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High Efficiency, Main Power Supply Controllers For Notebook Computers
High Efficiency, Main Power Supply Controllers For Notebook Computers
PGOOD2
PGOOD2
UGATE2
UGATE2
PHASE2
PHASE2
VOUT2
VOUT2
ILIM2
ILIM2
SKIP
SKIP
EN2
EN2
FB2
FB2
32 31 30 29 28 27 26 25 32 31 30 29 28 27 26 25
FB1
BYP
FB1
PHASE1
PHASE1
VOUT1
ILIM1
PGOOD1
EN1
UGATE1
VOUT1
ILIM1
PGOOD1
EN1
UGATE1
WQFN-32L 5x5 WQFN-32L 5x5
RT8206A RT8206B
Q1 R4 0 15 UGATE1 C11 L2
0.1µF 4.7µH VOUT2
PHASE2 25 3.3V
R3 0 17 C17
BOOT1 Q4
LGATE2 23 R10 220µF
L1 C2
VOUT1 6.8µH 0.1µF 16 PHASE1 PGND 22 C14
5V R17
C3 Q3 18 LGATE1 VOUT2 30 11.5k C22
R5
220µF FB2 32
C4 9 C21
BYP REF 1 R18 0.1µF
C15 10k
10 VOUT1 0.22µF R6
C5 13 100k
D1 PGOOD1 PVCC
0.1µF
C6 R13
D2 3 VCC 100k
0.1µF PGOOD2 28 PVCC
C7 C9
D3 0.1µF 1µF EN1 14 5V Enable
ON
D4 EN2 27 3.3V Enable OFF
C8 LDO Control
0.1µF R11 ENLDO 4 VIN
200k 20 SECFB/NC R1
180k
R12 ILIM1 12
CP 39k
R2
C23 R15 C19 180k
15k 31
ILIM2
11 FB1
C20
R7 0 TON 2 Frequency Control
0.1µF R16 19 PVCC
10k C16 29 PWM/DEM/Ultrasonic
SKIP
1µF
7 LDO 21, 33 (Exposed Pad)
GND
C10
4.7µF
BOOT1 BOOT2
UGATE1 UGATE2
PHASE1 PHASE2
PVCC PVCC
SMPS1 SMPS2
LGATE1 LGATE2
PWM Buck PWM Buck
PGND Controller Controller
VOUT1 VOUT2
FB1 FB2
ILIM1 ILIM2
PGOOD1 PGOOD2
GND SW Threshold
VCC
BYP
PVCC
Internal Power On
Logic ENLDO
Sequence
EN1
Clear Fault Latch
EN2
LDO
Thermal
LDO REF REF
Shutdown
VIN
UGATE
On-Time Q TOFF
VOUT TON R TRIG 1-Shot
Compute 1-Shot Q
TRIG
REF -
+ - Comp
+ - +
LGATE
- Blanking
0.7 x VREF + ILIM
+ Time
Under Voltage -
Current
-
Limit
0.9 x VREF + SS +
Time -
PGOOD
25kHz + PHASE
Detector Zero -
Detector
SKIP
GND [Pin 21, 33 (Exposed Pad)] SKIP = REF : Ultrasonic Mode operation
Analog Ground for both SMPS and LDO. The exposed SKIP = VCC : PWM operation.
pad must be soldered to a large PCB and connected to
GND for maximum power dissipation. VOUT2 (Pin 30)
SMPS2 Output Voltage Sense Input. Connect this pin to
PGND (Pin 22) the SMPS2 output. VOUT2 is an input to the constant
Power Ground for SMPS controller. Connect PGND on-time-PWM one-shot circuit. It also serves as the
externally to the underside of the exposed pad. SMPS2 feedback input in fixed voltage mode.
