the project.
Here, the state of the art of EV propulsion systems will be analyzed globally. This study will
determine the requirements to be fulfilled by the power converter to be designed in the
project. This task consists of the following subtasks:
T1.1. State of the technology of EV propulsion systems. First, the latest trends in the
field of EV propulsion (light, medium and heavy vehicles) will be thoroughly reviewed.
Special attention will be paid to the electrical machine technology (IM, PMSM, SynRM,
etc.), configuration (number of phases and poles, etc.), performance (torque, speed), etc.
Next, the implications of these characteristics in the power converter will be analyzed.
D2.4. Report describing the requirements of the switching devices of the converter.
TAREA 3: Análisis de diversas FPGAs que más se adecuen a los requisitos de los
nodos.
Once the requirements of the power converter and its devices have been determined, the
most suitable semiconductor devices must be selected, which will be done as follows:
T3.1. Update of the state of the art of SiC and GaN based semiconductor devices. In
previous projects, our research group has gained a great knowledge in WBG
semiconductor devices. However, because the technology is constantly evolving, it is
necessary to update such previous knowledge, to become fully acquainted with the latest
developments in this field.
M4.1. Model of the multiphase system, including a reliable model of the motor.
M4.4. Novel fault tolerant control algorithms for multiphase drive systems.
D4.1. Simulation models of propulsion systems having modulation and control solutions.
Parallel to the development of the converter, the integral design of each firing board will be
addressed, i.e. the interface between the control board and the power module. Because of
the higher switching frequencies, SiC- and GaN-based driver boards are different from
their conventional counterparts aimed at Si-based IGBTs. These differences make it
necessary to particularize the design, which will be done as follows:
T6.1. Analysis of the driver topologies of power semiconductors. This subtask will
analyze the various driver topologies, bearing in mind aspects as: a) Protections:
protections against overvoltages and overcurrents caused by parasitic elements present in
the circuits will be analyzed; then, it will be studied whether to incorporate external
protections (in addition to the built-in internal protections already present). b) Dead-time:
The ability of the driver to introduce a dead time in order to have to incorporate or not an
additional external circuit that takes care of it will be considered. c) Isolation: Depending on
the application specifications, the required isolation between high-voltage and low-voltage
zones will be taken into account. d) Number of channels: some drivers are able to fire just
one device, whereas other drivers can fire two or even three. e) Output current: it may be
necessary to incorporate current-amplifying stages that guarantee the fast switching of the
devices, thus avoiding excessive switching losses.
T6.3. Simulation and design of protection systems. This subtask will perform
simulations of the protection circuits, such as "desaturation protection", "active Miller
clamping", "active clamping", "gate clamping", etc. These protections will be merged with
those that are likely to be already present in the selected drivers (UVLO, overtemperature,
suppressor of glitches produced by electromagnetic noise, etc.). The simulation will
consider the semiconductors themselves, operating frequencies, parasitic effects of the
converter, etc. The protection systems will be designed according to the simulation results
obtained.
T6.4. Component selection for the driver stage. Considering the requirements of each
firing stage, the following components will be selected: a) Isolated drivers (as a function of
the switching frequency of the application, propagation times, consumption, output current
values, power per modulation period to be delivered to the semiconductor gates, intrinsic
protections of the integrated circuit, etc.); b) Isolated DC / DC sources; c) Fault-processing
circuits; d) Ancillary circuitry for dead-time generation (if the topology of the converter so
requires); e) Design of auxiliary circuitry for the correct operation of the input supplies of
isolated DC / DC sources, drivers, etc. so that the semiconductors operate in safe
switching zones and out of the linear area; e) Design of auxiliary circuitry for the
acquisition of voltage, current and temperature values provided by the respective sensors.
T6.5. Design, manufacturing and validation of printed circuit boards. In the design of
power modules, the printed circuit board (PCB) constitutes a critical element from four
perspectives: electrical, thermal, electromagnetic and reliability. The characteristics
imposed in this type of electronic design makes it necessary to thoroughly study and
model the PCB, so that all such four aspects can be evaluated and traded off. From an
electrical point of view, not only must the electrical connectivity be guaranteed, but the
model must also provide accurate information on the introduced parasitic elements
(capacitive and inductive), effects such as irregular current density distribution, e.g. skin
effect, and others. Then, the generated PCB model will also make it possible to determine
the thermal and electromagnetic behavior of the circuit. Finally, it is important to point out
that the required manufacturing processes will not be standard yet, since the techniques
and materials involved differ from those of normal consumer electronics, and are critical in
the reliability of the design. Therefore, an exhaustive study of such processes is required,
which will influence the design solutions adopted.
M6.1. Design, manufacturing and validation of a specific driver board aimed at WBG
devices.
D6.2. Simulation model of the power module and driver PCB set using ADS.
T9.1 Integration of the EV converter with the elements comprising the EV propulsion
system (battery and motor). Once all the constituent parts of the power converter have
been assembled, the next step will be to integrate it with the most important elements that
make up the electric propulsion system, such as the battery and the electric machine. This
integration will be carried out at the Tecnalia facilities. This technological center, with
which the research group collaborates, has the infrastructure to carry out these last tests.
In addition, the control of the converter will be done using the RCP platform developed in
T8.3, where the modulation techniques and control strategies developed in T4.1 and T4.3,
respectively, will be implemented. The result of this integration will be a demonstrator that
will allow experiencing EV propulsion-related aspects.