Manual Minicontac-Rs: English, Version 3.0

Manual MiniContac-RS
English, version 3.0
LPKF Laser & Electronics AG

Osteriede 7
D-30827 Garbsen
Telefon : ++ 49 - 51 31 - 70 95 - 0
Telefax : ++ 49 - 51 31 - 70 95 - 90
eMail : lpkf@lpkf.de
Homepage : http: //www.lpkf.de
Copyright (c) 2006 LPKF AG
Any distribution or copying of this manual and use of its contents require
the written permission of the LPFK AG. Subject to modifications. We
cannot be held liable for the contents. In particular, we cannot be held
liable for damage resulting from existing, non-existing or faulty informa-
tion.
Trademark: HP GL is a trademark of the Hewlett Packard Comp. All
other trademarks belong to their respective owners.
Part number 120405
2 Version 3.0 Revision 22.1.07 MiniContac-RS

Information on this manual
It is the duty of the system owner to care for and plan these measures as
well as to control their execution. The owner has to ensure that
• the system is only used as intendet

• the system is only operated in perfect and functional
condition. Especially the function of the safety appliances
has to be checked regularly
• the necessary personal protective equipment for the
operating, maintaining and repairing personnel is available
and being used
• the operating manual is kept legible and complete at the
place of operation
• this personnel is regularly instructed in matters of work
safety and environmental protection and is informed on the
operation manual and especially the safety instructions
• all safety and warning notes or signs stay on the system and
are legible
MiniContac-RS Version 3.0 Revision 22.1.07 3

I. Orientation
1. Introduction
2. Products supplied
3. Safety regulations
4. Description of the machine
5. Menus
6. Setting up
7. Description of operating procedure
8. Maintenance and servicing
9. Waste disposal
10. Appendix
II. Conventions used in this manual

Bold text is used to emphasise important information.
Illustrations are numbered. Example: Fig. 5

› Prompts for actions are identified with an arrow.
Italic sections are used to indicate the reactions consequent on an

action.
Words printed in italics mark proper names
Key inscriptions and menu terms are printed in BOLD CAPITALS.
III. Notes on the symbols used
Danger! This symbol is used to highlight danger to life or health.
Caution! This symbol is used to identify hazards which may cause

damage.
Note: This symbol is used for notes intended to help you avoid faults in
operation or to help you improve your procedures.

IV. Target Group
This manual is written for people with basic knowledge in PCB
production, including the production of multilayer PCBs for
electronics
V. Intended use
The LPKF MiniContac-RS is used for through-plating printed circuit
boards. Minimum diameter of the holes is 0.2 mm, and metalization is
done according to the black-hole method. The equipment can also
process double-sided and multilayer boards. Any other use is not
permitted or requires the prior approval of LPKF AG.

Table of contents
1.0 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . 9
2.0 Products Supplied . . . . . . . . . . . . . . . . . . . 10
2.1 Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
3.0 Safety Regulations . . . . . . . . . . . . . . . . . . . 11
4.0 Description of the Machine . . . . . . . . . . . . 12
4.1 Description of the individual containers . . . . . . . . .14
4.1.1 Filling level sensor . . . . . . . . . . . . . . . . . . . . . . . . 17
4.2 Locking into place of the printed circuit board holder .

17
4.3 Operating unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . .19
4.4 Technical Description of the Surroundings . . . . . . .20
4.5 Electrical Connections . . . . . . . . . . . . . . . . . . . . . .20
4.6 Technical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . .21
4.7 Reverse Pulse Plating . . . . . . . . . . . . . . . . . . . . . .22
5.0 Menus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
5.1 Menu guidance. . . . . . . . . . . . . . . . . . . . . . . . . . . .24
5.2 Changing the individual menu items . . . . . . . . . . .25
5.3 Profiles menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
5.4 Phases menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
5.5 Setup menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28
5.6 Service menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

6.0 Setting Up . . . . . . . . . . . . . . . . . . . . . . . . . . 29
7.0 Description of operating procedure. . . . . 31
8.0 Maintenance and servicing . . . . . . . . . . . . 36
8.1 Emptying the containers . . . . . . . . . . . . . . . . . . . . .39
9.0 Waste Disposal . . . . . . . . . . . . . . . . . . . . . 40
10.0 Appendix. . . . . . . . . . . . . . . . . . . . . . . . . . 41
10.1 Error codes and troubleshooting . . . . . . . . . . . . .41
10.2 Exchanging the fuses . . . . . . . . . . . . . . . . . . . . . .42
10.2.1 Exchanging the Main Fuse . . . . . . . . . . . . . . . . 42

10.2.2 Electronics fuse . . . . . . . . . . . . . . . . . . . . . . . . . 43
10.2.3 Fuse of the heating . . . . . . . . . . . . . . . . . . . . . . 45
10.3 Through-hole Plating Record . . . . . . . . . . . . . . . .46
10.4 Inspection Report 1 . . . . . . . . . . . . . . . . . . . . . . .47
10.5 Translation of Inspection Report 1 . . . . . . . . . . . .48
10.10 Inspection Report 4 . . . . . . . . . . . . . . . . . . . . . .53
10.11 Translation of Inspection Report 4 . . . . . . . . . . .54

10.19 Inspection Report . . . . . . . . . . . . . . . . . . . . . . . .62
10.21 Inspection Report . . . . . . . . . . . . . . . . . . . . . . . .64
10.24 Declaration of Conformity (German) . . . . . . . . .67
10.25 Declaration of Conformity. . . . . . . . . . . . . . . . . .69
11.0 Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 71
12.0 Safety Data Sheet . . . . . . . . . . . . . . . . . . . 73

Introduction
1.0 Introduction
Dear Customer
May we congratulate you on your choice of the LPKF MiniContac-RS

system for through-hole plating in the laboratory.
This is the simplest system for galvanic through-hole plating to use in

terms of the number of baths and production steps that we know of on
the market. The process requires no specialist knowledge of chemistry
or galvanizing.
Nevertheless, as with all galvanizing systems, the instructions in the

operating manual must be followed carefully, otherwise there is a
significant danger of a bath being damaged to such an extent that it can
no longer be used.
In particular we would like to draw on our experience and bring to

your attention the following possible errors:
• ! MAKE SURE THAT THE AMBIENT TEMPERATURE DURING

THE OPERATION IS BETWEEN 18° - 25°C / 64,4° - 77° F
(OVERNIGHT, FOR EXAMPLE) !
• Pay particular attention to careful rinsing. It is absolutely
important that no chemical liquids get from one bath into the
other. You must also rinse the circuit board holder carefully
after use.
• Do not use steel wool or similar materials to clean circuit
boards. Even the tiniest particle of metal is enough to
destroy a bath.
• Always keep the baths covered, in other words, keep them
as clean as humanly possible. This will ensure them a long
lifetime.
• Ensure that drillings are technically perfect. Please observe
the drilling parameters.
• Ammonia and chlorine vapours must not be allowed to
escape into the room.
• An air extraction system can be installed over the machine
but there must be no draft created over the baths.
• A ventilation system must not be installed over the baths.
• We recommend that you receive a basic training from our
subject expert. This will provide you with tips and expertise
for your entire circuit board production process.
We are certain that by following these notes and the instructions that
follow you will achieve reliable through-hole plating and will be satisfied
with the LPKF MiniContac-RS system in all respects.

