This document lists common defects that can occur during tablet manufacturing including capping/chipping where the top or bottom separates or a small portion is removed, cracking/double impression due to expansion or punch rotation, lamination where the tablet separates into layers, and mottling/picking/sticking where color is uneven or the tablet adheres to equipment.
This document lists common defects that can occur during tablet manufacturing including capping/chipping where the top or bottom separates or a small portion is removed, cracking/double impression due to expansion or punch rotation, lamination where the tablet separates into layers, and mottling/picking/sticking where color is uneven or the tablet adheres to equipment.
This document lists common defects that can occur during tablet manufacturing including capping/chipping where the top or bottom separates or a small portion is removed, cracking/double impression due to expansion or punch rotation, lamination where the tablet separates into layers, and mottling/picking/sticking where color is uneven or the tablet adheres to equipment.