Professional Documents
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Service Manual: UBP-X800 / UBP-UX80 / UBP-X1000ES
Service Manual: UBP-X800 / UBP-UX80 / UBP-X1000ES
RMT-VB310U / RMT-VB310E
SERVICE MANUAL
Ver. 1.2 2017.04
US, Canadian Model
US Model
AEP Model
UK Model
Australian Model
UBP-X800
RDCM © 2017.04
9-930- 450-13 Home Entertainment Business Group Published by Manual design dept.
Specifications : UBP-X800 EC1/CEK/AU2
Specifications and design are subject to change without notice.
System
Laser Semiconductor laser
Wireless
Wireless LAN standard Protocol IEEE802.11 a/b/g/n
Frequency range 2.4 GHz, 5 GHz band
Modulation DSSS and OFDM
Bluetooth Version Bluetooth Specification v4.1
Bluetooth
Communication system Bluetooth Specification v4.1
Output Bluetooth Specification Power Class 1
Maximum communication
range Line of sight approx. 30 m
Frequency band 2.4 GHz
Modulation method FHSS
Compatible Bluetooth Profiles A2DP v1.2, AVRCP v1.3
Supported Codecs SBC, AAC, LDAC
Transmission range (A2DP) •20 Hz - 40,000 Hz (LDAC in sampling 96 kHz and
transmit by 990 kbps)
•20 Hz - 20,000 Hz (in sampling 44.1 kHz)
General
Power requirements Rating: Input 220 V - 240 V AC, 50/60 Hz
Power consumption 15 W
Network standby Less than 2 W (all wired/wireless network ports ON)
Dimensions (approx.) 430 mm × 265 mm × 50 mm
(width × depth × height) incl. projecting parts
Mass (approx.) 3.8 kg
Operating temperature 5 ºC to 35 ºC
Operating humidity 25 % to 80 %
ii
Specifications : UBP-UX80/X800 U2/UC2 .
Specifications and design are subject to change without notice.
System
Laser Semiconductor laser
Wireless
Wireless LAN standard Protocol IEEE802.11 a/b/g/n
Frequency range 2.4 GHz, 5 GHz band
Modulation DSSS and OFDM
Bluetooth Version Bluetooth Specification v4.1
Bluetooth
Communication system Bluetooth Specification v4.1
Output Bluetooth Specification Power Class 1
Maximum communication
range Line of sight approx. 30 m
Frequency band 2.4 GHz
Modulation method FHSS
Compatible Bluetooth Profiles A2DP v1.2, AVRCP v1.3
Supported Codecs SBC, AAC, LDAC
Transmission range (A2DP) •20 Hz - 40,000 Hz (LDAC in sampling 96 kHz and transmit
by 990 kbps)
•20 Hz - 20,000 Hz (in sampling 44.1 kHz)
General
Power requirements Rating: Input 120 V AC, 60 Hz
Power consumption 15 W
Dimensions (approx.) 430 mm × 265 mm × 50 mm (17 in. × 10 1/2 in. × 2
in.) (width × depth × height) incl. projecting parts
Mass (approx.) 3.8 kg (8 lb 2/5 oz)
Operating temperature 5 ºC to 35 ºC (41 ºF to 95 ºF)
Operating humidity 25 % to 80 %
iii
Specifications : UBP-X1000ES UC2
Specifications and design are subject to change without notice.
System
Laser Semiconductor laser
Wireless
Wireless LAN standard Protocol IEEE802.11a/b/g/n
Frequency range 2.4 GHz, 5 GHz band
Modulation DSSS and OFDM
Bluetooth Version Bluetooth Specification v4.1
Bluetooth
Communication system Bluetooth Specification v4.1
Output Bluetooth Specification Power Class 1
Maximum communication Line of sight approx. 30 m
range
Frequency band 2.4 GHz
Modulation method FHSS
Compatible Bluetooth Profiles A2DP v1.2, AVRCP v1.3
Supported Codecs SBC, AAC, LDAC
Transmission range (A2DP) •20 Hz - 40,000 Hz (LDAC in sampling 96 kHz and transmit
by 990 kbps)
•20 Hz - 20,000 Hz (in sampling 44.1 kHz)
General
Power requirements Rating: Input 120 V AC, 60 Hz
Power consumption 17 W
Dimensions (approx.) 430 mm × 265 mm × 54 mm (17 in. × 10 1/2 in. × 2 1/4 in.)
(width × depth × height) incl. projecting parts
Mass (approx.) 3.9 kg (8 lb 3/5 oz)
Operating temperature 5 ºC to 35 ºC (41 ºF to 95 ºF)
Operating humidity 25 % to 80 %
iv
2 Specifications : UBP-X1000ES EC1
Specifications and design are subject to change without notice.
System
Laser Semiconductor laser
Wireless
Wireless LAN standard Protocol IEEE802.11a/b/g/n
Frequency band 2.4 GHz, 5 GHz band
Frequency range / Output • 2,400 - 2,483.5 MHz / < 20.0 dBm
Power • 5,150 - 5,250 MHz / < 20.0 dBm
• 5,250 - 5,350 MHz / < 20.0 dBm
• 5,470 - 5,725 MHz / < 20.0 dBm
Modulation DSSS and OFDM
Bluetooth Version Bluetooth Specification v4.1
Bluetooth
Communication system Bluetooth Specification v4.1
Output Bluetooth Specification Power Class 1
Maximum communication Line of sight approx. 30 m
range
Frequency band 2.4 GHz
Frequency range / Output
2,400 - 2,483.5 MHz / < 20.0 dBm
Power
Modulation method FHSS
Compatible Bluetooth Profiles A2DP v1.2, AVRCP v1.3
Supported Codecs SBC, AAC, LDAC
Transmission range (A2DP) •20 Hz - 40,000 Hz (LDAC in sampling 96 kHz and transmit
by 990 kbps)
•20 Hz - 20,000 Hz (in sampling 44.1 kHz)
v
General
Power requirements Rating: Input 220 V -240 V AC, 50/60 Hz
Power consumption 17 W
Network standby Less than 2 W (all wired/wireless network ports ON)
Dimensions (approx.) 430 mm × 265 mm × 54 mm.
