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BUZ 102 S

SPP52N05

SIPMOS ® Power Transistor

• N channel
• Enhancement mode
• Avalanche-rated
• dv /dt rated
• 175°C operating temperature
• also in SMD available

Pin 1 Pin 2 Pin 3


G D S

Type VDS ID RDS(on) Package Ordering Code

BUZ 102 S 55 V 52 A 0.023 Ω TO-220 AB Q67040-S4011-A2

Maximum Ratings
Parameter Symbol Values Unit
Continuous drain current ID A
TC = 25 °C 52
TC = 100 °C 37
Pulsed drain current IDpuls
TC = 25 °C 208
Avalanche energy, single pulse E AS mJ
ID = 52 A, V DD = 25 V, RGS = 25 Ω
L = 181 µH, Tj = 25 °C 245
Avalanche current,limited by Tjmax IAR 52 A
Avalanche energy,periodic limited by Tjmax E AR 12 mJ
Reverse diode dv/dt dv/dt kV/µs
IS = 52 A, VDS = 40 V, diF/dt = 200 A/µs
Tjmax = 175 °C 6
Gate source voltage V GS ± 20 V
Power dissipation P tot W
TC = 25 °C 120

Semiconductor Group 1 30/Jan/1998


BUZ 102 S
SPP52N05

Maximum Ratings
Parameter Symbol Values Unit
Operating temperature Tj -55 ... + 175 °C
Storage temperature Tstg -55 ... + 175
Thermal resistance, junction - case RthJC ≤ 1.25 K/W
Thermal resistance, junction - ambient RthJA ≤ 62
IEC climatic category, DIN IEC 68-1 55 / 175 / 56

Electrical Characteristics, at Tj = 25°C, unless otherwise specified

Parameter Symbol Values Unit


min. typ. max.

Static Characteristics
Drain- source breakdown voltage V (BR)DSS V
V GS = 0 V, ID = 0.25 mA, Tj = 25 °C 55 - -
Gate threshold voltage V GS(th)
V GS=V DS, ID = 90 µA 2.1 3 4
Zero gate voltage drain current IDSS µA
V DS = 50 V, V GS = 0 V, Tj = -40 °C - - 0.1
V DS = 50 V, V GS = 0 V, Tj = 25 °C - 0.1 1
V DS = 50 V, V GS = 0 V, Tj = 150 °C - - 100
Gate-source leakage current IGSS nA
V GS = 20 V, VDS = 0 V - 10 100
Drain-Source on-resistance RDS(on) Ω
V GS = 10 V, ID = 37 A - 0.016 0.023

Semiconductor Group 2 30/Jan/1998


BUZ 102 S
SPP52N05

Electrical Characteristics, at Tj = 25°C, unless otherwise specified

Parameter Symbol Values Unit


min. typ. max.

Dynamic Characteristics
Transconductance gfs S
V DS≥ 2 * ID * RDS(on)max, ID = 37 A 10 - -
Input capacitance Ciss pF
V GS = 0 V, V DS = 25 V, f = 1 MHz - 1220 1525
Output capacitance Coss
V GS = 0 V, V DS = 25 V, f = 1 MHz - 410 515
Reverse transfer capacitance Crss
V GS = 0 V, V DS = 25 V, f = 1 MHz - 210 265
Turn-on delay time td(on) ns
V DD = 30 V, VGS = 10 V, ID = 52 A
RG = 6.8 Ω - 12 18
Rise time tr
V DD = 30 V, VGS = 10 V, ID = 52 A
RG = 6.8 Ω - 22 33
Turn-off delay time td(off)
V DD = 30 V, VGS = 10 V, ID = 52 A
RG = 6.8 Ω - 30 45
Fall time tf
V DD = 30 V, VGS = 10 V, ID = 52 A
RG = 6.8 Ω - 25 40
Gate charge at threshold Qg(th) nC
V DD = 40 V, ID = 0.1 A, V GS =0 to 1 V - 1.5 2.8
Gate charge at 7.0 V Qg(7)
V DD = 40 V, ID = 52 A, VGS =0 to 7 V - 35 55
Gate charge total Qg(total)
V DD = 40 V, ID = 52 A, VGS =0 to 10 V - 45 70
Gate plateau voltage V (plateau) V
V DD = 40 V, ID = 52 A - 5.9 -

Semiconductor Group 3 30/Jan/1998


BUZ 102 S
SPP52N05

Electrical Characteristics, at Tj = 25°C, unless otherwise specified

Parameter Symbol Values Unit


min. typ. max.

