COMPRESSOR LESS REFRIGERATION

SYSTEM
A Project Report Submitted
in Fulfillment of the Requirement for the Degree of

BACHELOR OF TECHNOLOGY
In
Mechanical Engineering
ADARSH RAI
(Roll no. 1736140011)

Under the Supervision of

Mr. MOHD FAIZUL HASAN

(Assistant Professor)

DEPARTMENT OF MECHANICAL ENGINEERING

R.R INSTITUTE OF MODERN TECHNOLOGY, LUCKNOW
(Dr. A. P. J. Abdul Kalam Technical University, Lucknow)

June, 2021
 CERTIFICATE

It is certified that the work contained in the project entitled “Compressor Less
Refrigeration System” submitted by Mr.Adarsh Rai to the R.R Institute of Modern
Technology Lucknow, Uttar Pradesh for the award of the degree of Bachelor of Technology
has been carried out under my supervision in the Department of Mechanical Engineering.
This work has not been submitted elsewhere for the award of any other degree or diploma.

Mr. Mohd Faizul Hasan

Project Supervisor
Department of Mechanical Engineering
R.R.G.I, Lucknow-226201

Mr. Mohd Faizul Hasan

Head of Department
Department of Mechanical Engineering
R.R.G.I, Lucknow-226201

i
 ACKNOWLEDGEMENT

First of all, I express my deepest gratitude to my supervisor, Mr. Mohd Faizul Hasan for
his invaluable guidance, encouragement, inspiration, and support throughout my project work. I
can never forget the vigor and attention bestowed by him in taking my project work means, and
how with a focused mind, with patience and perseverance, an unsolved problem can be solved and
its results physically interpreted and analyzed. His character personal combined with professional
ethics will remain a source of inspiration for the rest of my life.

I am extremely grateful to Mr. R.K Saxena workshop in charge for their support and
guidance to carry out a part of experimental work. Special thanks to Prof. Surya Prakash
Tripathi, Director of RRIMT, Mr. Durgesh Verma, Dean Academics RRIMT, Lucknow and
Mr. Mohd Faizul Hasan, HOD Mechanical Department.

Last but not least, my parents, my brothers and my whole family members need special
mention. Leaving rest other things aside, their continued moral support and blessings, allowed me
to concentrate on my work for long hours. It is their trust and confidence in me that I am in a
position to write this acknowledgment.

The company of my friends at RRIMT, Lucknow supported me for the successful

completion of project. My friends especially Saurabh Awasthi, Rishabh shukla , and Manjeet
Kumar helped me at every stage of my project work. Here, I learned not only the academics and
research but many other things which are needed in personal and professional lives. They indeed
made me realize, what life is. Each of them deserves special thanks.

Adarsh Rai

(Roll No. 1736140011)

2
 ABSTRACT

The technology of Automation has gained tremendous importance in the field of workplace
rationalization and automation from old-fashioned timber works and coal mines to modern
machine shops and space robots. It is therefore important that technicians and engineers should
have a good knowledge of Advance system. The aim is to design and develop an auto control
system based an intelligent electronically controlled automatic bumper activation system is called
“COMPRESSOR LESS REFRIGERTION SYSTEM” This system is consisting of I R Sensor
circuit, Control Unit, bumper system. The sensor is used to detect the obstacle. There is any
obstacle closer to the vehicle; the control signal is given to the bumper activation system. The
Automatic bumper system is used to product the man and vehicle. This bumper activation system
is only activated when any object come in front of vehicle. This vehicle speed is sensed by the
proximity sensor and this signal is given to the control unit and Auto bumper activation system.

3
 TABLE OF CONTENTS

Certificate……………………………………………………………… 1

Acknowledgement……………………………………………………… 2
Abstract…………………………………………………………………3
Table of contents…………………………………………………………4
Index………………………………………………………………………5-6
List of tables-------------------------------------------------------------------------7

List of figures……………………………………………………………….8
Chapter 1--------------------------------------------------------------------------------9-21
Chapter 2---------------------------------------------------------------------------------21-32
Chapter 3---------------------------------------------------------------------------------33-39
Chapter 4---------------------------------------------------------------------------------40-54

Conclusion --------------------------------------------------------------------------------55
References ---------------------------------------------------------------------------------56

4
 List of Tables

• Table 1----------------------------------------------------------
• Table 2----------------------------------------------------------
• Table 3----------------------------------------------------------
• Table 4----------------------------------------------------------

5
 INDEX

1. Introduction
1.1 Introduction
1.2 Seebeck effect
1.3 Thermo Power
1.4 Charge Carrier Diffusion
1.5 Phonon Drag
1.6 Peltier Effect

1.7 Thompson Effect

1.8 The Thompsons Relationship

2. Compressor Less Portable Refrigerator

2.1 Objects
2.2 An Introduction to Thermoelectrical Coolers
2.3Powering The Thermoelectrics

2.4 Other parameter to Consider

2.5 Single Stage Vs Multistage

6
3. Sink and Uses

3.1 Heat Sink

3.2 Performance

3.3 Use in Electronics

3.4 Applications

3.4.1 In Soldering

3.4.2 Recent development

3.5 As a Problem in firestopping and fire proofing

3.5.1 Firestopping

3.5.2 Fireproofing

4. Peltier Modules and Features

4.1 Peltier Modules

4.2 Operating Features

4.3 The temperature Moisture Condensation

4.4 The Samples of Peltier Coolers

4.4.1 The Active Peltier Coolers from Computernerd

4.4.2 The Coolers of Bcool Series

7
8
 LIST OF FIGURES

1. Circuit Diagram of Peltier Module

2. Thermoelectric Power Generator
3. Peltier effect Circuit
4. Compressor Less Refrigeration system
5. Cross action of typical TE couple
6. Malcor Graph (temp vs voltage)
7. Malcor Graph (temp vs Qs)
8. CPU heat Sink with fan attached
9. Liquid cooled Heat sink with force convection flow trajectories
10. Pin fin heat sink Thermal profile and convection flow trajectories
11. Heat sink, workstation, and Computer motherboard
12. Fire test station
13. The scheme of the experiment of Peltier heat measuring
14. Uses of semiconductors
15. Structure of Peltier Module
16. Peltier module
17. An example of cascade connection of Peltier Modules
18. An outward appearance of a cooler with a Peltier Module
19. The PAP2*3B cooler

9
 Chapter 1

1.1INTRODUCTION

The Peltier–Seebeck effect, or thermoelectric effect, is the direct conversion of thermal

differentials to electric voltage and vice versa. Related effects are the Thomson effect
and Joule heating. The Peltier–Seebeck and Thomson effects are reversible (in fact,
the Peltier and Seebeck effects are reversals of one another); Joule heating cannot be
reversible under the laws of thermodynamics.