(width × depth × height) incl. projecting parts
Mass (approx.) 3.9 kg
Operating temperature 5 ºC to 35 ºC
Operating humidity 25 % to 80 %
Software version M37.R.___
This radio equipment is intended to be used with the
approved
version(s) of software that are indicated in the EU
Declaration of Conformity. The software loaded on this
radio equipment is verified to comply with the essential
requirements of the Directive 2014/53/EU.
Refer to [System Information] in [System Settings] to know
the
software version.
vi
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer:
1. Check the area of your repair for unsoldered or poorly- LEAKAGE TEST
soldered connections. Check the entire board surface for The AC leakage from any exposed metal part to earth
solder splashes and bridges. ground and from all exposed metal parts to any exposed
2. Check the interboard wiring to ensure that no wires are metal part having a return to chassis, must not exceed 0.5
“pinched” or contact high-wattage resistors. mA (500 microamperes). Leakage current can be measured
3. Look for unauthorized replacement parts, particularly by any one of three methods.
transistors, that were installed during a previous repair. 1. A commercial leakage tester, such as the Simpson 229 or
Point them out to the customer and recommend their RCA WT-540A. Follow the manufacturers' instructions to
replacement. use these instruments.
4. Look for parts which, though functioning, show obvious 2. A battery-operated AC milliammeter. The Data Precision
signs of deterioration. Point them out of the customer and 245 digital multimeter is suitable for this job.
recommend their replacement. 3. Measuring the voltage drop across a resistor by means of
5. Check the line cord for cracks and abrasion. Recommend a VOM or battery-operated AC voltmeter. The “limit”
the replacement of any such line cord to the customer. indication is 0.75V, so analog meters must have an accurate
6. Check the B+ voltage to see it is at the values specified. low-voltage scale. The Simpson 250 and Sanwa SH-63Trd
7. Check the antenna terminals, metal trim, “metallized” are examples of a passive VOM that is suitable. Nearly all
knobs, screws, and all other exposed metal parts for AC battery operated digital multimeters that have a 2V AC
leakage. Check leakage as described below. range are suitable. (See Fig. A)
CAUTION:
The use of optical instrument with this product will increase
eye hazard.
CAUTION
Use of controls or adjustments or performance of
procedures other than those specified herein may result in
hazardous radiation exposure.
CAUTION!
TO PREVENT ELECTRICAL SHOCK, CAPACITOR (C107
AT POWER SUPPLY BOARD) MUST BE DISCHARGED
BEFORE HANDLING ELECTRICAL COMPONENT.
WARNING!! Unleaded solder
WHEN SERVICING, DO NOT APPROACH THE LASER Boards requiring use of unleaded solder are printed with the
EXIT WITH THE EYE TOO CLOSELY. IN CASE IT IS leadfree mark (LF) indicating the solder contains no lead.
NECESSARY TO CONFIRM LASER BEAM EMISSION, (Caution: Some printed circuit boards may not come printed
BE SURE TO OBSERVE FROM A DISTANCE OF MORE with the lead free mark due to their particular size.)
THAN 25 cm FROM THE SURFACE OF THEOBJECTIVE : LEAD FREE MARK
LENS ON THE OPTICAL PICK-UP BLOCK. Unleaded solder has the following characteristics.
SAFETY-RELATED COMPONENT WARNING!! • Unleaded solder melts at a temperature about 40°C higher
COMPONENTS IDENTIFIED BY MARK OR DOTTED LINE than ordinary solder.
WITH MARK ON THE SCHEMATIC DIAGRAMS AND IN Ordinary soldering irons can be used but the iron tip has to
THE PARTS LIST ARE CRITICAL TO SAFE OPERATION. be applied to the solder joint for a slightly longer time.
REPLACE THESE COMPONENTS WITH SONY PARTS Soldering irons using a temperature regulator should be set
WHOSE PART NUMBERS APPEAR AS SHOWN IN THIS to about 350°C.
MANUAL OR IN SUPPLEMENTS PUBLISHED BY SONY. Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
ATTENTION AU COMPOSANT AYANT RAPPORT
• Strong viscosity
À LA SÉCURITÉ!
Unleaded solder is more viscous (sticky, less prone to flow)
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE
than ordinary solder so use caution not to let solder bridges
SUR LES DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES
occur such as on IC pins, etc.
PIÈCES SONT CRITIQUES POUR LA SÉCURITÉ DE
• Usable with ordinary solder
FONCTIONNEMENT. NE REMPLACER CES COMPOSANTS
It is best to use only unleaded solder but unleaded solder
QUE PAR DES PIÈSES SONY DONT LES NUMÉROS SONT
may also be added to ordinary solder.
DONNÉS DANS CE MANUEL OU DANS LES SUPPÉMENTS
PUBLIÉS PAR SONY.
