NICKEL ELECTROPLATING DECK

SYSTEM STANDARD OPERATING

PROCEDURES
Version: 1.0 JUNE 2013

UNIVERSITY OF TEXAS AT ARLINGTON

Nanotechnology Research and Education Center

DOCUMENT: NICKEL ELECTROPLATING DECK SYSTEM STANDAR OPERATING PROCEDURES Version: 1.0

Center

TABLE OF CONTENTS

1.0 DESCRIPTION..…………………………………………….…….… 3
1.1 SCOPE ……………………………………………….…....... 3
1.2 SAFETY…….…………………………………….…….……. 3
2.0 H ARDWARE..............................…………………………….….... 4
3.0 OPERATING PROCEDURES.………………………..…..………...... 6
3.1 REQUESTING A NICKEL SULFAMATE CHEMICAL FILL………… 6
3.2 RUNNING AN ELECTROPLATING PROCESS…………………… 8
4.0 INDEX……………………………………………………………….. 14

2
DOCUMENT: NICKEL ELECTROPLATING DECK SYSTEM STANDAR OPERATING PROCEDURES Version: 1.0

1.0 Description

1.1 Scope
The Nickel Electroplating Deck is used for the rapid deposition of thick nickel
films. These films can be deposited on silicon or glass samples and wafers up to
4” in diameter.

1.2 Safety
1.2.1 The nickel electroplating process uses a nickel sulfamate solution in the plating
bath. This solution poses serious water contamination issues and should only be
disposed of in the proper tagged storage containers supplied by EH&S. Never pour
this solution down the drain, or rinse your samples without catching the waste water.
1.2.2 All clean wipes that are contaminated by Nickel Sulfamate solution [if they show
green stains] should be bagged, tagged and stored for proper disposal by EH&S.
DO NOT throw wipes with green nickel sulfamate stains into the standard trash
cans.
1.2.3 Nickel Sulfamate fume inhalation by the users should be avoided. When the bath is
being filled, drained or when the plating deck front panel is opened for
loading/unloading the user should be wearing a filtered air respirator with the
appropriate filters installed.
1.2.4 Only Nanofab staff may add or drain chemicals from the electroplating bath.

3
DOCUMENT: NICKEL ELECTROPLATING DECK SYSTEM STANDAR OPERATING PROCEDURES Version: 1.0

2.0 Hardware

 Rear electroplating bath with heater

 Circulation pump, filter & flow meter
 Motorized cathode agitator
 Resistivity monitor
 Separate front DI rinse bath
 Precision DC plating power supply

Cathode Agitation Bar

Circulation Pump Bath Filter Flow Meter

(Fig. A)

4
DOCUMENT: NICKEL ELECTROPLATING DECK SYSTEM STANDAR OPERATING PROCEDURES Version: 1.0

3.0 Operating Procedures

3.1 Requesting a Nickel Sulfamate Chemical Fill
3.1.1 The Nickel Sulfamate solution is drained and stored by the Nanofab staff after each
users electroplating processing has been completed. Due to this the electroplating
deck must be filled by the Nanofab staff and prepared for each users processing. All
users must give at least 24 hours advanced notice to the Nanofab Staff in order for
the electroplating bath to be filled and prepared for processing.

3.2 Running an Electroplating Process

3.2.1 If you have not requested for the electroplating bath to be filled and prepared for
processing then see Section 3.1.
3.2.2 All wafers to be electroplated must have a sufficient metal seed layer deposited in
either an evaporator or sputtering system.
3.2.3 Fill the FRONT DI RINSE BATH on the Electroplating deck (See Section 2 Fig. A)
with DI water until it is approximately 75% full.
3.2.4 Ensure that the two front panel switches labeled HEATER and PUMP (Fig. 1) are
both ON and that the Temperature controller is displaying the necessary process
temperature. If either of the switches is turned OFF or if the bath temperature is
incorrect contact Nanofab Staff.

(Fig. 1)

5
DOCUMENT: NICKEL ELECTROPLATING DECK SYSTEM STANDAR OPERATING PROCEDURES Version: 1.0

3.2.5 Mount the sample to be electroplated onto the Sample Holder (Fig. 2). Only the top
pair of sample retention clips is electrically connected to the electroplating power
supply. Ensure that both of the upper clips are contacting your previously deposited
seed layer. Failure to have the upper clips in good contact with your seed layer
will result in no deposition occurring.

