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  • Equalizers, Selectable Engeq00134: 2-, 3.5-, and 5-Db Gain Equalizer Array, 2 To 18 GHZ

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    salah Othman
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    This document describes an equalizer array die with selectable 2, 3.5, and 5 dB gain from 2 to 18 GHz. The die allows selection of the signal path through wire bond connections and maintains a 50 ohm impedance match. It has a wide bandwidth, high return loss, and can handle up to 20 dBm of RF power. The die is intended for applications requiring selectable equalization such as test systems, prototypes, and radios.

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    Original Title

    EQ00134-SR1p1

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    This document describes an equalizer array die with selectable 2, 3.5, and 5 dB gain from 2 to 18 GHz. The die allows selection of the signal path through wire bond connections and maintains a 50 ohm impedance match. It has a wide bandwidth, high return loss, and can handle up to 20 dBm of RF power. The die is intended for applications requiring selectable equalization such as test systems, prototypes, and radios.

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    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
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    21 views6 pages

    Equalizers, Selectable Engeq00134: 2-, 3.5-, and 5-Db Gain Equalizer Array, 2 To 18 GHZ

    Uploaded by

    salah Othman
    This document describes an equalizer array die with selectable 2, 3.5, and 5 dB gain from 2 to 18 GHz. The die allows selection of the signal path through wire bond connections and maintains a 50 ohm impedance match. It has a wide bandwidth, high return loss, and can handle up to 20 dBm of RF power. The die is intended for applications requiring selectable equalization such as test systems, prototypes, and radios.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
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    of 6

    Equalizers, Selectable

    ENGEQ00134

    2-, 3.5-, and 5-dB Gain Equalizer Array, 2 to 18 GHz

    Typical Applications Features

    • Select at test • Ultra wideband performance


    • Space Hybrids • Excellent return loss
    • Military Hybrids • > 18 dB typical
    • Microwave Radios • RF Power handling: +20 dBm
    • Prototype Kits • Die size: 1.39 x 2.76 x 0.10 mm
    • Test and Measurement Systems (0.055 x 0.109 x 0.004 inch)

    Description 2 dB
    Functional Block Diagram

    The ENGEQ00134 is a die with 3 gain


    equalizers. The part is ideal for select at
    test applications. The signal path is
    selected by wire bond connections to 2 dB
    the bond pads associated for 2-, 3.5-, or
    5-dB gain slope, while maintaining good
    impedance match to 50 Ohms. The die
    has a gold backside metallization and is 3.5 dB
    designed to be silver epoxy attached.
    The RF interconnects are designed to
    account for wire bonds and external
    microstrip flares for optimal integrated 5 dB
    return loss. Nichrome resistors with low
    temperature coefficients are set up to
    handle up to 100 milliwatts RF input
    power levels.

    ENGIN-IC, Inc
    1721 W. PLANO PKWY STE 121 Plano, TX 75075
    Phone 972-332-5000 1
    Ver 1.1 1201 www.engin-ic.com
    ENGEQ00134
    Equalizer Array, 2 to 18 GHz

    Electrical Specifications, T = 25 ⁰C, Typical data

    Absolute Maximum Ratings


    Parameter Max level

    RF Power +20 dBm


    (assuming no DC power applied)
    Storage Temperature -65 ⁰C to +150 ⁰C

    Operating Temperature -55 ⁰C to +125 ⁰C

    Max DC Voltage applied to one port 2.2 V.


    (assuming no RF power applied)

    ENGIN-IC, Inc
    1721 W. PLANO PKWY STE 121 Plano, TX 75075
    Phone 972-332-5000 2
    Ver 1.1 1201 www.engin-ic.com
    ENGEQ00134
    Equalizer Array, 2 to 18 GHz

    RF Data with wirebonds and external microstrip flare pads


    Measured Insertion Loss and Return Loss (dB)

    ENGIN-IC, Inc
    1721 W. PLANO PKWY STE 121 Plano, TX 75075
    Phone 972-332-5000 3
    Ver 1.1 1201 www.engin-ic.com
    ENGEQ00134
    Equalizer Array, 2 to 18 GHz

    RF Data with wirebonds and external microstrip flare pads


    Measured Insertion Phase and Deviation from Linear Phase (Degrees)

    EQ 5dB

    EQ 3.5dB

    EQ 2dB

    ENGIN-IC, Inc
    1721 W. PLANO PKWY STE 121 Plano, TX 75075
    Phone 972-332-5000 4
    Ver 1.1 1201 www.engin-ic.com
    ENGEQ00134
    Equalizer Array, 2 to 18 GHz

    Outline Drawing

    2760
    (.109)

    6 1
    5 2
    4 3

    Y=0
    Notes:
    1. All dimensions are in µm (inches).
    (.055)
    1390

    2. Substrate thickness: 100 µm (0.004”).


    X=0

    3. Backside metallization is gold.


    4. Bond pad metallization is gold.

    ENGIN-IC, Inc
    1721 W. PLANO PKWY STE 121 Plano, TX 75075
    Phone 972-332-5000 5
    Ver 1.1 1201 www.engin-ic.com
    ENGEQ00134
    Equalizer Array, 2 to 18 GHz
    Wire Bond Configurations and Suggested Microstrip Flares
    1 mil dia. Gold wire
    Wire Bond X-dimension wire length 380um (15 mils)
    (2 places) as
    shown for 2 dB

    Wire Bond
    (2 places) as
    shown for 3.5 dB

    Wire Bond W1
    (4 places) as
    shown for 5 dB

    W50

    L1

    ENGIN-IC, Inc
    1721 W. PLANO PKWY STE 121 Plano, TX 75075
    Phone 972-332-5000 6
    Ver 1.1 1201 www.engin-ic.com

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