vii
TABLE OF CONTENTS
1. SERVICE NOTE Page
1.1 Disc Removal Procedure If The Tray
Cannot Be Ejected (Forced Ejection) .................................. 1-1
1-2. Work when optical device are replaced ...................... 1-1
1-3. Test Disc ....................................................................... 1-2
1-3-1. Operation and Display............................................... 1-2
1-3-2. Disc Information (ULX-301) ...................................... 1-3
1-4. Drive Repairing ............................................................ 1-4
1-4-1. Preparation............................................................... 1-4
1-4-2. Checking Flow ~ Drive (BU) section ~ ...................... 1-4
1-4-3. BU (Optical Unit) Check Flow [zz] ~ ......................... 1-4
1-4-4. BU Repair Guide ...................................................... 1-5
1-4-5. BU Adjustment Flow [yy] ~ ..................................... 1-5
1-4-6. KEM-481AAA/C2RP2 Packing Spec ......................... 1-6
1-4-7. BU Data Decode Jig.................................................. 1-7
1-4-8. MD (Mechanical Deck) Assy for Service ................. 1-8
1-4-9.Laser Caution Label .................................................. 1-8
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................ 2-1
2-2. Side Panel And Top Panel ............................................ 2-1
2-3. Top Chassis .................................................................. 2-2
2-4. Front Panel, FR-1602 Board and FC-1603 Board ....... 2-2
2-5. Bluetooth, Wifi and Switching Regulator Board ........ 2-3
2-6. MB-1601 Board ............................................................ 2-3
2-7. BD Drive ....................................................................... 2-4
2-8. AN-1605 Board ………………..…………………………………….. 2-4
2-9.FFC/Harness Caution Point……………………………………… 2-5
3. BLOCK DIAGRAMS
3-1. Frame Harness ............................................................ 3-1
3-2. Overall Block Diagram ................................................. 3-2
3-3. Power Block Diagram (UBP-X800/UX80) ................... 3-3
3-4. Power Block Diagram (UBP-X1000ES) ........................ 3-4
viii
TABLE OF CONTENTS
Page
6. TROUBLESHOOTING
6-1. Main Flowchart …………………………………………………….. 6-1
6-2. Power System Flowchart ………………………………………. 6-2
6-3. Remote Control Flowchart ……………………………………. 6-3
6-4 FR Board Flowchart ……………………………………………….. 6-3
6-5. FC Board Flowchart ………………………………………………. 6-3
6-6. Video Section Flowchart ……………………………………….. 6-4
6-7. Audio (SPDIF) Section Flowchart ……………….………….. 6-5
6-8. Audio (Analog) Section Flowchart …………..…………….. 6-6
6-9. Drive Flowchart …………………………………………………….. 6-7
6-10. Ethernet Flowchart …………………………………………….. 6-8
6-11. Wifi Flowchart …………………………………………………….. 6-8
6-12. USB Device Flowchart …………………………………………. 6-9
ix
SECTION 1
SERVICE NOTE
1-1. DISC REMOVAL PROCEDURE IF THE TRAY CANNOT BE EJECTED (FORCED EJECTION)
1. Remove the side panel left. (Refer to page 2-1 in Disassembly section)
2. Insert a pin or clip in the hole of a drive to open the tray.
❷ Tray open
Application Software
UHDBUDecode.exe
Data convert from JPEG TEXT
USB memory is connected to USB port on
the front unit, and the TEXT data as new
data is loaded to unit by Service Mode
A
1-1
1-3. TEST DISC
J-2501-307-A CD (HLX-A1)
1) ULX-301 (Ultra HD Blu-ray disc) with triple layer (L0, L1, L2)
1. No disc Menu; auto playback chapter 1 press <option>
2. Play chapter 1 : Content C Color bar 100% (L0)
3. Play chapter 20 : Content A with Bouncy music (L1) press <option>
4. Play chapter 21 : Content A with Bouncy music (L2)
4) CD HLX-A1
Check whether player can play back or not (Check the sound output)
1-2
1-3-2 Disc Information (ULX-301)
Basic specification:
Video : H.265/HEVC 3840 x 2160p 59.94Hz
Audio : 48kHz 16bit Linear PCM 1.536Mbps 2.0ch
TS bit rate : approx. 106Mbps
Characteristic chapters :
C01 : Low TR (34Mbps) at maximum velocity (inner area) with 100% color bar
C10 : Low TR (79Mbps) at minimum velocity (outer area) with Live Action Image
C21-C22 : TR sudden change / C21 low TR (79Mbps inner restricted area) to C22 High TR (112Mbps)
C31 : High TR (121 Mbps) at minimum velocity
1-3
1-4. DRIVE REPAIRING
1-4-1. Preparation
ESD Measures
It is necessary to check the working space ESD condition before starting the Drive Optical Unit or BU repairs.
The ESD-resistance of BD Laser is weaker than DVD/CD Laser.
As prevention of ESD destruction, please make sure the working space and human ESD.
YES
Optical Unit (BU) : OK
Before BU Replacement Optical Unit (BU) IOP check fl ow [zz] ~ Before BU Replacement
*Drive
Select - [7] OP Check Menu
IOP NO
judge
AC Power OFF
1-4
1-4-4. Optical Unit (BU) Repair Guide
•JIG Requirement
• Digital camera (recommend with macro mode)
• Barcode decoder (UHDBUDecode.exe) installed in JIG PC’s
• USB memory
• ESD work bench
•Procedure (all cases) refer the diagram 1.4-5 BU Adjustment Flow [yy]
Remarks:
LD ON TIME history does not carry over after change BU
LD ON TIME will be reset to 0 for all BD, DVD and CD laser hour
DO NOT touch any optical block parts, turn table during replacing
BU Laser Diode is very sensitive
B AC Power ON
HOME Enter Service Mode
Select [8] Drive
The following cases need OP Data Write: Select [7] OP Check Menu
(1) Replace BU (MB is original) Select [3] dIOP
(2) Replace MB (BU is original)
(3) Replace b oth BU and MB Check dIOP for BD, DVD and CD
dIOP in specification
JIG requirement Turn AC Power OFF
• Digital camera (with macro mode)
• Barcode decoder (UHDBUDecode.exe) installed in jig AC Power ON
• PC’s (jig purpose) USB memory Check playback performance BD : BLX-104 DVD : HLX-513
• ESD free work bench BD, DVD and CD CD : HLX-A1
1-5
1-4-6. KEM-481AAA/C2R single part packing
O pen the box Take out Top Cushion
❶ ❷ ❸
❹ ❺ T ake out BU ❻
‘Hol ding area’
M an u al
i n s t r u c t i on
C u s h i on c ar t on
C h am f er c u t
f ac i n g f r on t
I n d i vi d u al
c ar t on
P P t ap e
S h i p m en t l ab el
1-6
1-4-7. BU Data Decode Jig
• Software requirements :
Windows 7 OS ( Require Microsoft Framework 4.0)
Microsoft Office 2007 and above ( Require MS Office 12.0 Object Library)
• Installation methods :
Unzip File KEM-481BUDecode Soft.Zip to Desktop
Main execute file is KEM-481BUDecode.exe
• Method to use :
Place BU 2D barcode photo (jpg file) into ‘KEM-481 BUDecode Soft’ folder
Execute ‘KEM-481BUDecode.exe ‘(double click)
Press button ‘Open File’ to select BU 2D barcode photo
Soft display 64 & 91 BU decoded data and disable “Open File” button
User require to close and re-execute the soft for next decoding
Converted OP Data will be auto save at C:\BuData.txt
• Remarks :
Do not change the decoded file name “BuData.txt”.