Products Supplied
2.0 Products Supplied
The following items are supplied with the LPKF MiniContac-RS:
• 2 x Phosphorised copper anodes

• 2 x holders (1 with electric connection, 1 without electric
connection)
• 3 x covers (common cover for containers 1 + 2, separate covers
for containers 3 + 4)
• 1 x measuring cup
• Pan
• Squeeze bottle
• Scraper
• Adhesive tape
• Hose clamp
• This manual
Not included in the materials supplied:
• Distilled or deionized water

• Container for disposing of spent chemicals
• Basin for rinsing the boards
2.1 Accessories
The chemicals for through-plating are not included but can be ordered
from LPKF.
• 6 l CLEANER 110
• 5 l CLEANER 210
• 4 l ACTIVATOR 310
• 16 l COPPER PLATER 400
• 0.25 l SHINE 400
Note: Provide the containers with the delivered chemicals with

stickers or do not remove existing stickers, respectively, and store
them for filling with the corresponding used chemicals.

Safety Regulations
3.0 Safety Regulations
The user must have read this manual, paying particular attention to the
safety instructions printed in bold, to ensure safe working with this
system.
• Never reach into the machine when it is running.

• Avoid all contact with the fluids. (If the fluids have contact
with the skin or even the eye, immediately rinse thoroughly
with water and contact an ophthalmologist.)
• Never prepare or eat food while operating the machine.
• Wash your hands after operating the machine.
• Wear suitable protective clothing when filling or draining the
machine. (safety glasses and gloves)
• Never drink the fluids.
• Do not allow any of the fluids to escape when working on the
machine.
• Modifications carried out on the machine by you may
jeopardize the safety of the machine and are not covered by
the terms of the warranty.
• Please note that some materials can produce toxic gasses
during processing. Obtain information on this from your
materials supplier.
• Always work in rooms with ventilation or air extraction.
(operation with opened windows). A danger of air pollution
caused by operating a MiniContac-RS system could not be
established by internal measurements.
• Exchange of air 7 times if possible
• Please follow the instructions given on the containers and/
or separate safety leaflets when using chemicals.
• Only use chemicals for the purposes for which they are
intended.
• Keep your workplace clear.
• Observe safety instructions.

Description of the Machine
4.0 Description of the Machine
The machine consists of a stable plastic casing and a metal case with
working containers for the baths and their associated motion
mechanism, the operating unit, the control unit with status display and
the circuit board holders.
The operating unit containing the main switch and the control unit is
located on the right-hand side.
The dimensions of the machine are: approx. 750 mm x 525 mm x

500 mm (W x H x D).
Fig. 1: MiniContac RS
14 13 12
11
10
2
8
7
5 6
1- Container 1 8- Cooling element
2- Container 2 9- Cathode connection
3- Container 3 10- Status display
4- Container 4 11- Material holder with electrical connection (Cathode)
5- Pan 12- Heating element
6- Connection Ethernet /RS232 13- Material holder without electrical connection
7- Main switch 14- Thermometer
Caution! Use the material holder with the electrical connection

only for the container with COPPER PLATER.

Fig. 2:Rear view of MiniContac-RS

with outlet hoses
1 2 3 4 5 6
1- Hose clamp 4- Outlet hose container 3
2- Clamping bar 5- Outlet hose container 2
3- Outlet hose container 4 6- Outlet hose container 1
The rear side contains one outlet hose per basin. If liquid should drain
from a basin, it will be collected in the pan. In such a case, please
contact the LPKF Service.

4.1 Description of the individual containers
Fig. 3: Bath arrangement
1 2 3 4
1- Cleaner 110 3- Activator 310
2- Cleaner 210 4- Copper Plater 400
Container 1
Degreasing and drilling preparation
Solution: 1 (=CLEANER 110)

Inside dimensions: approximately 45 mm x 328 mm x 363 mm
(W x H x D)
Volume of chemical 5 liters
fluid:
Heating: approximately 55 °C
Frame motion: Lift approximately 12 mm
Drainage: via syphon
Container cover: yes, combined cover for containers 1+ 2
The supplied amount of chemicals is larger than the volume of the

container, so the filling level of the container must not be exceeded
during filling-in of the chemicals. The filling level is indicated by a
triangular marking on the container wall.

Container 2
Preparation
Solution: 2 (=CLEANER 210)

(W x H x D)
Volume of chemical 5 liters
fluid:
Heating: none
Container cover: yes, combined cover for containers 1 +2
The supplied amount of chemicals is larger than the volume of the

container, so the filling level of the container must not be exceeded
during filling-in of the chemicals. The filling level is indicated by a
triangular marking on the inside of the container wall.
Container 3
Activation
Solution: 3 (=Activator 310)

(W x H x D)
Volume of chemical 3.8 liters
fluid:
Heating: none
Container cover: yes
The filling level is indicated by a triangular marking on the container wall.

Container 4
Copper plating
Solution: 4 (=COPPER PLATER 400)

(W x H x D)
Volume of chemical 14.3 liters
fluid:
Heating: none
Container cover: yes
Two copper rails are fitted in the container to hold the 2 phosphatized
copper anodes (see „Locking into place of the printed circuit board
holder“ on page 17).
The filling level for container 4 is such that the chemicals have to be filled
in up to a level of approx. 5 mm below the copper bars.
Note: The MiniContac-RS is not provided with a container for

rinsing or drying. Nevertheless, the circuit board needs to be
rinsed which has to be done externally in a separate container or
basin.

4.1.1 Filling level sensor
A filling level sensor is located at the rear left side of the container 1 to
monitor the filling level of the bath. If the sensor is not moistened with
fluid when the MiniContac-RS is switched on, then the heating will
remain switched off. The heating is switched on automatically when the
system is switched on, provided the sensor is moistened with fluid. The
temperature is preset.
Note: Before starting to work with a PCB check the thermometer to

see whether the correct working temperature of 55°C (131 F) is
reached.
Fig. 4:Filling level sensor
1- Filling level sensor 2- Thermometer
4.2 Locking into place of the printed circuit board

holder
When handling the printed circuit board holder, proceed as follows:
Note: This handling applies to the usual printed circuit board

holder and to the printed circuit board holder with cathode
connection.
› Place the holes provided in the printed circuit board holder on the
pins at the frame of the basin edge (see following figure).

