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BYW82 To BYW86: Standard Avalanche Sinterglass Diode
BYW82 To BYW86: Standard Avalanche Sinterglass Diode
BYW82 to BYW86
Vishay Semiconductors
Features
• Glass passivated junction
• Hermetically sealed package
• Controlled avalanche characteristics
• Low reverse current
• High surge current loading
Applications
Rectification, general purpose
949588
Mechanical Data
Case: Sintered glass case, SOD 64
Parts Table
Part Type differentiation Package
BYW82 VR = 200 V; IFAV = 3 A SOD64
BYW83 VR = 400 V; IFAV = 3 A SOD64
BYW84 VR = 600 V; IFAV = 3 A SOD64
BYW85 VR = 800 V; IFAV = 3 A SOD64
BYW86 VR = 1000 V; IFAV = 3 A SOD64
Electrical Characteristics
Tamb = 25 °C, unless otherwise specified
Parameter Test condition Sub type Symbol Min Typ. Max Unit
Forward voltage IF = 3 A VF 1.0 V
Reverse current VR = VRRM IR 0.1 1 µA
VR = VRRM, Tj = 100 °C IR 5 10 µA
Breakdown voltage IR = 100 µA, tp/T = 0.01, tp = 0.3 ms V(BR) 1600 V
Diode capacitance VR = 4 V, f = 1 MHz CD 40 60 pF
Reverse recovery time IF = 0.5 A, IR = 1 A, iR = 0.25 A trr 2 4 µs
IF = 1 A, di/dt = 5 A/µs, VR = 50 V trr 3 6 µs
Reverse recovery charge IF = 1 A, di/dt = 5 A/µs Qrr 6 10 µC
40
100.000
30 10.000
I F – Forward Current ( A)
Tj=175°C
1.000
20 Tj=25°C
l l
0.100
10
0.010
TL=constant
0 0.001
0 5 10 15 20 25 30 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0
94 9563 l – Lead Length ( mm ) 16360 VF – Forward Voltage ( V )
Figure 1. Max. Thermal Resistance vs. Lead Length Figure 2. Forward Current vs. Forward Voltage
3.5 350
1.5 150
PR–Limit
1.0 100 @80%VR
RthJA=70K/W
PCB: d=25mm
0.5 50
0.0 0
0 20 4060 80 100 120 140 160 180 25 50 75 100 125 150 175
16361 Tamb – Ambient Temperature ( °C ) 16363 Tj – Junction Temperature ( °C )
Figure 3. Max. Average Forward Current vs. Ambient Temperature Figure 5. Max. Reverse Power Dissipation vs. Junction
Temperature
1000 100
VR = VRRM 90 f=1MHz
CD – Diode Capacitance ( pF )
80
IR – Reverse Current ( mA )
70
100
60
50
40
10
30
20
10
1 0
25 50 75 100 125 150 175 0.1 1.0 10.0 100.0
16362 Tj – Junction Temperature ( °C ) 16364 VR – Reverse Voltage ( V )
Figure 4. Reverse Current vs. Junction Temperature Figure 6. Diode Capacitance vs. Reverse Voltage
Zthp – Thermal Resistance for Pulse Cond. (K/W
1000
VRRM=1000V RthJA=70K/W
100
tp/T=0.5
Tamb=25°C
tp/T=0.2
10 tp/T=0.1
45°C
tp/T=0.05
tp/T=0.01 70°C 60°C
tp/T=0.02
100°C
1
10–4 10–3 10–2 10–1 100 101 10–1 100 101
IFRM – Repetitive Peak
94 9568 tp – Pulse Length ( s ) Forward Current ( A )
Package Dimensions in mm
Sintered Glass Case Cathode Identification ∅ 4.3 max.
SOD 64
Weight max. 1.0g technical drawings
according to DIN
specifications
∅ 1.35 max.
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