1.2Seebeck effect

The Seebeck effect is the conversion of temperature differences directly into

electricity. This effect was first discovered, accidentally, by the German physicist
Thomas Johann Seebeck in 1821, who found that a voltage existed between two ends
of a metal bar when a temperature difference ΔT existed in the bar.

10
 He also discovered that a compass needle would be deflected when a closed loop was
formed of two metals with a temperature difference between the junctions. This is
because the metals respond differently to the temperature difference, which creates a
current loop, which produces a magnetic field.

The effect is that a voltage, the thermoelectric EMF, is created in the presence of a
temperature difference between two different metals or semiconductors. This causes a
continuous current to flow in the conductors if they form a complete loop. The voltage
created is of the order of several microvolt’s per degree difference.

In the circuit:

Fig.-1: a typical circuit diagram of Peltier device

11
 (which can be in several different configurations and be governed by the same
equations), the voltage developed can be derived from:

SA and SB are the Seebeck coefficients (also called thermoelectric power or

thermopower) of the metals A and B, and T1 and T2 are the temperatures of the two
junctions. The Seebeck coefficients are non-linear, and depend on the conductors'
absolute temperature, material, and molecular structure. If the Seebeck coefficients are
effectively constant for the measured temperature range, the above formula can be
approximated as:

Thus, a thermocouple works by measuring the difference in potential caused by the

dissimilar wires. It can be used to measure a temperature difference directly, or to
measure an absolute temperature, by setting one end to a known temperature. Several
thermocouples in series are called a thermopile.

12
 This is also the principle at work behind thermal diodes and thermoelectric generators
(such as radioisotope thermoelectric generators or RTGs) which are used for creating
power from heat differentials.

The Seebeck effect is due to two effects: charge carrier diffusion and phonon drag. If
both connections are held at the same temperature, but one connection is periodically
opened and closed, an AC voltage is measured, which is also temperature dependent.
This application of the Kelvin probe is sometimes used to argue that the underlying
physics does only need one junction. And this effect is still visible if the wires only
come close, but do not touch, thus no diffusion is needed.

1.3Thermo power

The thermopower, or thermoelectric power, or Seebeck coefficient of a material is a

measure of the magnitude of an induced thermoelectric voltage in response to a
temperature difference across that material. The thermopower has units of (V / K). The
term thermopower is a misnomer since it measures the voltage or electric field (not the
electric power) induced in response to a temperature difference. An applied
temperature difference causes charged carriers in the material, whether they are
electrons or holes, to diffuse from the hot side to the cold side, similar to a classical
gas that expands when heated. Mobile charged carriers migrating to the cold side leave
behind their oppositely charged and immobile nuclei at the hot side thus giving rise to
a thermoelectric voltage (thermoelectric refers to the fact that the voltage is created by
a temperature difference). Since a separation of charges also creates an electric
potential, the buildup of charged carriers onto the cold side eventually ceases at some

13
 maximum value since there exists an equal amount of charged carriers drifting back to
the hot side as a result of the electric field at equilibrium. Only an increase in the
temperature difference can resume a buildup of more charge carriers on the cold side
and thus lead to an increase in the thermoelectric voltage. Incidentally the
thermopower also measures the entropy per charge carrier in the material.

The thermopower of a material, represented as S, depends on the material's

temperature, and crystal structure. Typically, metals have small thermopowers because
most have half-filled bands. Electrons (negative charges) and holes (positive charges)
both contribute to the induced thermoelectric voltage thus cancelling each other's
contribution to that voltage and making it small. In contrast, semiconductors can be
doped with an excess amount, of electrons or holes and thus can have large positive or
negative values of the thermopower depending on the charge of the excess carriers.
The sign of the thermopower can determine which charged carriers dominate the
electric transport in both metals and semiconductors.

If the temperature difference ΔT between the two ends of a material is small, then the
thermopower of a material is defined as:

and a thermoelectric voltage ΔV is seen at the terminals.

14
 This can also be written in relation to the electric field E and the temperature gradient
, by the equation:

In practice one rarely measures the absolute thermopower of the material of interest.
This is due to the fact that electrodes attached to a voltmeter must be placed onto the
material in order to measure the thermoelectric voltage. The temperature gradient then
also typically induces a thermoelectric voltage across one leg of the measurement
electrodes. Therefore, the measured thermopower is a contribution from the
thermopower of the material of interest and the material of the measurement
electrodes. This arrangement of two materials is usually called a thermocouple.
The measured thermopower is then a contribution from both and can be written as:

Superconductors have zero thermopower since the charged carriers produce no

entropy. This allows a direct measurement of the absolute thermopower of the material
of interest, since it is the thermopower of the entire thermocouple as well. In addition,
a measurement of the Thompson coefficient, μ, of a material can also yield the
thermopower through the relation: S = \int {\mu \over T} dT
The thermopower is an important material parameter that determines the efficiency of
a thermoelectric material. A larger induced thermoelectric voltage for a given
temperature gradient will lead to a larger efficiency. Ideally one would want very large
thermopower values since only a small amount of heat is then necessary to create a
large voltage. This voltage can then be used to provide power.

1.4 Charge carrier diffusion

15
 Charge carriers in the materials (electrons in metals, electrons and holes in
semiconductors, ions in ionic conductors) will diffuse when one end of a conductor is
at a different temperature than the other. Hot carriers diffuse from the hot end to the
cold end, since there is a lower density of hot carriers at the cold end of the conductor.
Cold carriers diffuse from the cold end to the hot end for the same reason.
If the conductor were left to reach thermodynamic equilibrium, this process would
result in heat being distributed evenly throughout the conductor (see heat transfer). The
movement of heat (in the form of hot charge carriers) from one end to the other is
called a heat current. As charge carriers are moving, it is also an electrical current.
In a system where both ends are kept at a constant temperature relative to each other
(a constant heat current flows from one end to the other), there is a constant diffusion
of carriers. If the rate of diffusion of hot and cold carriers in opposite directions were
equal, there would be no net change in charge. However, the diffusing charges are
scattered by impurities, imperfections, and lattice vibrations (phonons). If the
scattering is energy dependent, the hot and cold carriers will diffuse at different rates.
This creates a higher density of carriers at one end of the material, and the distance
between the positive and negative charges produces a potential difference; an
electrostatic voltage.
This electric field, however, opposes the uneven scattering of carriers, and an
equilibrium is reached where the net number of carriers diffusing in one direction is
canceled by the net number of carriers moving in the opposite direction from the
electrostatic field. This means the thermopower of a material depends greatly on
impurities, imperfections, and structural changes (which often vary themselves with
temperature and electric field), and the thermopower of a material is a collection of
many different effects.
Typical thermoelectric devices are structured as alternating p-type and n-type
semiconductor elements connected by metallic interconnects as pictured in the figures
below. Current flows through the n-type element, crosses a metallic interconnect, and
passes into the p-type element. If a power source is provided, the thermoelectric device
may act as a cooler, as in the figure to the left below. Electrons in the n-type element
will move opposite the direction of current flow and holes in the p-type element will

16
 move in the direction of current flow, both removing heat from one side of the device.
If a heat source is provided, the thermoelectric device may function as a power
generator, as in the figure to the right below. The heat source will drive electrons in
the n-type element toward the cooler region, thus creating a current through the circuit.
Holes in the p-type element will then flow in the direction of the current. The current
can then be used to power a load, thus converting the thermal energy into electrical
energy.