To be continued
www.richtek.com DS8206A/B-06 August 2011
10
RT8206A/B
Parameter Symbol Test Conditions Min Typ Max Unit
Low Level (DEM) -- -- 0.8
SKIP Input Voltage REF Level (Ultrasonic Mode) 1.8 -- 2.3 V
High Level (PWM Mode) 2.5 -- --
V OUT1 / V OUT2 (400kHz / 500kHz) -- -- 0.8
TON Setting Voltage V OUT1 / V OUT2 (300kHz / 375kHz) 1.8 -- 2.3 V
V OUT1 / V OUT2 (200kHz / 250kHz) 2.5 -- --
Clear Fault Level / SMPS Off Level -- -- 0.8
ENx Input Voltage Delay Start 1.8 -- 2.3 V
SMPS On Level 2.5 -- --
Rising Edge 1.2 1.6 2.0
ENLDO Input Voltage VENLDO V
Falling Edge 0.94 1 1.06
ENLDO = 0V or 25V −1 -- +3
ENx = 0V or 5V −1 -- +1
Input Leakage Current TON, SKIP = 0V or 5V −1 -- +1 μA
FBx = 0V or 5V −1 -- +1
SECFB = 0V or 5V (RT8206A) −1 -- +1
Internal BOOT Switch
Internal Boost Charging
PVCC to BOOTx -- 20 -- Ω
Switch On-Resistance
Power MOSFET Drivers
UGATEx Driver Sink/Source
UGATEx Forced to 2V -- 2 -- A
Current
LGATEx Driver Source
LGATEx Forced to 2V -- 1.7 -- A
Current
LGATEx Driver Sink Current LGATEx Forced to 2V -- 3.3 -- A
UGATEx On-Resistance BOOTx to PHASEx Forced to 5V -- 1.5 4 Ω
LGATEx, High State -- 2.2 5
LGATEx On-Resistance Ω
LGATEx, Low State -- 0.6 1.5
LG Rising -- 30 --
Dead Time ns
UG Rising -- 40 --
Note 1. Stresses beyond those listed under “ Absolute Maximum Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those
indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
Note 2. θJA is measured in the natural convection at TA = 25°C on a high effective four layers thermal conductivity test board of
JEDEC 51-7 thermal measurement standard.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.
Note 5. PVIN + PPVCC
Efficiency (%)
60 Ultrasonic Mode 60
Ultrasonic Mode
50 50
PWM Mode
40 40
PWM Mode
30 30
20 VIN = 7V, TON = VCC, 20 VIN = 12V, TON = VCC,
EN2 = GND, EN1 = VCC, 10 EN2 = GND, EN1 = VCC,
10
ENLDO = VIN, FB1 = GND ENLDO = VIN, FB1 = GND
0 0
0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10
Load Current (A) Load Current (A)
VOUT1 Efficiency vs. Load Current VOUT2 Efficiency vs. Load Current
100 100
90 90 DEM Mode
DEM Mode
80 80
70 70
Efficiency (%)
Efficiency (%)
60 60
50 50 Ultrasonic Mode
Ultrasonic Mode
40 40
PWM Mode PWM Mode
30 30
20 VIN = 25V, TON = VCC, 20 VIN = 7V, TON = VCC,
10 EN2 = GND, EN1 = VCC, 10 EN2 = VCC, EN1 = GND,
ENLDO = VIN, FB1 = GND ENLDO = VIN, FB2 = GND
0 0
0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10
Load Current (A) Load Current (A)
VOUT2 Efficiency vs. Load Current VOUT2 Efficiency vs. Load Current
100 100
90 90
DEM Mode
80 80
70 70
DEM Mode
Efficiency (%)
Efficiency (%)
60 60
50 50 Ultrasonic Mode
Ultrasonic Mode
40 40
PWM Mode PWM Mode
30 30
20 VIN = 12V, TON = VCC, 20 VIN = 25V, TON = VCC,
10 EN2 = VCC, EN1 = GND, 10 EN2 = VCC, EN1 = GND,
ENLDO = VIN, FB2 = GND ENLDO = VIN, FB2 = GND
0 0