1-7
1-4-8. MD (Mechanical Deck) Assy for Service
MD Assy service parts consists of 2 parts.
① Holder Assy, Chuck (CI-J) (A-2166-303-A)
② Loading Assy (A-2143-751-A)
Above service part ① & ② can be used for both UBP-X800/UX80 and UBP-X1000ES model.
Tape
Dressing, FFC
A new Holder Assy, Chuck (CI-J) part do not have Laser Caution Label.
Need to reuse the original Laser Caution label and paste it on top of new Holder Assy, Chuck (CI-J) .
Limit Sample
Following peel off position are acceptable
1-8
SECTION 2
DISASSEMBLY
This set can be disassembled in the order shown below.
SET
2-1
1
2-3. TOP CHASSIS
1. Eleven Screw +BVTP 3X8 TYPE2 IT-3
(tightening torque = 6.5 to 7.5kgf.cm)
3. Chassis, Top
4. Panel, Front
7.*FC-1603 Board
Note:
1) * - For UBP-X1000ES model only.
2) Hameron Tape is used to stick FFC/Harness to chassis.
Please attach Hameron tape at original location when
reassemble FFC/Harness.
2-2
2
2-5. BLUETOOTH, WiFi AND SWITCHING REGULATOR BOARD
Caution:
15. Heat Dissipation sheet is reusable, To keep Hi-Res Audio and EMC
must be in position before Requirement use only the correct
reassemble WiFi Board screw at its intended location
1. Two Screw +BVTP 3X8 TYPE2 IT-3 2. Two Screw (+BV 3X8 CU)
(tightening torque = 6.5 to 7.5kgf.cm) (tightening torque = 8.5 to 9.5kgf.cm)
Note:
1) * - For UBP-X1000ES model only.
2) Hameron Tape is used to stick FFC/Harness to chassis.
Please attach Hameron tape at original location when
reassemble FFC/Harness.
2-4
4
2-9 FFC /HARNESS CAUTION POINT
< OK >
CENTER OF
SCREW
Hemaron tape
(30x5mm)x4pcs
20mm
< NG >
CENTER OF
2 HOLES
*Hemaron tape
(30x5mm)x1pcs
Figure : 2-9-1
COVER CONNECTOR
HOLE
TEFLON TAPE
EMI TAPE
Figure : 2-9-2
Note:
1) * - For UBP-X1000ES model only.
2) Hameron Tape is used to stick FFC/Harness to chassis.
Please attach Hameron tape at original location when
reassemble FFC/Harness.
2-5
5
SECTION 3
BLOCK DIAGRAMS
Note:
* = For UBP-X1000ES
Harness
model only
PS (Power Block)
Harness*
WIFI/BT
Harness
FR
FFC 13P
MB
FFC 15P*
FC*
FFC 5P
FFC 17P*
FFC 9P
FFC 45P
3-1
3-2. OVERALL BLOCK DIAGRAM : UBP-X800/UX80/X1000ES
MB-1601 X1203
25MHz For UBP-X1000ES model only* Note:
IC1301 IC1202
* = For UBP-X1000ES
IC1402 IC1401 model only
4K BD Motor CXD90048 Ext. MAX CN1403
DRIVE Driver EQ
CPU 3222 RS232C AN-1605*
IC1808
IC1002
Selector ADAC
DDR3
J701
B-BUS A-BUS IR IR IN IC1807
IC201 IC102 J1802 J1801
IC202 IC103
C-BUS
IC101 J1001
IC301 (CXD90049GG-BA) Coaxial
SPDIF LEFT RIGHT
CN1102
HDMI HDMI 2 (V1.4)
IC802
4G SW12VAU
NAND CN1101 SW-12VAU
FC-1603* FLASH HDMI HDMI 1 (V2.0)
ND300 X601
VACCUM 27MHz CN901
FLUORESCET LAN (100) P0WER BLOCK
ETHERNET
DISPLAY
REGULATOR PS401
DC AC
PS402
FR-1602
IR UNSW1.8V SW1.8V
IC401 IC409 IC403
~ 12V 240V/110V (AC IN)
MT7662U
DDR1
Q506 SW3.3V_BTW BT/WLAN
PCONT3#/
PCONT4
PCONT3#
VREF_0.75V
Voltage Divider DDR2
2.2uH
UNSW12V PS401
DCDC1.5V L404 DDR_1.5V
3.15A
IC403 UNSW3.3V SW3.3V
TPS54295PWPR
DCDC3.3V L401 Q410
DVDD_CORE
TI (2A/2A) 2.2uH
DDR3
PCONT2#
PCONT5
1.0uH
DCDC1.0V L406
IC409 CORE_1.0V CORE1.0V
AOZ1267QI
AOS (8A)
DDR4
PCONT1# UNSW3.3V
SW3.3V
2.2uH DDR5
UNSW1.8V SW1.8V
DCDC1.8V L402 Q406
IC401 SoC
MP1471A
MPS (3A) PCONT1#/ CXD90048GG-BA
PCONT2#
COAXIAL
NAND Flash
UNSW1.8V
2.2uH
UNSW2.5V UNSW1.05V
POWER DCDC2.5V L405 1.05V Reg
IC406
MP1471A
SUPPLY MPS (3A)
IC408
BD00IA5WEFJ
UNIT Rohm (0.5A) FE_A3.3V
F/E
2.2uH FE_D3.3V CXD90049EQ
SW5V
IC501
DCDC5V L501
MP1471A FE_D3.3V
MPS (3A)
PCONT2#
MOTOR DRIVER
FE_SW5V_M
HDMI1 TPIC2060A
5V Reg
IC1102 CONNECTOR FE_SW12V_M
MM1839A50NRE