Fig. 2: Thermoeletric Power Generator

1.4Phonon Drag

Phonons are not always in local thermal equilibrium; they move along the thermal
gradient. They lose momentum by interacting with electrons (or other carriers) and
imperfections in the crystal. If the phonon-electron interaction is predominant, the
phonons will tend to push the electrons to one end of the material, losing momentum
in the process. This contributes to the already present thermoelectric field. This
contribution is most important in the temperature region where phonon-electron
scattering is predominant. This happens for

17
 where θD is the Debye temperature. At lower temperatures there are fewer phonons
available for drag, and at higher temperatures they tend to lose momentum in phonon-
phonon scattering instead of phonon-electron scattering.

This region of the thermopower-versus-temperature function is highly variable under

a magnetic field.

1.5Peltier effect

The Peltier effect is the reverse of the Seebeck effect; a creation of a heat difference
from an electric voltage.

Fig. 3: Peltier effect circuit

It occurs when a current is passed through two dissimilar metals or semiconductors (n-
type and p-type) that are connected to each other at two junctions (Peltier junctions).

18
 The current drives a transfer of heat from one junction to the other: one junction cools
off while the other heats up; as a result, the effect is often used for thermoelectric
cooling. This effect was observed in 1834 by Jean Peltier, 13 years after Seebeck's
initial discovery.

When a current I is made to flow through the circuit, heat is evolved at the upper
junction (at T2), and absorbed at the lower junction (at T1). The Peltier heat absorbed

by the lower junction per unit time, is equal to

Where Π is the Peltier coefficient ΠAB of the entire thermocouple, and ΠA and ΠB are
the coefficients of each material. P-type silicon typically has a positive Peltier
coefficient (though not above ~550 K), and n-type silicon is typically negative, as the
names suggest.

The Peltier coefficients represent how much heat current is carried per unit charge
through a given material. Since charge current must be continuous across a junction,
the associated heat flow will develop a discontinuity if ΠA and ΠB are different. This
causes a non-zero divergence at the junction and so heat must accumulate or deplete
there, depending on the sign of the current. Another way to understand how this effect
could cool a junction is to note that when electrons flow from a region of high density
to a region of low density, they expand (as with an ideal gas) and cool.

The conductors are attempting to return to the electron equilibrium that existed before
the current was applied by absorbing energy at one connector and releasing it at the
other. The individual couples can be connected in series to enhance the effect.

19
 An interesting consequence of this effect is that the direction of heat transfer is
controlled by the polarity of the current; reversing the polarity will change the direction
of transfer and thus the sign of the heat absorbed/evolved.

A Peltier cooler/heater or thermoelectric heat pump is a solid-state active heat pump

which transfers heat from one side of the device to the other. Peltier coolers are also
called thermo-electric coolers (TEC).

1.6Thomson effect

The Thomson effect, named for William Thomson (Lord Kelvin), describes the
heating or cooling of a current-carrying conductor with a temperature gradient.

Any current-carrying conductor (except lead), with a temperature difference between

two points, will either absorb or emit heat, depending on the material.

If a current density J is passed through a homogeneous conductor, heat production per

unit volume is,

Where,

ρ is the resistivity of the material

20
 dT/dx is the temperature gradient along the wire

μ is the Thomson coefficient.

The first term ρ J² is simply the Joule heating, which is not reversible.

The second term is the Thomson heat, which changes sign when J changes direction.

In metals such as zinc and copper, which have a hotter end at a higher potential and a
cooler end at a lower potential, when current moves from the hotter end to the colder
end, it is moving from a high to a low potential, so there is an evolution of energy. This
is called the positive Thomson effect.

In metals such as cobalt, nickel, and iron, which have a cooler end at a higher potential
and a hotter end at a lower potential, when current moves from the hotter end to the
colder end, it is moving from a low to a high potential, there is an absorption of energy.
This is called the negative Thomson effect.

In lead, there is zero Thomson effect.

1.6The Thomson relationships

The Seebeck effect is actually a combination of the Peltier and Thomson effects. In fact, in
1854 Thomson found two relationships, now called the Thomson or Kelvin relationships,
between the corresponding coefficients. The absolute temperature T, the Peltier coefficient Π
and Seebeck coefficient S are related by the first Thomson relation

21
 which predicted the Thomson effect before it was actually Formalized. These are related to

the Thomson coefficient μ by the second Thomson relation,

Chapter 2

COMPRESSOR LESS PORTABLE REFRIGERATOR

2.1OBJECTS:

• To fabricate a wooden & metal assembly container inside the Box Can suitable to store
food stuff inside.

• To make a space (at any one side of the above encloses) to fit Peltier junction apparatus
in this with no air gap remains open.

• To fix a small exhaust air fan at the outer surface above the Peltier junction apparatus.

• To fabricate & assemble a 12 V DC Power supply to provide power Source for this
whole set up and battery charging (optional).