0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10
Load Current (A) Load Current (A)
VOUT1 Switching Frequency vs. Load Current VOUT1 Switching Frequency vs. Load Current
250 250
VIN = 7V, TON = VCC, EN2 = GND, EN1 = VCC, VIN = 12V, TON = VCC, EN2 = GND, EN1 = VCC,
225 ENLDO = VIN, FB1 = GND 225 ENLDO = VIN, FB1 = GND
Switching Frequency (kHz)
150 150
125 125
100 100
75 75
50 Ultrasonic Mode 50 Ultrasonic Mode
25 25
DEM Mode DEM Mode
0 0
0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10
Load Current (A) Load Current (A)
VOUT1 Switching Frequency vs. Load Current VOUT2 Switching Frequency vs. Load Current
250 300
VIN = 25V, TON = VCC, EN2 = GND, EN1 = VCC, VIN = 7V, TON = VCC, EN2 = VCC, EN1 = GND,
225 275 ENLDO = VIN, FB2 = GND
ENLDO = VIN, FB1 = GND
Switching Frequency (kHz
250
200 PWM Mode
225
175 PWM Mode
200
150 175
125 150
100 125
100
75
75
50 Ultrasonic Mode Ultrasonic Mode
50
25 25
DEM Mode DEM Mode
0 0
0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10
Load Current (A) Load Current (A)
VOUT2 Switching Frequency vs. Load Current VOUT2 Switching Frequency vs. Load Current
300 300
VIN = 12V, TON = VCC, EN2 = VCC, EN1 = GND, VIN = 25V, TON = VCC, EN2 = VCC, EN1 = GND,
275 ENLDO = VIN, FB2 = GND 275 ENLDO = VIN, FB2 = GND
Switching Frequency (kHz)
Switching Frequency (kHz)
250 250
PWM Mode PWM Mode
225 225
200 200
175 175
150 150
125 125
100 100
75 75
50 Ultrasonic Mode 50 Ultrasonic Mode
25 25
DEM Mode DEM Mode
0 0
0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10
Load Current (A) Load Current (A)
LDO Output Voltage vs. Output Current VREF vs. Output Current
5.04 2.00500
VIN = 12V, EN1 = EN2 = GND, ENLDO = VIN VIN = 12V, EN1 = EN2 = GND, ENLDO = VIN
2.00475
5.036
2.00450
Output Voltage (V)
2.00425
5.032
VREF (V)
2.00400
5.028 2.00375
2.00350
5.024
2.00325
5.02 2.00300
0 10 20 30 40 50 60 70 -10 0 10 20 30 40 50
Output Current (mA) Output Current (µA)
No Load Battery Current vs. Input Voltage Standby Current vs. Input Voltage
100 216
TON = VCC, EN1 = EN2 = VCC, ENLDO = VIN No Load, EN1 = EN2 = GND, ENLDO = VIN
214
Standby Current (µA)1
10 210
206
1 204
200
0.1 198
7 9 11 13 15 17 19 21 23 25 7 9 11 13 15 17 19 21 23 25
Input Voltage (V) Input Voltage (V)
23 2.03
21 2.02
2.01
VREF (V)
19 Shutdown Current
2.00
17
1.99
15
1.98
13
1.97
11
1.96
9 1.95
7 9 11 13 15 17 19 21 23 25 -40 -25 -10 5 20 35 50 65 80 95 110 125
Input Voltage (V) Temperature (°C)
VIN EN1
(10V/Div) (5V/Div)
LDO VOUT1
(5V/Div) (5V/Div)
REF IL1
(2V/Div) (2A/Div)
CP
(10V/Div)
PGOOD1
No Load, VIN = 12V, TON = VCC, EN1 = VCC, (5V/Div) No Load, VIN = 12V,
EN2 = GND, ENLDO = VIN TON = VCC, EN1 = VCC, EN2 = GND, ENLDO = VIN
EN1 EN1
(5V/Div) (5V/Div)
VOUT1 VOUT1
(5V/Div) (5V/Div)
IL1
(2A/Div) IL1
(2A/Div)
PGOOD1 PGOOD1 ILOAD = 4A, VIN = 12V,
No Load, VIN = 12V,
(5V/Div) (5V/Div)