Mitsumi (0.2A) PCONT2#
FE_SW5V_A
HDMI2
CONNECTOR OPU
FE_SW12V_OPU 8V Reg KEM-481AAA
IC1201
MM1890A80NRE
Mitsumi (0.3A)
Q705 LED
LED PCONT
IC901
IR
TPS2065CDBVR
USB PCONT
SW5V
Reset/Delay Circuit
UNSW12V PGOODV PGOODV PGOODV
UNSW3.3V UNSW12V UNSW1.8V UNSW12V
UNSW12V
3-3
3-4. POWER BLOCK DIAGRAM (UBP-X1000ES)
MT7662U
DDR1
Q506 SW3.3V_BTW BT/WLAN
PCONT3#/
PCONT4
PCONT3#
VREF_0.75V
Voltage Divider DDR2
UNSW12V PS401 2.2uH
DCDC1.5V L404 DDR_1.5V
3.15A
IC403 UNSW3.3V SW3.3V
TPS54295PWPR
DCDC3.3V L401 Q410
2.2uH DVDD_CORE
TI (2A/2A)
DDR3
PCONT2#
PCONT5
1.0uH
DCDC1.0V L406
IC409 CORE_1.0V CORE1.0V
AOZ1267QI
AOS (8A)
DDR4
PCONT1# UNSW3.3V
SW3.3V
2.2uH DDR5
UNSW1.8V SW1.8V
DCDC1.8V L402 Q406
IC401
MP1471A
MPS (3A) PCONT1#/
PCONT2#
SoC
RS232C
CXD90048GG-BA
SICON
STM32F030
NAND Flash
OPTICAL
UNSW1.8V
2.2uH
UNSW2.5V UNSW1.05V
DCDC2.5V L405 1.05V Reg
IC406
MP1471A IC408
POWER MPS (3A) BD00IA5WEFJ
Rohm (0.5A)
SUPPLY FE_A3.3V
F/E
UNIT 2.2uH FE_D3.3V CXD90049EQ
SW5V
IC501
DCDC5V L501
MP1471A FE_D3.3V
MPS (3A)
PCONT2#
MOTOR DRIVER
FE_SW5V_M
HDMI1 TPIC2060A
5V Reg
IC1102 CONNECTOR FE_SW12V_M
MM1839A50NRE
Mitsumi (0.2A) PCONT2#
FE_SW5V_A
HDMI2
CONNECTOR OPU
FE_SW12V_OPU 8V Reg KEM-481AAA
IC1201
MM1890A80NRE
FR_SW12V Mitsumi (0.3A)
Q413
PCONT4/
PCONT2#
Q101
Charge pump
AN_5V Q411 0.8A
PS701
PCONT1#/ ND101
PS702
PCONT2# REG CIG VFD
1A
IC1809/1810
MM1839A50NRE PCONT4/
3.3V Reg
PCONT2#
5V Reg 2 CH DAC
SW+12VAU
AK4452
+12V +7V Reg 5V Reg
IC1805/1806 IR
+12V SW KIA7807API
IC901
TPS2065CDBVR
-12V -7V Reg IC1800
SW-12VAU NJM458 LPF USB SW FRONT USB
PCONT4#/
PCONT2#
IC1801 USB PCONT
NJM458 LPF
SW5V
Reset/Delay Circuit
UNSW12V PGOODV PGOODV PGOODV
UNSW3.3V UNSW12V UNSW1.8V UNSW12V
UNSW12V
3-4
(Mitsumi)
4‐1. THIS NOTE IS COMMON FOR PRINTED WIRING BOARDS
• : Uses unleaded solders.
• : Pattern from the side which enables seeing.
(The other layers’ patterns are not indicated)
Caution:
Pattern face side: Parts on the pattern face side seen from
(SIDE B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(
(SIDE A)) the parts face are indicated.
h f d d
• Through hole is omitted.
• There are few cases that the part printed on diagram isn’t
mounted in this model.
• : panel designation
• Chip parts.
4‐1
4-2 . *AN-1605 BOARD PRINTED WIRING BOARD
(SIDE A)
4-2
4-3 . *AN-1605 BOARD PRINTED WIRING BOARD
(SIDE B)
4-3
4-4 . *FC-1603 PRINTED WIRING BOARD
(SIDE A)
4-4
4-5 . *FC-1603 PRINTED WIRING BOARD
(SIDE B)
4-5
4-6 . FR-1602 PRINTED WIRING BOARD
(SIDE A)
4-6
4-7 . FR-1602 PRINTED WIRING BOARD
(SIDE B)
4-7
4-8 . MB-1601 PRINTED WIRING BOARD
(SIDE A)
4-8
4-9 . MB-1601 PRINTED WIRING BOARD
(SIDE B)
4-9
4-10. UBP-X800 Power Block (SRV2497WW)
A SIDE
B SIDE
4-10
4-11. UBP-X1000ES Power Block (SRV2513WW)
A-side
B-side
4-11
SECTION 5
SERVICE MODE AND ERROR LOG LIST
Main function
While sending of SIRCS code, wait time between each key code must be within 3 second. If 3 second waiting is exceeded user have to
re-key in the SIRCS code.
If SIRCS enter is successful, set will auto boot up and FLD will display SERVC [FLD available MODEL]. The screen of service mode is
displayed on a monitor.
Control via Remote Controller
• Diag
The unit test of the device mounted on the MainBoard.
• Factory Initialize
Return all of the player setting to their factory defaults.
• Network
Confirm Wired Network connection.
• System Information
System information of the set is displayed.
The Information on a soft version and drive information, etc. is displayed.
• Drive
Write Drive OP Data and check drive.
