Introduction to

Nanoscience and
Nanotechnology
LECTURE 7

Dr. Lutfiye Altay

Ege University
Mechanical Engineering Dept.
2019-2020 Spring
INTEGRATED CIRCUIT ? "Microchip" "Silicon chip"

is a set of electronic circuits on one small plate ("chip") of semiconductor

material, normally silicon
ICs can be made very compact, having
up to several billion transistors and
other electronic components in an area
the size of a fingernail. The width of
each conducting line in a circuit can be
made smaller and smaller as the
technology advances; in 2008 it dropped
below 100 nanometers, and now is tens
of nanometers.
 A photoresist is a light-sensitive material used in
photolithography to form a patterned coating on a
surface

A positive resist is a type of photoresist in A negative resist is a type of photoresist

which the portion of the photoresist that is in which the portion of the photoresist
exposed to light becomes soluble to the that is exposed to light becomes
photoresist developer insoluble to the photoresist developer
Different chemicals may be used for permanently
giving the material the desired property variations:

Poly(methyl methacrylate) (PMMA)

Poly(methyl glutarimide) (PMGI)
Phenol formaldehyde resin (DNQ/Novolac)
SU-8 Epoxy-based polymer: it is very difficult to strip and used in applications
where a permanent resist pattern (one that is not strippable, and can even
be used in harsh temperature and pressure environments) is needed for a
device.

The above materials are all applied as a liquid and,

generally, spin-coated to ensure uniformity of
thickness.
Spin coating is a procedure used to It is used intensively in
deposit uniform thin films to flat photolithography, to deposit layers of
substrates photoresist about 1 micrometre thick

-- a small amount of coating material is applied on the center of the

substrate
-- substrate is then rotated at high speed in order to spread the coating
material by centrifugal force
-- Rotation is continued while the fluid spins off the edges of the
substrate, until the desired thickness of the film is achieved

The applied solvent is usually volatile, and simultaneously evaporates. So, the
higher the angular speed of spinning, the thinner the film. The thickness of the
film also depends on the viscosity and concentration of the solution and the
solvent.
Spin coating theory
Possible problems:
Film too thin Uncoated Areas
Film too thick Insuffcie
nt
Air bubbles on wafer surface Dispense
Volume
Comets, streaks or flares

Resist sits on wafer too long prior to spin

Spin speed and acceleration setting is too high
 Spin coating theory

https://www.youtube.com/watch?v=v178jtHsfFM