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MAC223A6, MAC223A8, MAC223A10 Triacs: Silicon Bidirectional Thyristors
MAC223A6, MAC223A8, MAC223A10 Triacs: Silicon Bidirectional Thyristors
MAC223A10
Preferred Device
Triacs
THERMAL CHARACTERISTICS
Characteristic Symbol Value Unit
Thermal Resistance, Junction to Case RθJC 1.2 °C/W
Thermal Resistance, Junction to Ambient RθJA 60 °C/W
Maximum Lead Temperature for Soldering Purposes 1/8″ from Case for 10 Seconds TL 260 °C
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise indicated; Electricals apply in both directions)
Characteristic Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Peak Repetitive Blocking Current TJ = 25°C IDRM, — — 10 µA
(VD = Rated VDRM, VRRM; Gate Open) TJ = 125°C IRRM — — 2.0 mA
ON CHARACTERISTICS
Peak On–State Voltage (ITM = "35 A Peak, Pulse Width v 2 ms, VTM — 1.4 1.85 Volts
v
Duty Cycle 2%)
Gate Trigger Current (Continuous dc) IGT mA
(VD = 12 V, RL = 100 Ω)
MT2(+), G(+); MT2(–), G(–); MT(+), G(–) — 20 50
MT2(–), G(+) — 30 75
Gate Trigger Voltage (Continuous dc) VGT Volts
(VD = 12 V, RL = 100 Ω)
MT2(+), G(+); MT2(–), G(–); MT(+), G(–) — 1.1 2.0
MT2(–), G(+) — 1.3 2.5
Gate Non–trigger Voltage VGD Volts
(VD = 12 V, TJ = 125°C, RL = 100 Ω) 0.2 0.4 —
All Quadrants
Holding Current IH — 10 50 mA
(VD = 12 Vdc, Gate Open, Initiating Current = "200 mA)
Turn–On Time tgt — 1.5 — µs
(VD = Rated VDRM, ITM = 35 A Peak, IG = 200 mA)
DYNAMIC CHARACTERISTICS
Critical Rate of Rise of Off-State Voltage dv/dt — 40 — V/µs
(VD = Rated VDRM, Exponential Waveform, TC = 125°C)
Critical Rate of Rise of Commutation Voltage dv/dt(c) — 5.0 — V/µs
(VD = Rated VDRM, ITM = 35 A Peak, Commutating
di/dt = 12.6 A/ms, Gate Unenergized, TC = 80°C)
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MAC223A6, MAC223A8, MAC223A10
Quadrant 1
MainTerminal 2 +
Symbol Parameter VTM
VDRM Peak Repetitive Forward Off State Voltage
on state
IDRM Peak Forward Blocking Current IH
VRRM Peak Repetitive Reverse Off State Voltage IRRM at VRRM
IRRM Peak Reverse Blocking Current
VTM Maximum On State Voltage off state + Voltage
IH Holding Current IH IDRM at VDRM
Quadrant 3
VTM
MainTerminal 2 –
MT2 POSITIVE
(Positive Half Cycle)
+
MT1 MT1
REF REF
IGT – + IGT
MT1 MT1
REF REF
–
MT2 NEGATIVE
(Negative Half Cycle)
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MAC223A6, MAC223A8, MAC223A10
115
30
105
20
95
85
10
75
0
0 5.0 10 15 20 25
0 5.0 10 15 20 25 IT(RMS), RMS ON–STATE CURRENT (AMPS)
IT(RMS), RMS ON–STATE CURRENT (AMPS)
0.5 0.5
0.3 0.3
0.2 0.2
0.1 0.1
– 60 – 40 – 20 0 20 40 60 80 100 120 140 – 60 – 40 – 20 0 20 40 60 80 100 120 140
TJ, JUNCTION TEMPERATURE (°C) TJ, JUNCTION TEMPERATURE (°C)
Figure 3. Typical Gate Trigger Current Figure 4. Typical Gate Trigger Voltage
i TM, INSTANTANEOUS ON–STATE CURRENT (AMPS)
200
NORMALIZED HOLD CURRENT
100
2.0 ITM = 200 mA 50
Gate Open TJ = 25°C
1.0 10
5.0
0.5
0.3 1.0
0.2 0.5
0.1 0.1
– 60 – 40 – 20 0 20 40 60 80 100 120 140 0 1.0 2.0 3.0 4.0
TJ, JUNCTION TEMPERATURE (°C) VTM, INSTANTANEOUS ON–STATE VOLTAGE (VOLTS)
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MAC223A6, MAC223A8, MAC223A10
PACKAGE DIMENSIONS
TO–220AB
CASE 221A–07
ISSUE Z
NOTES:
SEATING 1. DIMENSIONING AND TOLERANCING PER ANSI
–T– PLANE Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL
B F C BODY AND LEAD IRREGULARITIES ARE
T
S ALLOWED.
INCHES MILLIMETERS
DIM MIN MAX MIN MAX
4
A 0.570 0.620 14.48 15.75
Q A B 0.380 0.405 9.66 10.28
C 0.160 0.190 4.07 4.82
1 2 3 U D 0.025 0.035 0.64 0.88
H F 0.142 0.147 3.61 3.73
G 0.095 0.105 2.42 2.66
K H 0.110 0.155 2.80 3.93
Z J 0.014 0.022 0.36 0.55
K 0.500 0.562 12.70 14.27
L 0.045 0.060 1.15 1.52
N 0.190 0.210 4.83 5.33
L R Q 0.100 0.120 2.54 3.04
R 0.080 0.110 2.04 2.79
V J S 0.045 0.055 1.15 1.39
T 0.235 0.255 5.97 6.47
G U 0.000 0.050 0.00 1.27
D V 0.045 ––– 1.15 –––
N Z ––– 0.080 ––– 2.04
STYLE 4:
PIN 1. MAIN TERMINAL 1
2. MAIN TERMINAL 2
3. GATE
4. MAIN TERMINAL 2
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MAC223A6, MAC223A8, MAC223A10
Notes
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MAC223A6, MAC223A8, MAC223A10
Notes
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MAC223A6, MAC223A8, MAC223A10
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