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Electronics Engineering: Ese, Gate, Psus
Electronics Engineering: Ese, Gate, Psus
Electronics
Engineering
Revised & Updated
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Publications
MADE EASY alumni have shared their winning stories of success and expressed
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but also secured top positions in their career profiles. Now, I invite you to
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Chapter 1 :
IV. Fourier Transform...............................................97
Electronic Devices
V. Laplace Transform........................................... 102
and Circuits.................................... 1-29
VI. Discrete Time Fourier Transform................ 105
I. Energy Band and Charge Carriers
in Semiconductors.............................................. 1 VII. Z -Transform...................................................... 106
VIII. Waveguides.....................................................272
Chapter 11 :
IX. Antenna............................................................275
Measurements and
X. RADAR...............................................................281
Instrumentation...................... 413-463
Chapter 8 : I. Characteristics of Instruments
and Measurement Systems.......................413
Digital Electronics................... 285-337
II. Circuit Components (Resistors,
I. Number System and Codes.......................285
Inductors, Capacitors)..................................419
II. Logic Gates......................................................291
III. Galvanometers...............................................421
III. Boolean Algebra and
IV. Analog Meters................................................423
Reduction Techniques.................................298
V. Measurement of Power and
IV. Digital Logic Circuits....................................302
Wattmeters......................................................431
V. Sequential Circuits........................................309
VI. Measurement of Resistance......................436
VII. A.C. Bridges.....................................................443 V. Cache, Main Memory and
VIII. Magnetic Measurements............................451 Secondary Storage.......................................544
Chapter 13 :
Chapter 16 :
Advanced Electronics.............. 505-526
Microwave................................ 624-669
I. VLSI Fabrication.............................................505
I. Introduction....................................................624
II. VLSI Design......................................................508
II. Waveguides.....................................................625
III. Pipelining.........................................................516
III. Microwave Hybrid Circuits.........................638
IV. VLSI Testing.....................................................520
IV. Microwave Transistor and
Tunnel Diode..................................................644
Chapter 14 :
V. Microwave Field Effect Transistors..........648
Computer Organization and
VI. Transferred Electron
Architecture............................. 527-576
Devices (TEDs)................................................651
I. Machine Instructions and
VII. Avalanche Transit Time Devices...............653
Addressing Modes........................................527
VIII. Microwave Linear Beam
II. ALU and Data-path,
Tubes (O-type)................................................658
CPU Control Design......................................530
IX. Microwave Crossed Field
III. Memory and I/O Interfaces........................536
Tubes (M-type)...............................................666
IV. Instruction Pipelining..................................538
X. Microwave Measurements.........................667
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