• To provide solar powered electrical energy (DC) Using Suitable Solar Modules
(optional assembly)

22
 PELTIER EFFECT

DTI

Fig. 4: Compressor less Refrigerator

23
 Table 1

BLOCK DIAGRAM

SPECIFICATION

Volume:

10 liters (Approx)

Voltage:

DC 12V; AC 180-240V

Power Consumption:
DC: Cold Mode: 58W+/-20%; Hot Mode: 46W+/-20% AC: Cold Mode: 72W+/-20% Hot
Mode: 60W+/-20%

Cooling Capacity:
03°C-8°C below ambient temperature (At peltier point)

Heating Capacity:
+55°C

Insulation:
Adopts thermoelectric technology (Peltier system) solid polyurethane foam with CFC-free

Features:

24
 One Peltier is fixed in the box so that it can cool.

2.2 An Introduction to Thermoelectric Coolers

2.2.1Sara Godfrey, Melcor Corporation

Fig. 5: Cross Section of a Typical TE Couple

2.2.1.1Introduction
Thermoelectric coolers are solid state heat pumps used in applications where
temperature stabilization, temperature cycling, or cooling below ambient are required.
There are many products using thermoelectric coolers, including CCD cameras (charge
coupled device), laser diodes, microprocessors, blood analyzers and portable picnic
coolers. This article discusses the theory behind the thermoelectric cooler, along with
the thermal and electrical parameters involved.
2.2.1.2How the Thermoelectric Works . . .
Thermoelectric are based on the Peltier Effect, discovered in 1834, by which DC
current applied across two dissimilar materials causes a temperature differential. The
Peltier Effect is one of the three thermoelectric effects, the other two are known as the

25
 Seebeck Effect and Thomson Effect. Whereas the last two effects act on a single
conductor, the Peltier Effect is a typical junction phenomenon. The three effects are
connected to each other by a simple relationship.
The typical thermoelectric module is manufactured using two thin ceramic wafers with
a series of P and N doped bismuth-telluride semiconductor material sandwiched
between them. The ceramic material on both sides of the thermoelectric adds rigidity
and the necessary electrical insulation. The N type material has an excess of electrons,
while the P type material has a deficit of electrons. One P and one N make up a couple,
as shown in Figure 1. The thermoelectric couples are electrically in series and
thermally in parallel. A thermoelectric module can contain one to several hundred
couples.
As the electrons move from the P type material to the N type material through an
electrical connector, the electrons jump to a higher energy state absorbing thermal
energy (cold side). Continuing through the lattice of material, the electrons flow from
the N type material to the P type material through an electrical connector, dropping to
a lower energy state and releasing energy as heat to the heat sink (hot side).
Thermoelectrics can be used to heat and to cool, depending on the direction of the
current. In an application requiring both heating and cooling, the design should focus
on the cooling mode. Using a thermoelectric in the heating mode is very efficient
because all the internal heating (Joulian heat) and the load from the cold side is pumped
to the hot side. This reduces the power needed to achieve the desired heating.
2.2.1.3Thermal Parameters Needed
The appropriate thermoelectric for an application, depends on at least three parameters.
These parameters are the hot surface temperature (Th), the cold surface temperature
(Tc), and the heat load to be absorbed at the cold surface (Qc).
The hot side of the thermoelectric is the side where heat is released when DC power is
applied. This side is attached to the heat sink. When using an air cooled heat sink
(natural or forced convection), the hot side temperature can be found by using
Equations 1 and 2.
(1) Th = Tamb + (O) (Qh)

26
 Where

Th = The hot side temperature (°C).

Tamb = The ambient temperature (°C).

O = Thermal resistance of heat exchanger (°C/watt).

And

(2) Qh = Qc + Pin

Where

Qh = the heat released to the hot side of the thermoelectric (watts).

Qc = the heat absorbed from the cold side (watts).

Pin = the electrical input power to the thermoelectric (watts).

The thermal resistance of the heat sink causes a temperature rise above ambient. If the
thermal resistance of the heat sink is unknown, then estimates of acceptable
temperature rise above ambient are:
Natural Convection 20°C to 40°C

Forced Convection 10°C to 15°C

Liquid Cooling 2°C to 5°C (rise above the liquid coolant temperature)

The heat sink is a key component in the assembly. A heat sink that is too small means
that the desired cold side temperature may not be obtained.
The cold side of the thermoelectric is the side that gets cold when DC power is applied.
This side may need to be colder than the desired temperature of the cooled object. This
is especially true when the cold side is not in direct contact with the object, such as
when cooling an enclosure.
The temperature difference across the thermoelectric ( T) relates to Th and Tc
according to Equation 3.

27
 (3) T = Th - Tc
The thermoelectric performance curves in Figures 2 and 3 show the relationship
between T and the other parameters.
Estimating Qc, the heat load in watts absorbed from the cold side is difficult, because
all thermal loads in the design must be considered. Among these thermal loads are:
1. Active: I2R heat load from the electronic devices
Any load generated by a chemical reaction
2. Passive: Radiation (heat loss between two close objects with different temperatures)
Convection (heat loss through the air, where the air has a different temperature than the object)
Insulation Losses
Conduction Losses (heat loss through leads, screws, etc.)
Transient Load (time required to change the temperature of an object)

2.3 Powering the Thermoelectric

All thermoelectrics are rated for Imax, Vmax, Qmax, and Tmax, at a specific value of Th.
Operating at or near the maximum power is relatively inefficient due to internal heating
(Joulian heat) at high power. Therefore, thermoelectrics generally operate within 25%
to 80% of the maximum current. The input power to the thermoelectric determines the
hot side temperature and cooling capability at a given load.
As the thermoelectric operates, the current flowing through it has two effects: (1) the
Peltier Effect (cooling) and (2) the Joulian Effect (heating). The Joulian Effect is
proportional to the square of the current. Therefore, as the current increases, the Joule
heating dominates the Peltier cooling and causes a loss in net cooling. This cut-off
defines Imax for the thermoelectric.
For each device, Qmax is the maximum heat load that can be absorbed by the cold side
of the thermoelectric. This maximum occurs at Imax, Vmax, and with T = 0°C. The
Tmax value is the maximum temperature difference across the thermoelectric. This
maximum occurs at Imax, Vmax and with no load (Qc = 0 watts). These values of Qmax
and Tmax are shown on the performance curve (Figure 3) as the end points of the I max
line.

28
 An Example
Suppose a designer has an application with an estimated heat load of 22 watts, a forced
convection type heat sink with a thermal resistance of 0.15°C/watt, an ambient
temperature of 25°C, and an object that needs to be cooled to 5°C. The cold side of the
thermoelectric will be in direct contact with the object.
The designer has a Melcor CP1.4-127-06L thermoelectric in the lab and needs to know
if it is suitable for this application. The specifications for the CP1.4-127-06L are as
follows (these specifications are at Th = 25°C):
Imax = 6.0 amps

Qmax = 51.4 watts

Vmax = 15.4 volts

Tmax = 67°C

To determine if this thermoelectric is appropriate for this application, it must be shown

that the parameters T and Qc are within the boundaries of the performance curves.
The parameter T follows directly from Th and Tc. Since the cold side of the
thermoelectric is in direct contact with the object being cooled, T c is estimated to be
5°C. Assuming a 10°C rise above ambient for the forced convection type heat sink, Th
is estimated to be 35°C. Without knowing the power into the thermoelectric, an exact
value of Th cannot be found. Equation 3 gives the temperature difference across the
thermoelectric:
T = Th - Tc = 35°C - 5°C = 30°C
Figures 2 and 3 show performance curves for the CP1.4-127-06L at a hot side
temperature of 35°C. Referring to Figure 3, the intersection of Qc and T show that
this thermoelectric can pump 22 watts of heat at a T of 30°C with an input current
of 3.6 amps.
Performance Curve ( T vs. Voltage)