Fig. 5:
1
3
1- circuit board holder 2- circuit board 3- Plug for cathode holder
› Move the printed circuit board holder such that the clamping piece
locks into place under the frame (see following figure).
Fig. 6:

4.3 Operating unit
Fig. 7:
After switching on, the following message appears on the display:
Fig. 8: Display operating unit
Now the system is in the warm-up phase.
Note: Chapter „5.5“ on page 28 describes how to set the language

selection.
The arrows marked in fig. 8 on page 19 show the selected menu.
The keys have the following functions:
The selection is done via the and keys.
Press the key, to go to the next higher level (ESC).
Press the key to activate the selected menu (see fig. 8 on

page 19 ) (ENT).
The description of the individual menus can be found in chapter see

„Menus“ on page 24.

4.4 Technical Description of the Surroundings

Voltage supply connection (230 / 115 V) must be protected against fault
current. This connection is to be supplied by the user.
The connection for voltage supply is located on the right side of the
system, at the main switch.
The electrical connection is done using an 230/115 V connection cable.
4.5 Electrical Connections
The machine can be run on 230 V (+15%/-30%) 50 Hz or 115 V (+ 15%/

-30%).
Power is supplied via a power cord with shock-proof plug.
Fig. 9: Electric connections/main

switch
1- Main switch 3- Voltage unit for voltage selection

2- Connection for mains cable
The voltage can be switched to be either 110-120 V or 220-240 V.

The top of the white triangle behind the voltage that is applied is directed
towards the rectangular white marking outside of the voltage unit,
indicating the voltage of the delivery state. In order to switch the voltage
(see figure above) carefully remove the voltage unit (3) by means of a
screwdriver. Then turn it around by 180° and insert it again. Make sure
that the arrow marking on the module is directed at the white marking on
the edge.

Fig. 10:Side view of MiniContac-RS,
1 2 3
1- Connection RS 232 3- Main switch

2- Connection Ethernet
Software updates can be effected via the RS 232 connection.
4.6 Technical Data
The MiniContac-RS is a desktop system.
Approx. dimensions and connection values:
Width 750 mm
Depth 500 mm
Height 525 mm
Weight approx. 47 kg (without chemicals)

Voltage 230 V +15% / -30%, 50 - 60 Hz
115 V +15% / -30%, 50 - 60 Hz
In order to switch the voltage, the bridge at the main switch must be
inserted in the corresponding position.
Power transformer 375 W
AMBIENT TEMPERATURE 18°-25° C (64,4° F - 77° F)
Max. size of base material: 230 mm x 330 mm

Max. size of printed circuit board: approx. 200 mm x 260 mm

4.7 Reverse Pulse Plating

The Reverse Pulse Plating is realized by means of a special LPKF
control electronics which monitors the complete through-plating process.
During the standard galvanisation, more material is deposited at the

corners of bore holes than within the holes, which is due to the
distribution of the flux lines. This formation of a bulge at the edges is
called „bone effect“ and occurs especially at a high aspect ratio (see left
part in fig. 11, „Bone effect,“ on page 22.
Fig. 11:Bone effect
During Reverse Pulse Plating the workpiece is shortly anodically poled

by applying a reverse pulse. This causes a part of the material to be
removed again at the bulges so that generally the copper deposition
becomes more constant and the aspect ratio is improved (see right part
in fig. 11 on page 22).
Fig. 12:Standard galvanisation
I = constant, standard galvanisation

Fig. 13:Galvanisation with reverse

pulse plating
+
-I

Menus
5.0 Menus
The following menus can be selected on the system:
• PROFILES
• PHASES
• SETUP
• SERVICE
5.1 Menu guidance

Below the menu guidance is explained with reference to an example
(Menu PROFILES).
Note: The application of this menu guidance applies to all available

menus
Fig. 14: Menu guidance
› Select the desired menu item by pressing the or key.
› Then activate the selected menu item by pressing the key

(ENT).
To leave the selected menu item, press the key (ENT).

Menus
5.2 Changing the individual menu items

To change the individual menu items, proceed as follows (Example:
PROFILES):
Fig. 15:
› Select the menu item to be changed (Example: time bath 1).

Edit the entered time as follows:
› Select the input position by pressing the key.
› To select the numbers, press the and keys.
To cancel the input, press the key (ESC).
› Press the key up to the last input position (^ ENT).

The input is applied.
› After the input, press the key (ESC) as often as necessary to

return to the main menu.
Note: Should any problems arise, please contact the LPKF service
personnel.

Menus
5.3 Profiles menu

Profiles 1 through 7 have been edited by LPKF for circuit board size 9” x
12”. When using different circuit board sizes, the current value must be
recalculated and the profile changed accordingly (see „Changing the
individual menu items“ on page 25).
The current value is calculated as follows:
Per 100 square inch of surface area, a value of 5.2 ampere is required.
Example:
Base material size 9“ x 12“ = 108 square inch

Surface area = front and rear side 108 square inch x 2 = 216 square inch
216 square inch = 216 x 5.2 A = 11.2 A
100
Current must be set to = 11.2 A

Maximum current to be set = 13 A
The data listed in the table can be changed individually under the menu
item CHANGE (see „Changing the individual menu items“ on page 25):
Change Example Remark

Time bath 1 15 min. Enter time
Current 10 A Current intensity
RPP Yes/No on/off
To select one of the profiles 1-9, go to the menu item SELECTION. If the
selection is saved, the selected profile will still be active the next time the
system is switched on.
Profile 1 (standard)
Note: The following information applies to bores > 0.4 mm
Bath 1: 55°C 15 minutes Pre-cleaning

Bath 2: Room temperature 5 minutes Cleaning
Bath 3: Room temperature 15 minutes Activation
Bath 4: Room temperature (<30°C)90 minutes Galvanization
Current 11 Ampere Current intensity
RPP Yes/No on/off

Menus
Profile 2 (standard + RPP)
Note: The following information applies to bores < 0.4 mm

RPP Yes/No on/off
Profile 3 (multilayer)

RPP Yes/No on/off
Profile 4 (multilayer + RPP)


RPP Yes/No on/off
Profile 5 (flexible circuit boards)

RPP Yes/No on/off
Profile 6 (flexible circuit boards + RPP)

RPP Yes/No on/off
Profile 7 (initialization)
Note: This profile must be used for commissioning.