TON = VCC, EN1 = VCC, EN2 = GND, ENLDO = VIN TON = VCC, EN1 = VCC, EN2 = GND, ENLDO = VIN
EN2 EN2
(5V/Div) (5V/Div)
VOUT2 VOUT2
(5V/Div) (5V/Div)
IL2 IL2
(2A/Div) (2A/Div)
PGOOD2 PGOOD2
(5V/Div) No Load, VIN = 12V, (5V/Div) No Load, VIN = 12V,
TON = VCC, EN1 = GND, EN2 = VCC, ENLDO = VIN TON = VCC, EN1 = GND, EN2 = VCC, ENLDO = VIN
EN2 EN1
(5V/Div) (5V/Div)
VOUT2 EN2
(5V/Div) (5V/Div)
IL2 VOUT1
(2A/Div) (2V/Div)
PGOOD2 VOUT2
(5V/Div) ILOAD = 4A, VIN = 12V, (2V/Div)
TON = VCC, EN1 = GND, EN2 = VCC, ENLDO = VIN VIN = 12V, TON = VCC, ENLDO = VIN
VOUT1 UGATE1
(2V/Div) (20V/Div)
VOUT2 LGATE1
(2V/Div) (5V/Div)
VIN = 12V, TON = VCC, ENLDO = VIN VIN = 12V, TON = VCC, SKIP = VCC, ENLDO = VIN
IL1 IL2
(5A/Div) (2A/Div)
LGATE1 LGATE2
(5V/Div) (5V/Div)
TON = VCC, SKIP = VCC, ENLDO = VIN, FB1 = VCC TON = VCC, SKIP = VCC, ENLDO = VIN, FB2 = VCC
OVP UVP
VOUT1 VOUT1
(5V/Div) (5V/Div)
IL1
PGOOD1 (10A/Div)
(5V/Div)
VOUT2 UGATE1
(5V/Div) (20V/Div)
PGOOD2
LGATE1
(5V/Div)
VIN = 12V, TON = VCC, SKIP = GND, ENLDO = VIN (5V/Div) VIN = 12V, TON = VCC, SKIP = VCC, ENLDO = VIN
IL1
(5A/Div)
UGATE1
(20V/Div)
LGATE1
(5V/Div)
VIN = 12V, TON = VCC, SKIP = VCC, ENLDO = VIN
Time (400μs/Div)
Layout Considerations
Layout is very important in high frequency switching
converter design. If the layout is designed improperly, the
PCB could radiate excessive noise and contribute to the
converter instability. The following points must be followed
for a proper layout of RT8206A/B.
` Connect RC low pass filter from PVCC to VCC, the RC
low pass filter is composed of an external capacitor and
an internal 10Ω resistor. Bypass VCC to GND with a
capacitor 1μF is recommended. Place the capacitor
close to the IC, within 12mm (0.5 inch) if possible.
` Keep current limit setting network as close as possible
to the IC. Routing of the network should avoid coupling
to high voltage switching node.
` Connections from the drivers to the respective gate of
the high side or the low side MOSFET should be as
short as possible to reduce stray inductance. Use
0.65mm (25 mils) or wider trace.
` All sensitive analog traces and components such as
VOUTx, FBx, GND, ENx, PGOODx, ILIMx, VCC, and
D D2 SEE DETAIL A
L
1
E E2
1 1
2 2
e b
DETAIL A
A Pin #1 ID and Tie Bar Mark Options
A3
A1 Note : The configuration of the Pin #1 identifier is optional,
but must be located within the zone indicated.
Information that is provided by Richtek Technology Corporation is believed to be accurate and reliable. Richtek reserves the right to make any change in circuit
design, specification or other related things if necessary without notice at any time. No third party intellectual property infringement of the applications should be
guaranteed by users when integrating Richtek products into any application. No legal responsibility for any said applications is assumed by Richtek.