29
 T( °C)
Fig. 6: Melcor CP1.4-127-06L, ^T vs. Voltage

Performance Curve ( T vs. Qc)

T( °C)
Fig. 7: Melcor CP1.4-127-06L, ^T vs. Qc

These values are based on the estimate Th = 35°C. Once the power into the
thermoelectric is determined, Equations 1 and 2 can be used to solve for T h and to
determine whether the original estimate of Th was appropriate.
The input power to the thermoelectric, Pin, is the product of the current and the voltage.
Using the 3.6 amp line in Figure 2 for the current, the input voltage corresponding to
T = 30°C is approximately 10 volts.
Using Equations 1 and 2, Th can now be calculated.

30
 Th = Tamb + (O) (Qh)

where Tamb = 25°C O = 0.15°C/watt

Qh = Qc + Pin = 22 watts + ((3.6 amps) * (10 volts)) = 22 watts + 36

watts = 58 watts

therefore Th = 25°C + (0.15°C / watt) (58 watts)

= 25°C + 8.7°C = 33.7°C

The calculated Th is close enough to the original estimate of Th, to conclude that the
CP1.4-127-06L thermoelectric will work in the given application. If an exact solution
needs to be known, the process of solving for Th mathematically can be repeated until
the value of Th does not change.

2.4 Other Parameters to Consider

The material used for the assembly components deserves careful thought. The heat
sink and cold side mounting surface should be made out of materials that have a high
thermal conductivity (i.e., copper or aluminum) to promote heat transfer. However,
insulation and assembly hardware should be made of materials that have low thermal
conductivity (i.e., polyurethane foam and stainless steel) to reduce heat loss.
Environmental concerns such as humidity and condensation on the cold side can be
alleviated by using proper sealing methods. A perimeter seal (Figure 4) protects the
couples from contact with water or gases, eliminating corrosion and thermal and
electrical shorts that can damage the thermoelectric module.

31
 Fig. 8: Typical thermoelectric from Melcor with a perimeter seal

The importance of other factors, such as the thermoelectric's footprint, its height, its
cost, the available power supply and type of heat sink, vary according to the
application.

2.5 Single Stage vs. Multistage

Given the hot side temperature, the cold side temperature and the heat load, a suitable
thermoelectric can be chosen. If T across the thermoelectric is less than 55°C, then
a single stage thermoelectric is sufficient. The theoretical maximum temperature
difference for a single stage thermoelectric is between 65°C and 70°C.
If T is greater than 55°C, then a multistage thermoelectric should be considered. A
multistage thermoelectric achieves a high T by stacking as many as six or seven
single stage thermoelectrics on top of each other.

32
 Chapter 3

3.1 HEAT SINK

A heat sink (or heatsink) is an environment or object that absorbs and dissipates heat
from another object using thermal contact (either direct or radiant). Heat sinks are used
in a wide range of applications wherever efficient heat dissipation is required; major
examples include refrigeration, heat engines, cooling electronic devices and lasers.

Fig. 8: CPU heat sink with fan attached

Radial Heat Sink with Thermal Profile and Swirling Forced Convection Flow
Trajectories (using CFD analysis)

33
 Figure 8: Liquid Cooled Heat Sink with Forced Convection Flow Trajectories (using
CFD analysis)

Figure 9: Pin Fin Heat Sink with Thermal Profile and Dione Convection Flow
Trajectories (using CFD analysis)

Figure 10: Heat sink in a workstation, computer motherboard

34
 Figure 11: Fire test where the steel pipe penetrants clearly act to absorb and conduct

heat from the furnace, through to the unexposed side.

Heat sinks function by efficiently transferring thermal energy ("heat") from an object
at high temperature to a second object at a lower temperature with a much greater heat
capacity. This rapid transfer of thermal energy quickly brings the first object into
thermal equilibrium with the second, lowering the temperature of the first object,
fulfilling the heat sink's role as a cooling device. Efficient function of a heat sink relies
on rapid transfer of thermal energy from the first object to the heat sink, and the heat
sink to the second object.
The most common design of a heat sink is a metal device with many fins. The high
thermal conductivity of the metal combined with its large surface area result in the
rapid transfer of thermal energy to the surrounding, cooler, air. This cools the heat sink
and whatever it is in direct thermal contact with. Use of fluids (for example coolants
in refrigeration) and thermal interface material (in cooling electronic devices) ensures
good transfer of thermal energy to the heat sink. Similarly, a fan may improve the
transfer of thermal energy from the heat sink to the air.

3.2Performance
Heat sink performance (including free convection, forced convection, liquid cooled,
and any combination thereof) is a function of material, geometry, and overall surface
heat transfer coefficient. Generally, forced convection heat sink thermal performance
is improved by increasing the thermal conductivity of the heat sink materials,
increasing the surface area (usually by adding extended surfaces, such as fins or foam

35
 metal) and by increasing the overall area heat transfer coefficient (usually by increase
fluid velocity, such as adding fans, pumps, etc.).
Online heat sink calculators from companies such as Novel Concepts, Inc., can
accurately estimate forced convection heat sink performance. For more complex heat
sink geometries, and/or heat sinks with multiple materials, and/or heat sinks with
multiple fluids, computation fluid dynamics (CFD) analysis is recommended (see
graphics on this page).

3.3Use in electronics
3.3.1Explanation
In common use, it is a metal object brought into contact with an electronic component's
hot surface — though in most cases, a thin thermal interface material mediates between
the two surfaces. Microprocessors and power handling semiconductors are examples
of electronics that need a heat sink to reduce their temperature through increased
thermal mass and heat dissipation (primarily by conduction and convection and to a
lesser extent by radiation). Heat sinks are widely used in electronics, and have become
almost essential to modern integrated circuits like microprocessors, DSPs, GPUs, and
more.