Menus
Profile 8
Can be defined by the user.
Profile 9
Can be defined by the user.
5.4 Phases menu

The circuit board is processed in the order PHASE 1 through PHASE 4
(see „Description of operating procedure“ on page 31) .
Phase Input Remark

Phases 1 - 4 Start Phase is starting
Phases 1 - 4 Pause Phase is interrupted
Phases 1 - 4 Change Current data of the phase
can be changed!
(see chapter „5.2“ on page 25)
Phases 1 - 4 End Ending the phase
Note: Data such as time, current intensity and RPP for the current
phase can be changed under the menu item CHANGE.
5.5 Setup menu

The following settings have been defined in the SETUP menu and can
be changed, as described in chapter „5.2“ on page 25:
Setting Input Remark

Save Save configuration in the EEPROM
Acoustic signal Yes/No Beeper on/off
Factory setting Set factory setting
Message Yes/No Message service on/off
Language German Language selection
English
Interface RS232/ Interface selection
Ethernet
Version Annunciation of the firmware-version
5.6 Service menu
Note: The SERVICE is used exclusively by the LPKF service

personnel.

Setting Up
6.0 Setting Up
Caution! The foamed plastic packaging material of the immersion

heater must be removed before setting the MiniContac-RS up for
operation!
Prior to startup, the phosphated copper anodes included in the delivery
must be inserted in container 4. To do so, proceed as follows:
Fig. 16:
2
2
1
1- Anode screws 2- anode holder (see arrows)
› First remove the anode screw from the anode holder in container 4.
› For protection, place a soft base (e.g. the foam packing material of
the heating element) in container 4.
› Remove the packaging of the copper anode plates.
› Carefully place the first copper anode plate in container 4 on the
base and then screw down the latter on the anode holder using the
anode screws.
› Repeat the same procedure for the second copper anode.
› Remove the base from container 4 and make sure that no residues
remain in the cleaned container.

Setting Up
The containers have already been cleaned and rinsed before delivery.
You can immediately pour in the through-hole plating chemicals.
Danger: When filling or emptying the system, it is absolutely

necessary to wear suitable protective clothing (safety goggles and
protective gloves) as contact with chemicals can result in acid
burns!
Caution! Always make sure that the first bath is sufficiently topped
up. Top up with demineralized water if necessary.
Caution! Container 3 of the ACTIVATOR has to be absolutely dry

before filling and should be the last one to be filled.
The maximum filling height is marked with an engraved triangle in
• Container 1 (CLEANER 110)

• Container 2 (CLEANER 210)
• Container 3 (ACTIVATOR 310)
The filling level for container 4 ( COPPER PLATER 400) is such that the
chemicals have to be filled in up to a level of approx. 5 mm below the
copper bars.
Caution! For the COPPER PLATER 400 you have to add 2 ml of

SHINE 400 (use the enclosed measuring cup) per liter of bath
volume (do this only shortly before putting the bath into operation).
After inserting the copper anodes and filling the container, the system
can be put into operation. To do so, proceed as follows:
› Connect the device (see fig. 9 on page 20) and switch it on.
The device will start heating up the bath in container 1, which will be
shown on the display (see fig. 7 on page 19).
Note: Before starting to work with a PCB, you should check the
thermometer to see if the working temperature of approx. 55°C
(131 F) is reached.
› Clamp a dummy plate into the circuit board holder.

› Thoroughly rinse the dummy plate in an external container or sink.
› Then move the dummy plate into container 1 (CLEANER 110).
Now select PROFILE 7 and start the PHASES menu (see „Menu
guidance“ on page 24)
Caution! It is imperative that you observe instructions in the safety

data sheets for CLEANER 110, CLEANER 210, ACTIVATOR 310,
COPPER PLATER 400 and SHINE 400!
These must be fixed to the machine so that they are clearly visible.
Caution! Use the material holder with the electrical connection

only for the container no. 4.

Description of operating procedure
7.0 Description of operating procedure
Circuit boards must only be drilled with hard-metal drills suitable for
drilling board material. They should fall within the drilling parameters
which you can obtain from the machine manuals or the tool libraries in
BoardMaster.
You may only use FR4 material as the base material.

Ideally you should use FR4 with a 5 µm or 9 µm copper coating
(depending on availability). This material only needs rinsing to clean the
drillings as it is protected by a copper film.
You will need to deburr the circuit board after drilling and brush or scrub
the surface with, for example, artificial fleece (not with steel wool) if you
are using a board material without a protective film, for example 18/
18µm FR4. Rinse the circuit board thoroughly with water, paying
particular attention to the drillings.
Caution! Never blast clean with oil-containing compressed air. Any

oil residues could destroy the chemicals or have a negative
influence on the quality of the through plating.
Attention! To produce a multilayer, cover up the outer edge with

the adhesive tape included in the delivery, in order to prevent
contamination with chemicals.
Note: Before starting to work with a PCB, you should check the
thermometer to see if the working temperature of approx. 55°C
(131 F) is reached.
Before starting the actual circuit board processing, select the profile
adapted to your requirements. If you do not use a circuit board material
of size 9” x 12”, the profiles must be edited to suit your circuit board size
(see „Profiles menu“ on page 26).
Note: In the menu item PROFILES / INPUT / RPP, you can select
between copper plating or RPP copper plating (see „Reverse Pulse
Plating“ on page 22 and see „Profiles menu“ on page 26 ).

burns!
› Fix the base material in the PCB holder.

› Rinse off the circuit board thoroughly in an external container or
washing basin.
› Send the circuit board into Container 1 (CLEANER 110).
› Start PHASE 1.
If the countdown to zero is completed, a buzzer will sound and a
prompt will appear in the display asking you to rinse.

› Finish PHASE 1.
› Take the board out of container 1 and thorougly rinse it off in an
external container.
Caution! The circuit board must be rinsed off immediately it has

been treated in the CLEANER 110 bath to ensure that the
degreasing chemicals do not harden. To do this, move the circuit
board up and down in a jet of water for about 15 times or at least 30
sec. Make sure that the circuit board mountings are also rinsed off
to prevent the transfer of chemicals.
› Once the circuit board has been thoroughly rinsed, send it to

Container 2 (CLEANER 210),
› Start PHASE 2.
If the countdown to zero is completed, a buzzer will sound and a
prompt will appear in the display asking you to rinse and then to dry.
› Finish PHASE 2.
› Rinse off the circuit board in an external container with drinking water
and then with demineralized water! Otherwise the Activator bath can
lose its effectiveness.
› Then blow off the PCB with oil-free compressed air. This is to
prevent water remaining in the drill holes.
Afterwards dry the board completely with warm air.
Caution: Do not allow water to get into the activator!
Containers 1 and 2 must now be covered to avoid evaporation of the

chemicals. Container 4 must also be covered.
Note: Stir the ACTIVATOR with a glas fiber stick before you put the
circuit board into the bath. When the filling level is too low only fill
up with ACTIVATOR 310.
› Afterwards put into the Container 3 (ACTIVATOR ).