5-1
Function Support List
Service Mode UBP-X800 /
(Top) Category Device UBP-UX80 UBP-X1000ES
1 Diag 1 Device Test 1 USB X X
2 D/A Converter √ √
3 IF CON X X
*FDP all ON X X
*Show Strings X X
*LED Sequantial ON X X
*Fan Control ON X X
4 MIC X X
5 MFI X X
6 IPC X X
7 External HDMI X X
8 Transcorder X X
2 Video Test √ √
3 Audio Test √ √
4 Audio Input Test X X
5 Wireless LAN Test X X
6 Mic Test X X
7 HDMI Input Test X X
8 Transcoder Test X X
9 Bluetooth 1 Bluetooth Enable X X
2 Bluetooth Disable X X
3 Write Bluetooth device address to Registry X X
4 Bluetooth Inquiry Test X X
2 Log 1 Error Log √ √
2 HDD Log X X
3 Factory Initialize √ √
4 Network √ √
5 Version Up (Disc) X X
6 System Information √ √
7 EMC Test Mode SC SC
8 Drive 1 OP Data Write √ √
2 Servo Parameter Check SC SC
3 Servo Signal Check SC SC
4 S-Curve Check SC SC
5 Readability Check SC SC
6 OP Position Check SC SC
7 OP Check SC SC
8 Aging Test SC SC
9 Spindle Control Check SC SC
10 FA Test SC SC
9 HDD Mode √ Support
10 RF Test Mode 1 RF Test WLAN SC SC X Not Support
2 RF Test Bluetooth SC SC SC Special Control 5-2
Service Mode Menu
Outline:
Service Mode Top Menu
It selects to each function from here.
output HDMI/Component 480p forcibly.
Operation:
[1] Select and Activate Diag Menu.
[2] Select and Activate Log Menu,
[3] Select and Activate Factory Initialize Menu.,
[4] Select and Activate Network Menu
[5] Select and Activate Version Up (DISC version Up) (not Used)
[6] Select and Activate System Information Menu.
[7] Select and Activate EMC Test Mode Menu. (not Used)
[8] Select and Activate Drive Menu.
[9] Select and Activate HDD mode. (not Used)
[10] Select and Activate RF Test mode. (not Used)
[UP] Move Up cursor Move
[DOWN] Down cursor
[ENT] Activate the selected cursor.
*The cursor is not displayed when initial.
5-3
Diag Menu (Device Test) (additional)
5-4
Diag Menu (Video Test/ Audio Test)
Outline:
Activate Video Test and Audio Test
(Window 1)
* Diag
(Window 1)Select Video Test Category
Operation: Category : Video Test [ENT]
[ENT] Activate and display Color Bar
[UP][RET] Return to test category selection.
[ENT] Show Color Bar
(Window 2)Display Color Bar
Operation: (Window 2)
[ENT] Return to Select Video Test Category.
>Video Test:
[ENT]
Color Bar output HDMI.
>Audio Test;
TONE sound output SPDIF & HDMI.
( Wi ndow 3)
* Di ag
(Window 3)
* Diag
Cat egor y: Audi o Test
5-5
Log Menu
Outline:
Display each contents of the log,
5-6
Factory Initialize Menu
Outline:
Return all of the player setting to their factory defaults.
(Window 1)
* Factory Initialize
(Window 1) select initialize.
Operation: [ENT] Start Initialize
When you return a set to the factory defaults, push [1] on this screen.
[ENT] Start Factory Initialize
[RET] Return to Top Menu
[RET] Return to Service Top Menu.
(Window 2)
It is a screen of the end of initialization.
[RET] Return to Service Top Menu.
(Window 2)
Please disconnect AC power supply, and connect AC again. * Factory Initialize
- The operation of other service mode menu can be continued.
HELP : [RET]
5-7
Network Menu (Network Test : Ifconfig)
Outline: (Window 1)
Network Menu for the wired Ethernet.
* Network
(Window1)Ifconfig Test Test: I f c o n f i g Ping
Operation:
[ENT] Activate Ifconfig( Display network setting)
[RIGHT] Select Ping Test. (Window 2)
[RET] Return to Service Top Menu. * Network
(Window 2)Ping Test Test: I f c o n f i g Ping
Operation:
[LEFT] Select Ifconfig Test. Ping To :
[RET] Return to Service Top Menu.
(The details of a Ping test are nest page)
[START]
Remark:
Some items require10~15sec waiting time.
5-8
Network ( Network Test: Ping)
Outline:
Ping Test for the wired Ethernet.
(Window 1)
* Network
(Window 1)Ping Test Test: I f c o n f i g
Operation:
Ping
[LEFT] Select Ifconfig Test. Ping To :
[DOWN] Ping execution preparation.
[RET] Return to Service Top Menu. [START]
(Window 2) The IP address of the Ping point is set up. (Window 2)
(IP address input mode) * Network
When “Ping to :>” is reversed, [ENT] is pushed and IP is inputted.
Operation: Test: I f c o n f i g Ping
[ENT] Finish to input.
[RET] Finish to input.
Ping To : 192.168.1.10
[LEFT] Finish to input and Select Ifconfig Test.
[(NUM)] Input Character sting ‘0-9’ [ENT] : Release
[TIME] Input Character sting ’.’
[CLEAR] Backspace
[RET] : Release
[ LEFT] : l f conf i g Test
(Window 3)
[ ( NUM) ] : ' 0- 9'
(Windows3): Ping Test Active
When [START] is reversed, [ENT] is pushed and execute ping . * Network
[ Tl ME] : ' . '
Operation:
[ENT] Activate Ping Test Test:
[ CLEAIRf]c: oB f i g Ping
nackspace
[UP] The IP address of the Ping point is set up. Ping To : 192.168.1.10
[RET] Return to Service Top Menu.
[START]
Front Panel Display:
NET
Ping 192.168.1.10 OK!