3.3.2Construction and materials

A heat sink usually consists of a base with one or more flat surfaces and an array of
comb or fin-like protrusions to increase the heat sink's surface area contacting the air,
and thus increasing the heat dissipation rate. While a heat sink is a static object, a fan
often aids a heat sink by providing increased airflow over the heat sink — thus
maintaining a larger temperature gradient by replacing the warmed air more quickly
than passive convection achieves alone — this is known as a forced air system.
Heat sinks are made from a good thermal conductor such as copper or aluminum alloy.
Copper (401 W/(m·K) at 300 K) is significantly more expensive than aluminum
(237 W/(m·K) at 300 K) but is also roughly twice as efficient as a thermal conductor.
Aluminum has the significant advantage that it can be easily formed by extrusion, thus
making complex cross-sections possible. The heat sink's contact surface (the base)

36
 must be flat and smooth to ensure the best thermal contact with the object needing
cooling. Frequently, a thermally conductive grease is used to ensure optimal thermal
contact; such grease usually contains ceramic materials such as beryllium oxide and
aluminium nitride, but may alternatively contain finely divided metal particles, e.g.
colloidal silver.[1] Further, a clamping mechanism, screws, or thermal adhesive hold
the heat sink tightly onto the component, but specifically without pressure that would
crush the component.

3.3.3PC marketplace
Due to recent technological developments and public interest, the retail heat sink
market has reached an all time high. In the early 2000s, CPUs were produced that
emitted more heat than ever before, escalating requirements for quality cooling
systems.
Overclocking has always meant greater cooling needs, and the inherently hotter chips
meant more concerns for the enthusiast. Efficient heat sinks are vital to overclocked
computer systems because the higher a microprocessor's cooling rate, the faster the
computer can operate without instability; generally, faster operation leads to higher
performance. Many companies now compete to offer the best heat sink for PC
overclocking enthusiasts. Prominent aftermarket heat sink manufacturers include:
Aero Cool, Cooler Master, Foxconn, Thermalright, Thermaltake, Swiftech, and
Zalman.

3.4 Applications
3.4.1 In soldering
Temporary heat sinks were sometimes used while soldering circuit boards, preventing
excessive heat from damaging sensitive nearby electronics. In the simplest case, this
means partially gripping a component using a heavy metal crocodile clip or similar
clamp. Modern semiconductor devices, which are designed to be assembled by reflow
soldering, can usually tolerate soldering temperatures without damage. On the other
hand, electrical components such as magnetic reed switches can malfunction if

37
 exposed to higher powered soldering irons, so this practice is still very much in use.
[1]
3.4.2 Recent developments
More recently, synthetic diamond cooling sinks are being researched to provide better
cooling. Also, some heat sinks are constructed of multiple materials with desirable
characteristics, such as phase change materials, which can store a great deal of energy
due to their heat of fusion.
3.4.3 As a problem in firestopping and fireproofing
A heat sink is rarely a desired thing in passive fire protection. Rather, it is usually a
problem that must be overcome to maintain fire-resistance ratings. The proven ability
to overcome heat sinks in construction is subject to building code and fire code
regulations.
3.4.3.1 Firestopping
• Problem - Metallic penetrants and sleeves, at a density of 7.9kg/L are more dense than
common firestops or concrete. Consequently, during a fire, they will absorb more photons and
seek to conduct these to the unexposed side of a fire barrier (thus "cooling" the exposed side
at the expense of the unexposed side), such as the cold side of a firewall. This is undesirable.
Even if the fire is stopped by the barrier, one must keep the unexposed side cool to prevent
autoignition of combustibles on the unexposed side of a fire barrier. The unexposed side may
very well be an Area of refuge, which must be safeguarded to comply with the building code.
Greater penetrant and sleeve conductivity leads to lower T-ratings. Higher density firestops,
such as firestop mortars act as a heat sink to absorb heat away from small penetrants, such as
cables, thus increasing T-ratings.
• Benefit - a rare exception where heat sinks are beneficial in firestops is where
intumescents must be activated, such as in a firestop containing a plastic pipe. Heat sinks such
as wire mesh and extra metallic sleeving may be used to carry heat to intumescents to activate
expansion such as to choke off a melting plastic pipe or melting pipe covering, such as foamed
plastic or fibreglass.

3.4.3.2 Fireproofing
In fireproofing of structural steel as well as providing circuit integrity to cables, cable
trays, junction boxes and electrical conduit, the metallic items that are protected by the
fireproofing measures act as a heat sink. Fireproofing methods are used to defeat the

38
 heat sink properties of the items they protect. In the case of circuit integrity measures,
electrical services will fuse and short circuit above 140°C.
The work of modern efficient electronic devices dissipates a lot of heat, especially
while overclocking. Effective work of such components require adequate cooling. As
a rule, we use fan based coolers.
The reliability and performance of them grow constantly due to construction
improving, usage of the latest technologies for sensor development. However, not so
long ago there appeared new-based cooling devices - semiconductor coolers which
utilize the Peltier effect.
Peltier refrigerators containing specific semiconductor thermo-electric modules have
the widest perspective in the market for cooling devices.
Thanks to their unique heat and operational characteristics, Peltier modules allow to
reach the required cooling of computer components without huge technical problems
and finance expenditure. They are quite compact, convenient, reliable and efficient.
In the systems, elements of which are operated in the tough temperature modes (i.e. in
case of overclocking), Peltier modules are of great interest.

39
 Chapter 4

4.1Peltier modules

There used a so called thermoelectric refrigerator based on Peltier effect. The given
effect was called after a french watchmaker (1785-1845.), who discovered it in 1834.
If you put a drop of water in the hollow on the joint of 2 semiconductors Sb and Bi,
and switch on the current, the drop would freeze (with the reverse direction of the
current the drop would melt ). This is how Peltier effect works.
Unlike the Joule heat which is proportional to the current strength squared (Q=R·I·I·t),
the Peltier is proportional to the current strength and changes the sign (-/+) if the
current changes the direction. The Peltier heat equals:
Qp = P · q

q=I·t, P is a Peltier factor that depends on contacting materials and temperature.

Peltier heat is considered positive in case of dissipation, and negative in case of
absorption.

40
 Fig. 12: The scheme of the experiment of Peltier heat measuring, Cu, Bi.

In this case the Joule heat in both calorimeters is the same (since R = R(Cu)+R(Bi)).
But the Peltier heat differs in the sign. So, this experiment allows to calculate the
Peltier factor.

Table 2:-

In the table below you can see some Peltier factors for different pairs of metals.
Peltier factors for different metal pairs

Fe-constantan Cu-Ni Pb-constantan

P, P, P,
T, T, T,
m m m
K K K
V V V

27 13, 29 29
8,0 8,7
3 0 2 3

29 15, 32 38 11,
9,0
9 0 8 3 8

40 19, 47 10, 50 16,

3 0 8 3 8 0

41
 51 26, 56 57 18,
8,6
3 0 3 8 7

59 34, 61 63 20,
8,0
3 0 3 3 6

83 52, 71 10, 71 23,

3 0 8 0 3 4

Usually, a Peltier factor is calculated this way:

P= ·T

P - Peltier factor, - Tomson factor, T - absolute temperature.