› Start PHASE 3.
If the countdown to zero is completed, a buzzer will sound five times
and a prompt will appear in the display asking you to dry.
› Finish PHASE 3.
› Take out the board.
› Wipe the ACTIVATOR off the surface of both sides with the scraper
so that the remaining liquid will drop back into Container 3
› Remove the PCB holder.
› Let the board dry thorougly (e.g. use a hair dryer - temperature <
55°C - or wait for a correspondingly long period of time) and remove
excessive activator by carefully tapping the board on a soft support
material.
The ACTIVATOR can also be dried in the drying cabinet at 55°C.

Make sure that the drillings are free from chemical residues.
Caution! Never blast clean with compressed air. Any oil residues
could destroy the chemicals.
› Should you use FR4 material with copper foil, pull it off after drying.
Attention! To produce a multilayer, cover up the outer edge with

the adhesive tape included in the delivery, in order to prevent
contamination with chemicals.
Note: When you use base material without a protective film, then
pat dry using a fibre-free damp cloth very carefully so as not to
wipe the ACTIVATOR out of the drillings.
› Clamp the circuit board into the circuit board holder with cathode
connection.
› Make sure that the plug has been plugged into the cathode holder.
› Only now can you move the circuit board into Container 4 (COPPER
PLATER 400).
› Start PHASE 4.
The circuit board should be removed after 15-20 minutes and checked to
see that all the drillings have been copper plated.
Danger! Make sure to wear protective gloves and safety glasses

while checking the board.
› Press PAUSE button to interrupt the through-plating process.
The countdown of the time is then interrupted.
› Take out the board and rinse it in an external container with tap
water.
› Check the board.
› After you have checked the circuit board and put it back in the
container, press the START button again, then the countdown is
resumed at the point where it has been interrupted.
When the first half has expired, a buzzer will sound, and a prompt will
appear asking you to turn over the circuit board.
› Take out the circuit board along with the circuit board holder, turn it
over by 180° and re-insert it.
› Press again START.
When the countdown to zero is complete, a buzzer will sound and a
prompt will appear in the display asking you to rinse and then to dry.
› Finish PHASE 4.
Note: Copper will be deposited at a rate of approximately 0.1-0.1 µm

per minute depending on the temperature of the bath, the current
level, the size of the circuit board and the quality of the chemicals
used. Thus approximately 6-12 µm of copper will form in sixty
minutes.

Caution: Please note that the values given for the potential copper
thickness are the approximate values that can be deposited using a
machine such as the LPKF MiniContac-RS under laboratory
conditions.
You will have to through-hole plate several test circuit boards and use
micrographs to determine the actual wall thickness if you need to obtain
precise data on the thickness of copper deposited in the drillings.
You can begin through-hole plating the circuit boards themselves once
you have determined the parameters for the wall thickness you require.
We recommend that you use the parameters specified by us to obtain
satisfactory through-hole plating.
The galvanisation process can be repeated as often as you choose.
In order to finish the process, proceed as follows.
› Always allow the circuit board to drip off completely over the bath.
By letting the PCB drip off over bath 4 (COPPER PLATER 400) you can
save chemicals and at the same time act environmentally friendly.
› Take the PCB with its holder out of bath 4
Fig. 17:Spraying the board
› Use the supplied spray bottle to spray the PCB on both sides with
distilled or demineralized water (see fig. 17 on page 34) over bath 5.
› Let this water run back into the COPPER PLATER 400 bath, as it
then compensates for any loss due to spreading or evaporation of
chemicals.
When the through-hole plating is terminated rinse the board in an

external container or basin for at least 30 seconds, using demineralized
running water.
Danger! Do not rinse the board for less than 30 seconds as the
operator may otherwise come in contact with any acid residue on
the board. Moreover, due to the danger of water pollution the waste
water may then no longer be disposed of in the sewerage.

› Now dry the circuit board, preferably in warm air. This should be
carried out as quickly as possible to prevent oxidation of the copper
in the drillings.
Note: The quality of the surface finish on the circuit board may be
poor and the life of the chemicals will be reduced if too high a
current is used.

Maintenance and servicing
8.0 Maintenance and servicing
Machine
The machine itself is maintenance-free.
It is important that you cover up the baths immediately work is completed

to prevent contamination.
The machine must be carefully cleaned from time to time and must be
kept clean.
Baths
Container 1 Degreasing Product: CLEANER 110
Cover the container during breaks in working when neither container 1

nor 2 are in use.
Fluid lost through evaporation can be replaced with distilled or
demineralized water. (Change the chemicals after 3 months or when
they clearly changed color ).
Note: Avoid unnecessary heating, this will affect the lifetime of the
chemicals.
Container 2 Preparation Product: CLEANER 210
Cover the container during breaks in working when neither container 1

nor 2 are in use.
Fluid lost through evaporation can be replaced with distilled or
demineralized water.
(Change the chemicals after 3 months or when they clearly changed
color).
Container 3 Activation Product: ACTIVATOR 310
Cover the container during breaks in working.

The bath is extremely sensitive to other components and acid ions. It
has to be handled with great care.
Remainings of CLEANER 110, CLEANER 210, COPPERPLATER 400,

tap water, all acid chemicals or metal chips can lead to a failure of the
bath already after a short time. It is irrelevant whether the bath is used or
not. The contents of the bath should be thoroughly mixed once a week if
the bath is not being used.
Please only put completely dry PCBs into the ACTIVATOR bath. Other
liquids like water are not allowed to get into the bath. So please blow off
the PCB with oil-free compressed air to guarantee it being free from oil
and water. Afterwards dry with warm air (dryer) < 55°C.
Note: Filling only with ACTIVATOR.

After taking the PCB out of the ACTIVATOR bath, the surplus
ACTIVATOR liquid has to be wiped off the surface into the bath with the
scraper. Afterwards the drill holes are dried and blown free which is
followed by visual control.
› Let the board dry thoroughly (e.g. use a hair-dryer - temperature <
55°C - or wait for a correspondingly long period of time) and remove
excessive activator by tapping the board carefully on a soft underlay
material, only then go to the CopperPlater bath.
The ACTIVATOR can also be dried in the drying cabinet 55°C.
Note: After work breaks (longer than one day) thoroughly stir the
bath with a glass fibre stick or similar for 2-3 minutes.
Fluid lost can be topped up with ACTIVATOR 310.
Caution! Never add water to the ACTIVATOR bath otherwise the

through-hole plating will be out of order.
The bath must be made up anew after a maximum of one year.

