Professional Documents
Culture Documents
LIG HT: Ф3Mm / 8×8 /1.1 Inch (28Mm) Super Red Dot Matrix
LIG HT: Ф3Mm / 8×8 /1.1 Inch (28Mm) Super Red Dot Matrix
LIG HT: Ф3Mm / 8×8 /1.1 Inch (28Mm) Super Red Dot Matrix
A-1088BS
FEATURES
※ 1.1 inch (28.0mm) matrix height.
※ Low power requirement, solid state reliability.
※ Multicolor available, stackable horizontally.
※ Categorized for luminous intensity.
※ Easy mounting on P.C. boards.
※ Remain within RoHS compliant version.
HT
APPLICATION
※ Digital readout display
※ Instrument pancls
※ Elevator
※ Audio epuipment
Ordering Information
G
LI
Luminous Intensity IV (µcd)
Part Emission Face Bin (IF=10mA)
Number Color Color Code
Min. Typ. Max.
2012-5-27 1 Rev -
HT
Electrical / Optical Characteristics (1)
(TA = 25 ºC)
Parameter Symbol Value Unit
Wavelength at peak
(Typ.) λP 635 nm
emission
Dominant wavelength
IF = 20mA
Spectral bandwidth at 50%
IF = 20mA
Viewing angle at 50%
(Typ.)
(Typ.)
G λD
Δλ
-
20
nm
nm
LI
(Typ.) 2θ1/2 - degree
IF = 20mA
(Min.) VF 1.8 V
Forward voltage
(Typ.) VF 2.1 V
IF = 20mA
(Max.) VF 2.4 V
Reverse current
P
(Max.) IR 20 µA
VR = 5V
Optical efficiency
(Typ.) ηOPT - lm/W
IF = 20mA
TO
2012-5-27 2 Rev -
HT
G
LI
P
TO
°
°
2012-5-27 3 Rev -
HT
TOP LIGHT
A-1088BS
-S-
09C3
G
LI
P
TO
Notes:
1. All dimensions are in millimeters. Tolerance is +/-0.25 unless otherwise noted.
2. The specifications, characteristics and technical data described in the datasheet are subject to change
without prior notice.
2012-5-27 4 Rev -
HT
2 . Through the Wave Soldering Conditions
Wave Soldering Profile For Lead-free Through-hole LED
G
LI
3 . Soldering General Notes:
a. Toplight recommend manual soldering to be used only for repair and rework purposes. The soldering iron should
P
not exceed 30W in power. The tip of the soldering iron should not touch the reflector case to avoid heat-damage.
b. Maintain the pre-heat and peak temperatures with dip units as low as possible and the times as short as is feasible,
since the pproducts are susceptible
p to heat duringg flow soldering.
g
TO
c. After soldering, allow at least three minutes for the component to cool to room temperature before further
operations.
d. If components will undergo multiple soldering processes, or other processes where the components may be
subjected to intense heat, please check with Toplight for compatibility.
2012-5-27 5 Rev -