In theory, the Peltier effect is explained the following way: electrons speed up or slow
down under the influence of contact potential difference. In the first case the kinetic
energy of the electrons increases, and then, turns into heat. In the second case the
kinetic energy decreases and the joint temperature falls down.
In case of usage of semiconductors of p- and n- types the effect becomes more vivid.
On the scheme you can see how it works.
COLD

HEAT

Fig. 13: Usage of semiconductors of p- and n-type in thermoelectric coolers.

42
 Combination of many pairs of p- and n-semiconductors allows to create cooling units
- Peltier modules of relatively high power (see the scheme below).

Fig. 14: Structure of a Peltier module

A Peltier module consists of semiconductors mounted successively, which form p-n-

and n-p-junctions. Each junction has a thermal contact with radiators. When switching
on the current of the definite polarity, there forms a temperature difference between
the radiators: one of them warms up and works as a heatsink, the other works as a
refrigerator.

Fig. 15: Peltier module

43
 A typical module provides a temperature difference of several tens degrees Celsius.
With forced cooling of the hot radiator, the second one can reach the temperatures
below 0 Celsius. For more temperature difference the cascade connection is used.

Fig. 16: An example of cascade connection of Peltier modules

The cooling devices based on Peltier modules are often called active Peltier
refrigerators or Peltier coolers.
Peltier module's power depends on its size. The modules of low power might not be
efficient enough. But the usage of the modules of too high power might cause moisture
condensation, what is dangerous for electronic circuits. The distance between
conductors on the modern printed circuit boards constitutes parts of a millimeter.
Nevertheless, they were powerful Peltier modules and additional cooling systems
which helped KryoTech and AMD companies to overclock AMD processors up to 1
GHz. We should notice here, that the systems work was stable and reliable enough.
Similar experiments were made with Intel Celeron, Pentium II, Pentium III, which
achieved tremendous performance growth.
We should point out that Peltier modules dissipates a lot of heat. That's why it's
necessary to use not only a powerful fan in the cooler, but also other different fans
inside the case.

44
 Fig. 17: An outward appearance of a cooler with a Peltier module

The information on Peltier modules, refrigerators and their test results you can find on
the following sites:
• www.melcor.com
• www.kryotech.com
• www.computernerd.com
• www.tomshardware.com

4.2Operating features
Peltier modules are very reliable; they haven't got any moving parts, unlike
refrigerators constructed according to the traditional technology.
But despite all the mentioned advantages, Peltier modules have some specific features,
which must be taken into account when using as a part of a cooling unit. The most
important characteristics are:
• The modules, dissipating much heat, require the relative fans and heatsinks which
would manage to carry off the heat effectively. We should notice, that the thermoelectric
modules have a quite low performance factor and they are themselves a powerful source of
heat. The usage of these modules might cause overheating of the other components inside the
system block. That's why it's necessary to install additional cooling systems inside the block.
Besides, the modules consume a lot of energy, and in this connection a power supply unit
capacity shouldn't be less that 250 W. Though there are sometimes Peltier refrigerators with
its own power supply unit.

45
 • In case of the module's failure the cooler becomes isolated from the cooled element. It
might lead to fast overheating of the latter.
• Low temperatures might cause moisture condensation. This might lead to short circuits
between the elements. That's why you should use the modules of the optimal power. Moisture
condensation depends on the temperature inside the system block, the temperature of the
cooled device and air moisture. The warmer air is and the more moisture is, the condensation
is more probable. The table below shows the dependence between a condensation temperature
on a cooled element and a temperature and moisture of the surrounding air.

4.3.1The temperature of moisture condensation

Moisture, %

T
h
e
o
u
t
e
r
t
e
m 3 3 4 4 5 5 6 6 7
p 0 5 0 5 0 5 0 5 0
e
r
a
t
u
r
e
,
°
C

46
 3 1 1 1 1 1 2 2 2 2
0 1 3 5 7 8 0 1 3 4

2 1 1 1 1 1 1 2 2 2
9 0 2 4 6 8 9 0 2 3

2 1 1 1 1 1 2 2 2
9
8 1 3 5 7 8 0 1 2

2 1 1 1 1 1 1 2 2
8
7 0 2 4 6 7 9 0 1

2 1 1 1 1 1 1 2
7 9
6 1 3 5 6 8 9 0

2 1 1 1 1 1 1 1
6 9
5 1 2 4 5 7 8 9

2 1 1 1 1 1 1 1
5 8
4 0 1 3 4 6 7 8

2 1 1 1 1 1 1
5 7 9
3 0 2 4 5 6 7

2 1 1 1 1 1 1
4 6 8
2 0 1 3 4 5 6

2 1 1 1 1 1
3 5 7 9
1 0 2 3 4 5

2 1 1 1 1
2 4 6 8 9
0 1 2 3 4

Besides, you have to take into account some peculiar features when installing a cooler
near a high efficient CPU of powerful computers.

47
 The architecture of the modern processors and some system programs provide different
power consumption modes depending on CPU load. Some people use "cooling"
programs, i.e. CPU Idle, or Windows NT/2000 and Linux. In this case the usage of
Peltier modules is undesirable, since it's assigned for continuous work. In case of low
power supply of a processor, the crystal temperature falls much. This might lead to
buzz. Remember, that theoretically Intel's Pentium II and Pentium III processors can't
work at the temperature below +5°C (though in practice, they endure lower
temperature).
Some more problems can occur in case your motherboard supports a function allowing
to control the fan speed depending on the power consumption of the processor. In the
regular conditions it improves the thermal mode of the processor. In case of Peltier
module usage, you might face some problems. It takes place, since the module is a
source of heat itself and thus, it requires the heat to be carried off.
Peltier modules can be used for cooling of video card chips as well. The work of video
chipsets causes huge amount of heat evolved, and it's at the same time quite stable.
It's quite rational to use intelligence systems to control not only fans but also
thermoelectric modules. It will help to avoid both supercooling and moisture
condensation.
Not so long ago the experiments on installation of the miniature modules in processors
were carried out. It's considered to be a rather perspective way of processors' cooling.
4.4The samples of Peltier coolers
Below you can see examples of thermoelectric coolers (TECs).
Table 3 :-
4.4.1The active Peltier coolers from Computernerd
Fan
Manufacturer/
Name Paramet Processor
supplier
ers

ball- Pentium/M
PAX56B Computernerd
bearing MX up to

48
 200 MHz, 25
W

dual
ball- Pentium
PA6EXB Computernerd bearing, MMX up to
tachomet 40 W
er

DesTech dual ball

DT-P54A Pentium
Solutions bearing

ball
AC-P2 AOC Cooler Pentium II
bearing

3 ball
PAP2X3B Computernerd Pentium II
bearing

Step
STEP-UP- 2 ball Pentium II,
Thermodynam
53X2 bearing Celeron
ics

PAP2CX3 3 ball-
B-10 bearing, Pentium II,
Computernerd
BCool PC- tachomet Celeron
Peltier er