Make sure that the dispersion is thoroughly mixed when doing this.
Caution! Chemicals which have splashed onto the machine should

be removed with soft cloths, not with abrasive materials. Otherwise
the machine’s plastic surface will be roughened, making it harder
still to remove the chemicals.
Container 4 Copper plating Product: COPPER

PLATER 400
Cover the container during breaks in working. Filter the chemicals from
time to time.
› To do so, empty the bath (see „Emptying the containers“ on page 39)
and pour the contents into a can, passing it preferably through
several coffee filters fitted into each other.
Note: Do not rinse the black coating off the anodes as it is

important for their function. However, you must make sure that
particles of the black coating do not break loose and get into the
bath otherwise these particles must be filtered out (see „Emptying
the containers“ on page 39).
Fluid lost should be topped up with COPPER PLATER 400.
› The COPPER PLATER 400 container should be checked visually

every week to see if cystals of copper sulphate have formed at the
walls and edges of the container.
› These crystals can be put back into the bath.
› Then wipe off the brim and edges of the container with a piece of
cloth that is wetted with demineralized water.

Caution! Do not allow crystals of copper sulphate or remains of

COPPER PLATER 400 chemicals to get into the adjacent
ACTIVATOR container as this would destroy the ACTIVATOR
chemicals. In this case all warranty claims are forfeited.
If the COPPER PLATER 400 bath is still working satisfactorily but the
copper plate appears dull or coarsely crystalline, this can be corrected
by the addition of SHINE 400. The chemical admix SHINE 400 is used
up in dependence on the throughput. 5ml SHINE 400 must be added
after 8 process cycles or 100 ampere-hours.
Ampere-hours/circuit board=
Adjusted electicity x time in bath – then add up all circuit boards.
Take records of the through-hole plating.
Note: The service life of the bath is approximately one year.

These figures are only approximate and may vary as the life
expectancy is influenced by such factors as careful working
procedures and local levels of air pollution.
Caution! If the baths have been changed or SHINE 400 has been
added, the machine should be started up again by producing a test
circuit board.

8.1 Emptying the containers

burns!
Danger: Never empty spent chemicals into the drain, but instead
into the containers provided for waste disposal and dispose of
them in an approved chemical processing plant.
Note: The cans of the delivered chemicals must be saved for the
bottling of spent chemicals according to type.
Fig. 18:
1 2 3 4 5 6 7
1- Pan 5- Outlet hose Container 3

2- Hose clamp 6- Outlet hose Container 2
3- Clamping rail 7- Outlet hose Container 1
4- Outlet hose Container 4
To empty the containers 1 through 4, proceed as follows:
› Pull the hose in question out of the clamping rail.

› Completely close the hose by fastening the hose clamp included in
the delivery to the hose above the liquid level.
› While keeping the hose shut, pull off the closing plug.
› Next, hold the end of the hose into the can and open the hose clamp,
to allow the chemicals to drain into the can.

Waste Disposal
9.0 Waste Disposal
• Do not allow spilt chemicals to enter waterways or the sewerage

system.
• The rinsing water generated by working processes can be
disposed of via the sewerage system without concern (see the
investigation report in the Appendix).
• Never empty chemicals into the drain. Instead drain them into the
containers provided for disposal and dispose of them at an
authorized chemical processing plant.
• The appropriate method of disposal (neutralization, hazardous
waste disposal, chemical-physical treatment) can be found in the
safety data sheets provided by the chemical manufacturer.
• You must always check and comply with local and regional
regulations governing the on-site and off-site disposal of waste.
• Local and state regulations will always take precedence in the
event of any conflict with our recommendations.

Appendix
10.0 Appendix
10.1 Error codes and troubleshooting

If errors occurred, this will be displayed in the status display.
In the left part of the display (Time) appears the message „Er.“ for error
and in the right part of the display (current) is shown the number of the
error code.
At the same time a continuous acoustic signal is given.
Error-
code Description Possible cause Elimination
01 Interruption of PAUSE button was Put the circuit board into
current flow in the not pressed to put the container and press
galvanic bath machine in stand-by START.
state prior to
removing PCB from
the galvanic bath (4)
Blue cristalline Switch machine off.
material of the Take out anode plates and
galvanical chemicals copper frame and clean
has formed between with tap water, rinse with
copper rails and distilled or demineralised
anode plates. water, then insert again.
Switch machine on again
02 Cleaning chemicals Filling level in Fill container 1 with
in container 1 remain container 1 is Cleaner 110 until level
at room temperature, insufficient reaches the triangular
i.e. the heating does marking
not start
Heating is defective Switch off machine.
Heating must be
exchanged by a service
technician.
Fuse of heating Exchange fuse on the
defective power board, see „Fuse of
the heating“ on page 45
04 Overheating of Power transistor is Switch off machine.
cooling element defective and Power transistor must be
generates too much exchanged by a service
heat technician.
08 Temperature sensor Sensor emits Switch off machine.
defective unrealistic Power transitor board must
temperature values, be exchanged by a service
R too high, T too low, technician.
(NTC)
16 Overload of motor Frame is jammed or Switch off machine.
has become sluggish Detach guiding blocks of
the frame and fix again in a
way that the frame can
move easily.

Appendix
Error-
code Description Possible cause Elimination
Motor is defective Switch off machine.
Motor must be exchanged
by a service technician.
Machine cannot be Power connection Check whether connector
switched on missing is plugged in and
connection to power
supply existent
Main fuse defective, Exchange main fuse, see
Fuse on the „Exchanging the Main
powerboard Fuse“ on
defective page 42.Exchange fuse on
the powerboard s. „10.2.2“
on page 43
10.2 Exchanging the fuses

10.2.1 Exchanging the Main Fuse
The main fuses are two glass fuses (2.5 AT for 230V, 5 AT for 115V)
which are located inside the voltage module. There is one fuse for each
voltage setting.
In order to exchange the fuses, proceed as follows:

› Pull out the connector of the voltage supply
› Insert a screw driver at the gap of the voltage module (1 in following
figure) and carefully pull out the module.
› Exchange the fuses in the side walls of the module
› Insert the module again
› Plug in the connector of the voltage supply

Appendix
10.2.2 Electronics fuse
In case of electronics failure and, after having checked the main fuse,
the electronics fuse may be defective. This glass fuse (3.15 AT) is on the
power board.
To exchange the fuse, proceed as follows:
› Switch off the MiniContac-RS and pull the mains plug.
› Unscrew the screws marked with arrows (see following figure).
Fig. 19: Access to the fuse
› Now remove the side cover.

Appendix
Fig. 20:
› On the power board, pull off the fuse holder containing the fuse (1)
(see following figure)
Fig. 21:
1 2 3 4
1- Fuse „elektronics“ on powerboard 3- Fuse holder (side view)
2- Fuse „heating“ on powerboard 4- Fuse
› Exchange the fuse (1).