(Fig. 2)
3.2.6 Install the Sample Holder onto the rear side of the agitator bar (Fig. 3) with the
sample facing the user. The sample holder should sit centered on the Agitator Bar
with the Sample Holder locking bolts tightened by hand against the agitator bar.
(Fig. 4).

(Fig. 3) (Fig. 4)

6
DOCUMENT: NICKEL ELECTROPLATING DECK SYSTEM STANDAR OPERATING PROCEDURES Version: 1.0

3.2.7 Install the Nickel Anode Plate (Fig. 5) in front of the Sample Holder. The Anode
Plate’s oval opening should face towards the sample to be electroplated or away
from the user (Fig. 6).

(Fig. 5) (Fig. 6)

3.2.8 The Nickel Anode Plate position is adjustable from front to back approx.. 2” via the
slide rail. Users should pay close attention to the distance of the Nickel Anode Plate
in relation to the Sample Holder as this distance can greatly affect the deposition
rate of the Nickel. Once a proper distance has been determined for a process it is
recommended that the user always set the Nickel Anode Plate to this distance.
3.2.9 Turn on the front panel switch labeled AGITATOR (See Fig. 1) and ensure that the
Sample Holder is now moving from side-to-side.
3.2.10 Connect the electroplating DC power supply red and black leads together (short
them out) (Fig. 7). Set the power supply for Constant Current (CC) mode and turn
ON the power supply.

(Fig. 7)

7
DOCUMENT: NICKEL ELECTROPLATING DECK SYSTEM STANDAR OPERATING PROCEDURES Version: 1.0

3.2.11 Adjust the electroplating DC power supply for the desired plating current and then
turn OFF the DC power supply.
3.2.12 Now disconnect the RED and BLACK leads from each other and connect the Black
lead from the power supply to the black wire coming from the Sample holder (See
Fig. 7).
3.2.13 Connect the Red Lead from the power supply to the bare wire coming from the
Nickel Anode Plate (Fig. 8).

(Fig. 8)

3.2.14 Begin your electroplating process by turning on the electroplating DC power supply
and then immediately start your process timer.
3.2.15 Monitor the voltage on the electroplating DC power supply’s front panel display and
ensure that the voltage does not deviate by a large amount from earlier process
runs or throughout the current process run. Large deviations in voltage can mean
improper or poor connection of the electrodes to the sample being processed.
3.2.16 Once the necessary process time has elapsed turn OFF the electroplating DC
power supply power to stop the electroplating process.
3.2.17 Disconnect the RED and BLACK leads from the Anode and Cathode.
3.2.18 Turn OFF the sample AGITATOR switch (See Fig. 1) on the system front panel.

8
DOCUMENT: NICKEL ELECTROPLATING DECK SYSTEM STANDAR OPERATING PROCEDURES Version: 1.0

3.2.19 Remove the SAMPLE CARRIER (See Fig. 2) from the nickel sulfamate solution and
while holding the carrier above the bath, allow the residual nickel sulfamate liquid to
drip back into the sulfamate bath for 15 – 20 seconds. Now set the sample carrier
into the DI water rinse bath directly in front of the Nickel Sulfamate bath.

3.2.20 Agitate the sample carrier slightly by moving it from front to back in the DI water bath
for 60 seconds to assist in the removal of the remaining Nickel Sulfamate solution.
3.2.21 Remove the sample carrier from the DI rinse bath and move it to the BAY 4 wet
hood sitting it down with the samples facing upward.
3.2.22 Remove your samples from the sample carrier and drop them into a small container
of clean DI water to allow for the complete removal of all residual Nickel Sulfamate
solution from the samples.
**NOTE** The DI water from this step should be disposed of by pouring it into the
DI rinse bath on the Nickel Electroplating deck. This water will then be properly
disposed of by EH&S. Do NOT dispose of this final rinse water by pouring it down
the drain.
3.2.23 Once all electroplating processes have been completed turn OFF the HEATER
switch (See Fig. 1) located on the system front panel.
3.2.24 Leave the pump switch ON (See Fig. 1) while the solution is cooling and notify a
Nanofab staff member that you have finished processing on the Nickel
Electroplating Deck.
3.2.25 Clean up the surrounding area and wipe up any Nickel Sulfamate that may have
dripped off of the sample carrier onto the cleanroom floor or on the Bay 4 wet hood.
3.2.26 A Nanofab staff member will drain and flush the nickel sulfamate solution from the
electroplating deck to put the system into a secure standby state.

4.0 Index