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Molecular Dynamics Simulation Study of The Mechanical Properties of Rectangular Cu Nanowires
Molecular Dynamics Simulation Study of The Mechanical Properties of Rectangular Cu Nanowires
Molecular Dynamics Simulation Study of The Mechanical Properties of Rectangular Cu Nanowires
695∼700
We investigate the mechanical properties for elongation and shear of Cu nanowires. As the
stretch velocity increased, the strains occurring the first yield and the rupture decrease, the period
of yielding gets shorter, and the magnitude of force relaxation decreases. The first yield and the
rupture at the high stretch velocity occur faster than those at low stretch velocity, and the period
of yielding and the magnitudes of force relaxation at high stretch velocity are less than those at
low stretch velocity. Before the first yielding, nanowires preserve the elastic stages, and after that,
the elongation deformation proceeds to alternate quasi-elastic and yielding stages. The deformation
preferentially takes place by slips in {111} planes. In the cases of thick nanowires, the centers layers
of the original {100} nanowire change to and remain in {111} planes because long and energetic
relaxation processes for an atomic rearrangement is necessary. Homogeneous slip occurs in the shear
processes of thin Cu {100} nanowire with high stretch velocity.
-695-
-696- Journal of the Korean Physical Society, Vol. 38, No. 6, June 2001
Fig. 5. Cu nanowire was composed of 10 atomic layer, Fig. 6. Cu nanowire was composed of 10 atomic layer, each
each of which had 18 atoms. A stable atomic configuration of which had 18 atoms. The shear velocity is 1 m/s. (a) The
was calculated by using the steepest descent method. (a) The variation of the shear force with the stretch along the x-axis
variation of shear force with the stretch along the x-axis for for a Cu nanowire. (b) Atomic arrangements at the points
a Cu nanowire. (b) Atomic arrangements at the points A-D A-D in Fig. 5(a). The arrows denote the slip directions.
in Fig. 5(a). The arrows denote the slip directions.
[5] L. Olesen, E. Laegsgaard, I. Stensgaard, F. Besenbacher, [15] G. Bilalbegovie, Phys. Rev. B 58, 15412 (1998).
J. Shiotz, P. Stoltze, K. W. Hacobsen and J. K. Norskow, [16] M. R. Sorensen, K. W. Jacobsen and P. Stoltze, Phys.
Phys. Rev. Lett. 72, 2251 (1994); 74, 2147 (1995). Rev. B 53, 2101 (1996).
[6] S. Ciraci and E. Tekman, Phys. Rev. B 40, 11969 (1989). [17] T. M. Todorov and A. P. Sutton, Phys. Rev. Lett. 70,
[7] J. M. Krans, C. J. Muller, I. K. Yanson, T. C. M. Gov- 2138 (1993).
aert, R. Hesper and J. M. Van Ruitenbeek, Phys. Rev. B [18] R. M. Lynden-Bell, Science 263, 1704 (1994).
48, 14721 (1994); J. M. Krans, C. J. Muller, N. Van der [19] H. Mehrez and S. Ciraci, Phys. Rev. B 56, 12632 (1997).
Post, F. R. Postma, A. P. Sutton, T. N. Todorov and J. [20] T. W. Ellis, L. Levine and R. Wicen, Solid State Tech-
M. Van Ruitenbeek, Phys. Rev. Lett. 74, 2146 (1995). nology 41 (4), 71 (2000)
[8] N. Agrait, G. Rubion and S. Vieira, Phys. Rev. Lett. 74, [21] J. W. Kang, K. S. Choi, K. R. Byun and H. J. Hwang,
3995 (1995); G. Rubio, N. Agarit and S. Vieira, ibid. 76, J. Korean Phys. Soc. 36, 248 (2000); J. W. Kang, K.
2302 (1996). S. Choi, J. C. Kang, K. R. Byun and H. J. Hwang, J.
[9] A. Stalder and U. Durig, Appl. Phys. Lett. 68, 637 Korean Phys. Soc. 38, 158 (2001); J. W. Kang and H. J.
(1996). Hwang, Comp. Mater. Sci. (in press); J. W. Kang, K. S.
[10] S. Dubois, L. Piraux, J. M. George, K. Ounadjela, J. L. Cho and H. J. Hwang, Comp. Mater. Sci. (in press); J.
Duvail and A. Fert, Phys. Rev. B 60, 477 (1999). W. Kang and H. J. Hwang, Phys. Rev. B (accepted).
[11] S. Tanimori and S. Shimamura, Technical Proceeding [22] D. Tomanek, A. A. Aligia and C. A. Balseiro, Phys. Rev.
of the Third International Conference on Modeling and B 32, 5051 (1985).
Simulation of Microsystems (MSM2000), San Diego, CA, [23] F. Cleri and V. Rosato, Phys. Rev. B 48, 22 (1993).
U.S.A. March 27-29, 110 (2000). [24] A. P. Sutton, Curr. Opinion Solid State Mater. Sci. 1,
[12] M. R. Sorensen, M. Brandbyge and Karsten W. Jacob- 827 (1996).
sen, Phys. Rev. B 57, 3283 (1998). [25] R. E. Hummel, Understanding Materials Science: His-
[13] K. Hansen, E. Laegsgaard, I. Stensgaard and F Besen- tory, Properties and Application, (1998 Springer, New
bacher, Phys. Rev. B 56, 2208 (1997). York), Chap. 4.
[14] A. Correia and N. Garcia, Phys. Rev. B 55, 6689 (1997).