Reverse Diode
Inverse diode continuous forward current IS A
TC = 25 °C - - 52
Inverse diode direct current,pulsed ISM
TC = 25 °C - - 208
Inverse diode forward voltage V SD V
V GS = 0 V, IF = 104 A - 1.2 1.7
Reverse recovery time trr ns
V R = 30 V, IF=lS, diF/dt = 100 A/µs - 70 105
Reverse recovery charge Qrr µC
V R = 30 V, IF=lS, diF/dt = 100 A/µs - 0.15 0.25

Semiconductor Group 4 30/Jan/1998


BUZ 102 S
SPP52N05

Power dissipation Drain current


Ptot = ƒ(TC) ID = ƒ(TC)
parameter: VGS ≥ 10 V

130 55

W
A
110
45
Ptot ID
100
40
90
35
80

70 30

60 25
50
20
40
15
30
10
20

10 5
0 0
0 20 40 60 80 100 120 140 °C 180 0 20 40 60 80 100 120 140 °C 180
TC TC

Safe operating area Transient thermal impedance


ID = ƒ(VDS) Zth JC = ƒ(tp)
parameter: D = 0, TC = 25°C parameter: D = tp / T

10 3 10 1

K/W

A 10 0
t = 19.0µs
p
ID ZthJC
D
/I
DS
V

10 2 10 -1
=
n)
(o
DS
R

100 µs

10 -2
D = 0.50
0.20
10 1 10 -3 0.10
1 ms
0.05
10 ms single pulse 0.02
10 -4 0.01
DC

10 0 10 -5
0 1 2 -7 -6 -5 -4 -3 -2 -1 0
10 10 V 10 10 10 10 10 10 10 10 s 10
VDS tp

Semiconductor Group 5 30/Jan/1998


BUZ 102 S
SPP52N05

Typ. output characteristics Typ. drain-source on-resistance


ID = ƒ(VDS) RDS (on) = ƒ(ID)
parameter: tp = 80 µs , Tj = 25 °C parameter: tp = 80 µs, Tj = 25 °C

120 0.070
Ptot = 120W l a b c d e f g
A k j i

V [V] 0.060
100 h GS
ID a 4.0 RDS (on)
0.055
90 b 4.5
g c 5.0 0.050
80 d 5.5 0.045
e 6.0
70 f 0.040
f 6.5
60 g 7.0 0.035
e h 7.5
50 0.030
i 8.0
j 9.0 0.025 h
40 d
k 10.0 i
0.020 j
30 l 20.0
c 0.015 k
20
0.010 V [V] =
b GS
10 a b c d e f g h i j k
0.005 4.0
4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 9.0 10.0 20.0
a
0 0.000
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 V 5.0 0 20 40 60 80 A 110
VDS ID

Typ. transfer characteristics ID = f (V GS)


parameter: tp = 80 µs
VDS≥2 x ID x RDS(on)max

120

A
I
D

80

60

40

20

0
0 1 2 3 4 5 6 7 8 V 10
VGS

Semiconductor Group 6 30/Jan/1998


BUZ 102 S
SPP52N05

Drain-source on-resistance Gate threshold voltage


RDS (on) = ƒ(Tj ) V GS(th)= f (Tj)
parameter: ID = 37 A, VGS = 10 V parameter:VGS=VDS, ID =90µA

0.075 5.0
Ω V
0.065 4.4

0.060
RDS (on) VGS(th) 4.0
0.055
3.6
0.050
3.2
0.045
2.8
0.040
0.035 2.4 max
98%
0.030 2.0
0.025 typ 1.6
0.020 typ
1.2
0.015
0.8
0.010
min
0.005 0.4
0.000 0.0
-60 -20 20 60 100 °C 180 -60 -20 20 60 100 140 V 200
Tj Tj

Typ. capacitances Forward characteristics of reverse diode


C = f (VDS) IF = ƒ(VSD)
parameter:VGS = 0V, f = 1MHz parameter: Tj , tp = 80 µs

10 4 10 3

A
C IF
pF

10 2
Ciss

10 3

10 1
C Tj = 25 °C typ
oss
Tj = 175 °C typ
Tj = 25 °C (98%)
Crss
Tj = 175 °C (98%)

10 2 10 0
0 5 10 15 20 25 30 V 40 0.0 0.4 0.8 1.2 1.6 2.0 2.4 V 3.0
VDS VSD

Semiconductor Group 7 30/Jan/1998


BUZ 102 S
SPP52N05

Avalanche energy EAS = ƒ(Tj) Typ. gate charge


parameter: ID = 52 A, VDD = 25 V VGS = ƒ(QGate)
RGS = 25 Ω, L = 181 µH parameter: ID puls = 52 A

260 16

mJ
V
220
EAS VGS
200
12
180

160 10
0,2 VDS max 0,8 VDS max
140
8
120

100 6
80
4
60

40
2
20
0 0
20 40 60 80 100 120 140 °C 180 0 10 20 30 40 50 nC 65
Tj Q Gate

Drain-source breakdown voltage


V(BR)DSS = ƒ(Tj)

65

V(BR)DSS
61

59

57

55

53

51

49
-60 -20 20 60 100 °C 180
Tj

Semiconductor Group 8 30/Jan/1998

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