5-9
System Information
Outline:
Display System Information (Window 1)
* System Information
(Window 1)Basic Information Menu
Operation: Main LSIname: CXD90049GG-BA
[RIGHT] Drive Information (delta IOP of a drive is measured ) and
Wireless device Information (only wireless model)
Model: BDP12G-CX/CI
displayed. (go to window 2) Destination: xx
[RET] Return to Service Top Menu. Sequence Number: Bxxxxxxxxxxx
MAC: xx-xx-xx-xx-xx-xx
(Window 2)Drive and Wireless Information Menu
Operation:
IP: xxx.xxx.xxx.xxx
[LEFT] Basic Information displayed. (go to window 1) IF-con Block0 version: xx, Block1 version: xxxx
[RET] Return to Service Top Menu. Bootloader Version:xxxxx
Host Main Version: M36/37.R.xxxx
When delta IOP is measured, it becomes impossible to use the Version Up function.
MicroBE Version: xxxx
Contents List: Host Sub Version: 2016xxxxxx
Model Middleware Version: xxxxx
Destination
Sequence Number HELP : [RET] [RIGHT]
MAC
IP
IFCON IFCON Version
Bootloader Bootloader Version (Window 2)
Host Main Host Main Version * System Information
MicroBE MicroBE Version
Host Sub Host Sub Version Drive Firm Revision: TExxxx
Middleware Middleware Version
CD DIOP: 0xxxxxxx
Drive Firm Revision DVD DIOP: 0xxxxxxx
CD DIOP Delta IOP
DVD DIOP BD Delta IOP BD DIOP: 0xxxxxxx
DIOP CD LD Delta IOP CD LD TIME: 0xxxxxxxxxxxxxxx
TIME DVD LD LD Time DVD LD TIME: 0xxxxxxxxxxxxxxx
TIME BD LD LD Time BD LD TIME: 0xxxxxxxxxxxxxxx
TIME LD Time
5-10
Drive
Outline:
(Window 1)
Activate Drive test
* Drive
(Window 1) Select Drive test category ara rammeteteer Chehecck M
Operation: [1] Drive OP data Write
enenuu igngnaal Chehecck M
[LEFT] [RIGHT] Select Category [2] Servo Parameter
(WindowCheck
2) Menu
Men enuu Checkck Menu
[DOWN][ENT] Activate the s elected Category. [3] Servo Signal Check
* Drive OPMenu
data Write
[RET] Return to Service To p Menu. [4] S-Curve Check Menu y Chececkk Me
l iti ty
[1] Drive OP data Write
nunuUSB
[Insert
[5] Readability Check Menu tioiStorageDevice
onn Chececk …
[2] Servo Parameter Check Menu (Not Used) [6] OP Position Check k Me
Menu nu
n u k Menunu
[3] Servo Signal Check Menu (Not Used)
Remove DISC and Close tray.
[7] OP Check Menu e ctc t A g i ngng
[4] S-Curve Check Menu (Not Used) C on trt roo l Chehecck Men
[5] Readability Check Menu (Not Used) [8] Aging Test Menu
[9] Spindle Control enuu t
Check Menu M o de
d e
[6] OP Po s ition Check Menu (Not Used) Disc: Eject
[7] OP Check Menu [10] FA Test Mode [E[ENNT]T] StStartart
[8] Lo ad Eject Aging (Not Used) Mode: 1
[9] Spindle Co ntrol Check Menu (Not Used) (Window 3)
[10] FA Tes t Mo de (Not Used) * Drive OP data Write WN]
HelpHelp:: [UP] P][
[DOND][
[OENENTT][][RRETET]][([(NNUMUM))]
HELP : [UP] [DOWN] [ENT]
[ENT] [RET] [(NUM)]
Start
(Window 2) To start OP data Write [Insert USB StorageDeviceHELP H…ELP:: [LEFEFT][T][RIGRIGHT]HT][UP[UP][D][
Operation : DOWNOWN][E][ENT] NT][RE[RETT
[ENT] Start Remove DISC and Close tray.
(Window 3) Show OP data Write result [ENT] Start HELP : [ENT] [RET]
Operation : (Window 4)
* OP Check Menu
NG - USB is no t find
NG - USB is not Remove
find DISC and Close tray.
NG – File(Budata.txt) is no t find
OK – OP data write OK - OP data write
[1] Disc: Eject
>Drive Test: [2]ROP
IG Serial
HT]T][[: UPUP]]xxxxxxxxxxxxxxxxx
IGH [D[DOOWNWN]][E[ENNT]T][[RERETT]
Fo r drive o perating check. Service is o nly us e Drive OP data write to re write
OP data after change o f new OPU. [3] dIOP
BD : x [xx]
(Window 4) Show OP Check Menu DVD : x [xx]
HELP : [ENT] [RET]
Operation : CD : x [xx]
[1] Dis c : Eject TEMP : xx.x deg
[2] OP Serial : ************** [4] LD ON Time
[3] dIOP
[4] LD ON Time
5-11
Error Log Information
Error LogCode
issue note
Category ErrorCode ErrorInfo_0 ErrorInfo_1 ErrorInfo_2 ErrorInfo_3
IFCON - Communication
0x03 0x01 0x00 0xXX 0xXX 0x00 No response from Ifcon
time out
NAND - Unknown Error 0x04 0x00 0x00 0xXX 0xXX 0x00 Unknown/Undeclare Error
NAND - Bad Block Marking
0x04 0x01 0x00 0xXX 0xXX 0x00 When Software make bad block marking
Error
DRIVE Error 0x06 0x01 Error Code Cannot detect optical drive
DRIVE Error 0x06 0x03 SCR Diag Field(Simultaneous error) SATA IF ERROR
DRIVE Error 0x06 0x04 Error Code Removing FFC cable (drive)
Fan error 0x07 0x01 0x01 0x00 0x00 0x00 Temperature is too high
Ethernet - Internet Access
0x08 0xXX 0x02 0x00 0x00 0x00 No internet Access
Error
USB - Unknown Error 0x0A 0x00 0xXX 0xXX 0xXX 0xXX Unknown/Undeclare Error
USB - Can't Recog. Device 0x0A 0x01 0xXX 0xXX 0xXX 0xXX Cannot recognise USB Device
USB - Over Current Error 0x0A 0x02 0xXX 0xXX 0xXX 0xXX Over current Happen.