› Re-insert the fuse holder (2) containing the new fuse (3).
› Tighten the cover again.
› Connect the mains plug and switch the machine on again.

Appendix
10.2.3 Fuse of the heating
If the heating does not start and a defective heating can be ruled out,
than the cause may be a defective fuse of the heating. This fuse is a 4
ampere slow-blow glass fuse located on the power board.
To exchange the fuse, proceed as in the previous chapter and exchange
the heating system fuse (2 in fig. 21 on page 44).

Appendix
10.3 Through-hole Plating Record

Keeping this record up-to-date allows you to determine, monitor and
analyse the service lives of the chemicals.
Please keep carefully.
Chemical replaced/topped up
Date Board material Current Time Chemical Quan-
size tity
W x L (mm)
Copy as required and keep by the machine

Appendix
10.4 Inspection Report 1

Appendix
10.5 Translation of Inspection Report 1

Appendix

Appendix

Appendix

Appendix

Appendix

Appendix

Appendix

Appendix

Appendix

Appendix

Appendix

Appendix

Appendix

Appendix
10.19 Inspection Report

Appendix

Appendix
10.21 Inspection Report

Appendix

Appendix

Appendix
10.24 Declaration of Conformity (German)
EG-Konformitätserklärung nach Maschinenrichtlinie 98/37/EG, Anhang II

A
Der Hersteller / Inverkehrbringer

Osteriede 7
30827 Garbsen
erklärt hiermit, dass folgendes Produkt
Produktbezeichnung: Anlage zur Durchkontaktierung von

Leiterplatten
Fabrikat:
Seriennummer:
Serien-/Typenbezeichnung: MiniContac RS
den Bestimmungen der (den) oben gekennzeichneten Richtlinie(n) -

einschließlich deren zum Zeitpunkt der Erklärung geltenden Änderungen
- entspricht.
Wir unterhalten ein von der BVQI zertifiziertes Qualitätssicherungs-

system nach ISO 9001 und haben daher bei der Entwicklung und
Herstellung nachstehende EG Richtlinien und EN Normen beachtet.
Folgende harmonisierte Normen wurden angewandt:

• EN 349:1993 Sicherheit von Maschinen - Mindestabstände zur
Vermeidung des Quetschens von Körperteilen
• EN 292-1:1991 Sicherheit von Maschinen - Grundbegriffe,
allgemeine Gestaltungsleitsätze - Teil 1: Grundsätzliche
Terminologie, Methodik
• EN 292-2:1991+A1:1995 Sicherheit von Maschinen -
Grundbegriffe, allgemeine Gestaltungsleitsätze - Teil 2:
Technische Leitsätze und Spezifikationen
• EN 1050:1996 Sicherheit von Maschinen - Leitsätze zur
Risikobeurteilung
• EN 626-1:1994 Sicherheit von Maschinen - Reduzierung des
Gesundheitsrisikos durch Gefahrstoffe, die von Maschinen
ausgehen - Teil 1: Grundsätze und Festlegungen für
Maschinenhersteller
• EN 60204-1:1997 Sicherheit von Maschinen - Elektrische
Ausrüstung von Maschinen - Teil 1: Allgemeine Anforderungen
• EN 61000-3-2:2000 Elektromagnetische Verträglichkeit (EMV) -
Teil 3-2: Grenzwerte - Grenzwerte für Oberschwingungsströme
(Geräte-Eingangsstrom bis einschließlich 16 A je Leiter)
• EN 61000-6-2:2001 Elektromagnetische Verträglichkeit (EMV) -
Teil 6 - Fachgrundnormen - Störfestigkeit - Industriebereich

Appendix
• EN 61000-6-3:2001 Elektromagnetische
Verträglichkeit (EMV - Teil 6-3: Fachgrundnormen -
Fachgrundnorm Störaussendung - Wohnbereich, Geschäfts-und
Gewerbebereiche sowie Kleinbetriebe
Folgende nationale oder internationale Normen (oder Teile/Klauseln

daraus) und Spezifikationen wurden angewandt:
• EN55022 Klasse B Funkstörspannung, Funkstörstrahlung

• EN61000-4-3 Störfestigkeit
• EN61000-4-2 Störfestigkeit
• EN61000-4-6 Wechselstrom Netzein- und ausgänge
Folgende weitere EU-Richtlinien wurden angewandt:
• EMV-Richtlinie 89/336/EWG
• Niederspannungsrichtlinie 73/23/EWG
Ort:Garbsen
Datum:25.08.2006
______________________________________
Herr Bernd Hackmann (Vorstandsvorsitzender)

Appendix
10.25 Declaration of Conformity
EC Declaration of Conformity in accordance with Machinery Directive

98/37/EC, Appendix II A
The manufacturer/seller

Osteriede 7
D-30827 Garbsen
hereby declares that the following product
Product designation: System for Through-Hole Plating of

Circuit Boards
Make:
Serial number:
Serial/Type designation: MiniContac RS
conforms to the provisions of the directive(s) identified above - including

the modifications effective at the time of this declaration.
We maintain a quality assurance system according to ISO 901 that has

been certified by the BVQI, which is why our developments and
productions are in compliance with the following EC directives and EN
standards.
The following harmonized standards were applied:

• EN 349:1993 Safety of machinery - Minimum gaps to avoid
crushing of body parts
• EN 292-1:1991 Safety of machinery - Basic terms, general
principles for design - Part 1: Basic terminology, methods
• EN 292-2:1995+A1:1995 Safety of machinery - Basic terms,
general principles for design - Part 2: Technical principles and
specifications
• EN 1050:1996 Safety of machinery - Principles for risk
assessment
• EN 626-1:1994 Safety of machinery - Reduction of risks to health
from hazardous substances emitted by machinery - Part 1:
Principles and specifications for machinery manufacturers
• EN 60204-1:1997 Safety of machinery - Electrical equipment of
machines - Part 1: General requirements
• EN 61000-3-2:2000 Electromagnetic Compatibility (EMC) - Part
3-2: Limits – Limits for harmonic current emissions (Equipment
input current 16 A per phase)
• EN 61000-6-2:2001 Electromagnetic Compatibility (EMC) - Part 6
- Generic standards - Immunity for industrial environments

Appendix
• EN 61000-6-3:2001 Electromagnetic
Compatibility (EMC) - Part 6-3: Generic standards - Emission
standard for residential, commercial and light-industrial
environments
The following national and international standards (or parts/clauses

thereof) and specifications were observed:
• EN55022 Class B Radio interference voltage, Radio interference

emission
• EN61000-4-3 Interference immunity
• EN61000-4-2 Interference immunity
• EN61000-4-6 AC voltage mains inputs and outputs
The following additional EU Directives were applied:

