A. Printed Circuit Device

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1.

Its used to mechanically support and electrically connect electronic components using
conductive pathways is
a. Printed Circuit Device
b. Patterning Manufacture
c. Electrical Circuit Device
2. In the below is the process to manufacture a PCB, except
a. Patterning
b. Lamination
c. Surface Mounting
3. Line art and text may be printed onto the outer surfaces of a PCB by
a. Solder Resist
b. Screen Printing
c. Test
4. After the printed circuit board is completed, electronic components must be attached to form a
functional of
a. Printed Circuit Assembly
b. Second Layer of PCB
c. Electrical Circuit Device
5. In the below is include on Surface Mount Components
a. L
b. N
c. M
6. Device which used with wire ended components in applications where space was at a premium
(such as missile guidance and telemetry systems) is
a. Testing
b. Cordwood Construction
c. Surface Mount Technology
7. When compared to a system that is constructed on one board, a modular system using Printed
Circuit Boards (PCBs) is
a. Harder to Find Fault
b. More Expensive for Spares
c. Easier to Find Fault
8. A multi layer of PCB has
a. Two or more layers on one or both side
b. One layer on either side
c. Two or more layers connected in series
9. What is the base material of PCB
a. Conductor
b. Semi Conductor
c. Insulator
10. A Printed Circuit Board (PCS) is constructed of a plastic laminate which has bonded to one or
both
a. A thin sheet of copper
b. Various thicknesses of copper
c. A thick sheet of copper
11. In the below is not the process to manufacture a PCB, except
a. Lamination
b. Testing
c. Surface Mounting Device

12. In the above is the picture of


a. A cordwood
b. A Printed Circuit Assembly
c. Screen Printing
13. In the picture of number 12, the construction is used
a. Both sides of PCB as the interconnection
b. Single sides of PCB as the interconnection
c. All sides of PCB as the interconnection
14. In a printed circuit board , the surface resistance testing is
a. Insulation resistance between adjacent printed conductor
b. The resistance between the tow inductors
c. Between the board and the conductor
15. Uses a two or three axis mechanical milling system to mill away the copper foil to the substrate.
That is the one of process manufacture PCB, name of process is
a. Lamination
b. PCB Milling
c. PCB Solder Resist

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