Advances in Interconnect Technologies: An International Journal (AITIJ)

https://airccse.com/aitij/index.html

Scope & Topics

Advances in Interconnect Technologies: An International Journal (AITIJ) invites original and

significant contributions relating to the theory, design, performance and reliability of interconnect,
including materials, analysis, modeling and simulation of interconnect. The journal proposes to stimulate
the development of latest technology in industry and academia. High quality review papers and short
communications are also acceptable.

Research areas suitable for publication include, but are not limited to the following fields:

Topics of interest include, but are not limited to, the following

 Emerging Materials
 CNT/ Graphene Interconnects
 Modeling and Simulation
 Testing
 RFIC
 Optical Interconnects
 Wireless Interconnects
 Microstrip Lines
 Analog and Mixed Signals
 Dedicated Software and Systems for Developing Interconnect Technology
 On-Chip and Off-Chip Interconnects
 EMC/EMI
 FPGA/ASICs
 Fabrication Techniques
 Neural Networks
 Parasitics Issues
 Optimization Techniques

Paper Submission

Authors are invited to submit papers for this journal through Email aitijjournal@airccse.com or
Submission System. Submissions must be original and should not have been published previously or be
under consideration for publication while being evaluated for this Journal.

Important Dates

 Submission Deadline   : June 05, 2021 

 Notification                    : July 05, 2021 
 Final Manuscript Due    : July 13, 2021
 Publication Date            : Determined by the Editor-in-Chief 

Contact Us

Here's where you can reach us: aitijjournal@yahoo.com or aitijjournal@airccse.com