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LaserCutting RTantra
LaserCutting RTantra
PRESENTED BY
S. SIVA PRASAD
17JA1A0316
CERTIFICATE
Basic:
1. Atoms initially at the Ground
State
2. The atoms go to Excited State
when a high energy is applied
(called ‘pumping’)
3. When atoms moves back to the
ground state, photons (particle
of light) are released
Laser Cutting
Material Removal Types of Laser Cutting
1. Vaporization: low vaporization
temperature materials
2. Fusion: Material is melted &
ejected (by an inert gas jet)
3. Reactive Fusion: dross is no
longer a metal, but an oxide
4. Thermal stress cracking or
controlled fracturing: for brittle
materials
5. Scribing: Mechanical snapping
along scribed line
6. Ablation (Excimer laser): breaking
organic material bonds
7. Burning in reactive gas
Equipment
1. Laser-beam generator
2. Beam delivery: Circular polarizers,
mirrors, beam splitters, focusing
lenses and fiber optic couplings
3. Workpiece positioning
4. Auxiliary devices: Laser head, safety
equipment, etc.
In addition, assist gases also required
Smart Laser Cutting System
Picture from
[2]
Different Type of Laser for Laser Cutting
1. CO2 laser (most
commonly used for laser
cutting):
a. Have the highest
Continuous Wave (CW)
power
b. Capable to extract as
much as 10kW/m of
discharge tube (with
CO2 Laser Schematic [8]
traverse flow laser)
c. Have a high energy
efficiency (up to 10%)
d. Capable of both CW
and Pulsed operation
(5kHz)
2. Nd:YAG:
a. has the highest peak power for pulsed
operation
b. May be operated in either CW or pulsed
(200Hz) temporal modes