PAP2CX3 3 ball-
B-25 bearing, Pentium II,
Computernerd
BCool-ER tachomet Celeron
PC-Peltier er

PAP2CX3 3 ball- Pentium II,

Computernerd
B-10S bearing, Celeron

49
 BCool- tachomet
EST PC- er
Peltier

The PAX56B cooler is developed for Pentium and Pentium-MMX processors from
Intel, Cyrix and AMD, working at the frequency up to 200 MHz. The thermo-electric
module (30x30 mm) allows the temperature below 63°C at 25 W of dissipated power
and the outer temperature of 25°C. It provides the lowest temperature than alternative
fans and radiators. For normal work of this cooler it's necessary to provide 5 V and 1,5
A (maximum). The fan for this cooler require 12 V and 0,1 A (maximum). The fan
parameters: ball-bearing, 47,5 mm, 65000 hours, 26 decibel. The whole size of the
cooler is 25x25x28,7 mm. The guiding price is $35.
The PA6EXB cooler is developed for more powerful Pentium-MMX processors,
dissipating heat up to 40 W. This cooler suits all processors from Intel, Cyrix and AMD
intended for Socket 5 or Socket 7. The thermo-electric module (40x40 mm) consumes
maximum 8 A (usually 3 A) and 5 V; the cooler uses a power supply unit of the
computer. The whole size is 60x60x52,5 mm. For better performance it's necessary to
provide at least 10 mm above and 2,5 mm on each side when installing the cooler. The
cooler ensures the temperature of 62,7°C with 40 W of dissipated heat and the outer
temperature of 45°C. To avoid moisture condensation and short circuits you should
not use programs, which set a processor into a standby mode for a long time. The
guiding price is $65.
The DT-P54A cooler (is known also as PA5B from Computernerd) is developed for
Pentium processors. However, some companies recommend it also for Cyrix/IBM
6x86 and AMD K6. The radiator is quite small (29x29 mm). The cooler has a thermode
to prevent overheating. It controls a Peltier element as well. The complete set includes
an external control device (it controls voltage, a Peltier element, a fan and
temperature). The device gives an alarm signal in case of failure of a Peltier element
or a fan, the fan rotates at the speed less than 70% of the standard value (4500 RPM)
or processor's temperature goes up more than 145°F (63°C). The Peltier element
switches on at the temperature of the processor more than 100°F (38°C). Since the
element is firmly connected with the radiator, you won't be able to install it on other

50
 one. The fan is quite reliable: 12 V, 4500 RPM, 6.0 CFM air supply speed, 1 W power
input, 30 decibel. The price is $39 to $49.
The AC-P2 cooler is developed for Pentium II processors. The complete set includes
60 mm cooler, a radiator and 40 mm Peltier element. The cooler doesn't suit Pentium
II of 400 MHz and higher, since SRAM chips practically don't get cold. The guiding
price is $59.
The PAP2X3B cooler (fig. 8) is similar to AOC AC-P2. It has 2 more fans (60 mm).
The same problems with SRAM cooling. You shouldn't better use it together with
"cooling" programs, such as CpuIdle, and under Windows NT and Linux, since
moisture condensation may occur. The guiding price is $79.

Fig. 18: The PAP2X3B cooler

The STEP-UP-53X2 cooler is provided with 2 fans, which pump much air through the
radiator. The guiding price is $79 (Pentium II), $69 (Celeron).
The coolers of Bcool series from Computernerd (PAP2CX3B-10 BCool PC-Peltier,
PAP2CX3B-25 BCool-ER PC-Peltier, PAP2CX3B-10S, BCool-EST PC-Peltier) are
developed for Pentium II and Celeron processors and have similar characteristics (see
the table below).

51
Table 4 :-
4.4.2The coolers of Bcool series
PAP2CX3B PAP2CX3B PAP2CX3B
-10 -25 -10S
Item
BCool PC- BCool-ER BCool-EST
Peltier PC-Peltier PC-Peltier

Advisabl
e Pentium II and Celeron
processor

The
number 3
of fans

Central
Ball-Bearing, tachometer (12 V, 120 mA)
fan type

Size of a
central 60x60x10 mm
fan

Type of
Ball- Ball-
an Ball-
Bearing, Bearing,
external Bearing
tachometer thermistor
fan

Size of an
60x60x10
external 60x60x25 mm
mm
fan

52
 Voltage,
12 V, 130 12 V, 80-
Current 12 V, 90 mA
mA 225 mA
strength

Area
occupied
84.9 sm2
by the
cooler

Total
280-570 mA
current 300 mA 380 mA
(3.36-6.84
for fans (3.6 W) (4.56 W)
W)
(power)

The
number
of fins on
63 long and 72 short
the
radiator
(center)

The
number
of fins on
the 45 long and 18 short
radiator
(on each
side)

Total fins
on the 153 long and 108 short
radiator

53
 Radiator
size 57x59x27 mm (including the thermo-electric module)
(center)

Radiator
size (each 41x59x32 mm
side)

The
general
145x59x38 mm (including the thermo-electric module)
size of the
radiator

The
145x60x50
cooler 145x60x65 mm
mm
size

The
cooler 357 gr. 416 gr. 422 gr.
weight

Guarante
5 years
e

Guiding
$74.95 $79.95 $84.95
price

We should mention that the BCool group includes devices with similar features, but
they lack for Peltier elements. These coolers are undoubtedly cheaper and not so
effective.
"PC Overclocking, Optimization, & Tuning" book by E. Rudometov & V. Rudometov
ISBN 1-58450-079-4 (bhv PUBLISHING HOUSE)
used as major source for this article.

54
 Conclusion

Although there is a variety of applications that use thermoelectric devices, all of them
are based on the same principle. When designing a thermoelectric application, it is
important that all of the relevant electrical and thermal parameters be incorporated into
the design process. Once these factors are considered, a suitable thermoelectric device
can be selected based on the guidelines presented in this article.

55
 References

1. Levine, M.A., Solid State Cooling with Thermoelectrics, Electronic Packaging &
Production, Nov. 1989.

2. Melcor Corporation, Thermoelectric Handbook, Sept., 1995.

3. Rowe, D. M., CRC Handbook of Thermoelectrics, CRC Press, Inc., 1995.

4. Smythe, Robert, Thermoelectric coolers take the heat out of today's hot chips, Electronic

Products

56