• EMC directive 89/336/EEC
• Low Voltage Directive 73/23/EEC
Place:Garbsen
Date:25.08.2006
______________________________________
Bernd Hackmann (Board chairman)

Index
11.0 Index
A
Accessories ........................................................................................................10
ambient temperature .......................................................................................9
C
Caution ....................................................................................................................4
Changing the individual menu items .....................................................25
Container 1 .........................................................................................................14
Container 2 .........................................................................................................15
Container 3 .........................................................................................................15
Container 4 .........................................................................................................16
Conventions .........................................................................................................4
D
Danger ..............................................................................................................4, 33
Declaration of Conformity ...........................................................................69
Declaration of Conformity (German) .....................................................67
Description of operating procedure .......................................................31
Description of the individual containers ...............................................14
Description of the Machine .........................................................................12
E
Electrical Connections ..................................................................................20
Electronics fuse ................................................................................................43
Emptying the containers ..............................................................................39
Error codes .........................................................................................................41
Exchanging the Main Fuse .........................................................................42
F
Filling level sensor ..........................................................................................17
Fuse of the heating .........................................................................................45
I
Intended use ........................................................................................................5
L
Locking into place of the printed circuit board holder ...................17
M
Maintenance ......................................................................................................36
Menu guidance .................................................................................................24
Menu selection ..................................................................................................19
N
Note ..............................................................................................................4, 16, 17
O
Operating unit ....................................................................................................19
Orientation .............................................................................................................4
P
Phases menu .....................................................................................................28
Products Supplied ...........................................................................................10

Index
Profiles menu 26
R
Reverse Pulse Plating .................................................................................. 22
S
Safety Regulations ......................................................................................... 11
Service menu .................................................................................................... 28
Servicing .............................................................................................................. 36
Setting Up ........................................................................................................... 29
Setup menu ........................................................................................................ 28
T
Target Group ........................................................................................................ 5
Technical Data .................................................................................................. 21
Technical Description of the Surroundings ........................................ 20
Through-hole Plating Record .................................................................... 46
Troubleshooting ............................................................................................... 41
W
Waste Disposal ................................................................................................ 40
Working temperature ..................................................................................... 17

Safety Data Sheet
12.0 Safety Data Sheet
CLEANER 110
CLEANER 210
ACTIVATOR 310
COPPER PLATER 400
SHINE 400

Safety Data Sheet

Manual Minicontac-Rs: English, Version 3.0

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Manual MiniContac-RS

English, version 3.0

LPKF Laser & Electronics AG

Part number 120405

2 Version 3.0 Revision 22.1.07 MiniContac-RS

• the system is only used as intendet

MiniContac-RS Version 3.0 Revision 22.1.07 3

II. Conventions used in this manual

Illustrations are numbered. Example: Fig. 5

Italic sections are used to indicate the reactions consequent on an

Key inscriptions and menu terms are printed in BOLD CAPITALS.

III. Notes on the symbols used

Danger! This symbol is used to highlight danger to life or health.

Caution! This symbol is used to identify hazards which may cause

4 Version 3.0 Revision 22.1.07 MiniContac-RS

MiniContac-RS Version 3.0 Revision 22.1.07 5

2.0 Products Supplied . . . . . . . . . . . . . . . . . . . 10

2.1 Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

3.0 Safety Regulations . . . . . . . . . . . . . . . . . . . 11

4.0 Description of the Machine . . . . . . . . . . . . 12

4.1 Description of the individual containers . . . . . . . . .14

4.1.1 Filling level sensor . . . . . . . . . . . . . . . . . . . . . . . . 17

4.2 Locking into place of the printed circuit board holder .

4.3 Operating unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . .19

4.4 Technical Description of the Surroundings . . . . . . .20

4.5 Electrical Connections . . . . . . . . . . . . . . . . . . . . . .20

4.6 Technical Data . . . . . . . . . . . . . . . . . . . . . . . . . . . .21

4.7 Reverse Pulse Plating . . . . . . . . . . . . . . . . . . . . . .22

5.1 Menu guidance. . . . . . . . . . . . . . . . . . . . . . . . . . . .24

5.2 Changing the individual menu items . . . . . . . . . . .25

5.3 Profiles menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26

5.4 Phases menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

5.5 Setup menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

5.6 Service menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . .28

6 Version 3.0 Revision 22.1.07 MiniContac-RS

7.0 Description of operating procedure. . . . . 31

8.0 Maintenance and servicing . . . . . . . . . . . . 36

8.1 Emptying the containers . . . . . . . . . . . . . . . . . . . . .39

9.0 Waste Disposal . . . . . . . . . . . . . . . . . . . . . 40

10.1 Error codes and troubleshooting . . . . . . . . . . . . .41

10.2 Exchanging the fuses . . . . . . . . . . . . . . . . . . . . . .42

10.2.1 Exchanging the Main Fuse . . . . . . . . . . . . . . . . 42

10.3 Through-hole Plating Record . . . . . . . . . . . . . . . .46

10.4 Inspection Report 1 . . . . . . . . . . . . . . . . . . . . . . .47

10.5 Translation of Inspection Report 1 . . . . . . . . . . . .48

10.6 Inspection Report 2 . . . . . . . . . . . . . . . . . . . . . . .49

10.7 Translation of Inspection Report 2 . . . . . . . . . . . .50

10.8 Inspection Report 3 . . . . . . . . . . . . . . . . . . . . . . .51

10.9 Translation of Inspection Report 3 . . . . . . . . . . . .52

10.10 Inspection Report 4 . . . . . . . . . . . . . . . . . . . . . .53

10.11 Translation of Inspection Report 4 . . . . . . . . . . .54

10.12 Inspection Report 5 . . . . . . . . . . . . . . . . . . . . . .55

10.13 Translation of Inspection Report 5 . . . . . . . . . . .56

MiniContac-RS Version 3.0 Revision 22.1.07 7

10.15 Translation of Inspection Report 6 . . . . . . . . . . .58

10.16 Inspection Report 7 . . . . . . . . . . . . . . . . . . . . . .59

10.17 Translation of Inspection Report 7 . . . . . . . . . . .60

10.18 Inspection Report 8 . . . . . . . . . . . . . . . . . . . . . .61

10.19 Inspection Report . . . . . . . . . . . . . . . . . . . . . . . .62

10.20 Translation of Inspection Report 8 . . . . . . . . . . .63

10.21 Inspection Report . . . . . . . . . . . . . . . . . . . . . . . .64

10.22 Inspection Report 9 . . . . . . . . . . . . . . . . . . . . . .65

10.23 Translation of Inspection Report 9 . . . . . . . . . . .66