5-12
SECTION 6
TROUBLESHOOTING
Power LED Light up about 10s No Are all the power line mentioned No
6-2. Power System Flowchart
and turn of automatically. in Power flow (x-x) normal?
Yes
Yes
Check IC401, pin 4 No
(output) UNSW 1.8V
Yes
Yes
Yes
Yes
Change MB board
To Drive Flowchart (BU adj. flow)
Note:
* - For UBP-X1000ES model only
(with FLD display)
6-1
6-2. Power (System) Flow
AC IN
Yes
No
Yes
Check Voltage lines that are not output Failure of power supply IC ->
No
are shorted to GND Replace the MB board .
Yes
Replace MB Board
6-2
6-3. Remote Control Does Not Operate
Check IC100 pin2 +3.3V? No Check CN707 pin2 +3.3V? No
(MB Board) To Power Supply flowchart
(FR Board)
Yes Yes
Check CN100 pin2 +3.3V? No Check FFC connection from OK
(FR Board) CN100? Change FR Board
Yes NG
6-3
6-6. Video Section Flowchart
HDMI 1
Video does not appear right
HDMI 2
Video does not appear right
6-4
6-7. Audio (SPDIF) Section Flowchart
No No
Audio does not sound right? Video is output properly? To Video section flowchart
Yes Yes
To Main Flowchart
Yes
Replace MB Board
6-5
6-8*. Audio (Analog) Section Flowchart (For UBP-X1000ES model only)
MB-1601
No
Is there Audio signal out at IC101? Replace new MB-1601
Check Audio-L/R Channel
Yes
MB-1601 No
Is there AK4452 Reset Signal from Replace new MB-1601
IC1401 (Pin57)?
Check SW3.3V(CL1007)
Yes
AN-1605
Yes
AN-1605
6-6
6-9. Drive flowchart
Optical Unit (BU) IOP check flow [zz] Optical Unit (BU) Replacement flow [yy]
~ Before BU Replacement
Remove defective BU assy from Loading
Enter Service Mode (HOME) The following cases need Assy
Press OP Data Write:
<STOP><DISPLAY><PAUSE><↑> (1) Replace BU (MB is original) Remove insulator and weight from
(2) Replace MB (BU is original) defective BU
*Service Mode Menu
Select - [8] Drive
(3) Replace b oth BU and MB
Unpack new BU and take OP Data
barcode photo by camera
judge
B
YES Optical Block Unit (BU) replacement
(Flowchart yy) B
AC Power OFF
Insert USB memory to
Set USB connector
AC Power ON HOME
Enter Service Mode
Press <STOP><DISPLAY><PAUSE><↑>
*Drive
Select - [1] Drive OP data write Explanation :
Select mode : 2 Mode 1 : BDV set
Press <ENTER> Mode 2 : UBP set
AC Power ON
HOME Enter Service Mode
Select [8] Drive
Select [7] OP Check Menu
Select [3] dIOP
AC Power ON
Check playback performance
BD : BLX-104 DVD : HLX-513
BD, DVD and CD
CD : HLX-A1
6-7
6-10. Ethernet flowchart
No
Is the LAN cable plugged in properly? Plug in the LAN cable firmly
Yes
Is the LED of the hub router lit? (LINK No No
Is power supplied to the MB board? To Power System Flowchart
LED)
Yes
Yes
Replace the MB board.
YES
Check 3.3V at NO
Wifi Module pin8 To power supply flow chart
YES
Check 3.3V at NO
Wifi Module pin2 To power supply flowchart
YES
Can establish NO Change MB board
Repeat wireless setup Wi-Fi Connection? / Wifi Module
YES
END
6-8
6-12. USB (Front) Device Flow
No
Is 5V present at CN201 (FR board) Yes Replace the FFC between the
pin1? MB board and the IF board. No Replace the MB board.
Do the sym ptoms improve?
No
Yes
Defective FFC between the IF
board and the MB board
Yes
6-9
SECTION 7
REPAIR PARTS LIST
7-1. EXPLODED VIEWS
NOTE:
• Items marked “*” are not stocked since they are seldom The components identified by mark or dotted
• -XX and -X mean standardized parts, so they may
required for routine service. Some delay should be line with mark are critical for safety.
have some difference from the original one.
anticipated when ordering these items. Replace only with part number specified.
• Color Indication of Appearance Parts
• The mechanical parts with no reference number in
Example:
the exploded views are not supplied.
KNOB, BALANCE (WHITE) . . . (RED) Les composants iden tifi és par une marque
• Accessories and packing materials are given in the
last of the electrical parts list. sont critiquens pour la sécurité.
Ne les remplace r que par une pièce portant le
Parts Color Cabinet’s Color numéro spécifi é.
2
6
7-1
The components identified by mark or dotted
line with mark are critical for safety.
7-1-2. MAIN CHASSIS SECTION Replace only with part number specified.
BD Section Les composants iden tifi és par une marque
(Ref. Pg:7-3) sont critiquens pour la sécurité.
Ne les remplace r que par une pièce portant le
numéro spécifi é.
7-2
The components identified by mark or dotted
line with mark are critical for safety.
Replace only with part number specified.
7-1-3. BD SECTION
Les composants iden tifi és par une marque
sont critiquens pour la sécurité.
ns*2 Ne les remplace r que par une pièce portant le
ns*1 numéro spécifi é.
Legend :
ns*1
ns*2 ns*1 : screw tighten 1.3kgf.cm
ns*2 : screw tighten 3.0kgf.cm
ns : non-service part
ns
2
ns*1 ns
ns
3
ns*1
ns
ns (weight)
ns*1
ns*1
ns*1
5
1 6
1 2
Power Supply Cord Remote Commander
7-4
REVISION HISTORY
7-5