LIGITEK ELECTRONICS CO.,LTD.

Property of Ligitek Only

LED ARRAY
Pb
Lead-Free Parts

LA16B/DBK-S19-PF

DATA SHEET

DOC. NO : QW0905-LA16B/DBK-S19-PF

REV. : A

DATE : 10 - Mar. - 2007

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PART NO. LA16B/DBK-S19-PF Page 1/5

Package Dimensions

4.6 2.4±0.5 6.5

Ø 3.5

3.0
7.4
5.08

3.5±0.5
□0.5
TYP

2.54TYP 4.75± 0.5

+ -

LDBK2341
3.0

5.0

1.5MAX

25.0MIN

□0.5
TYP
1.0MIN

2.54TYP
+ -
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
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PART NO. LA16B/DBK-S19-PF Page 2/5

Absolute Maximum Ratings at Ta=25 ℃

Ratings
Parameter Symbol UNIT
DBK

Forward Current IF 30 mA
Peak Forward Current
IFP 100 mA
Duty 1/10@10KHz
Power Dissipation PD 120 mW

Reverse Current @5V Ir 50 μA

Electrostatic Discharge( * ) ESD 150 V

Operating Temperature Topr -20 ~ +80 ℃

Storage Temperature Tstg -30 ~ +100 ℃

* glove
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.

Typical Electrical & Optical Characteristics (Ta=25 ℃)

Dominant Spectral Forward Luminous Viewing

wave halfwidth voltage intensity angle
COLOR
PART NO MATERIAL length △λ nm @20mA(V) @20mA(mcd) 2 θ 1/2
λD nm (deg)
Emitted Lens Typ. Max. Min. Typ.

LA16B/DBK-S19-PF InGaN/GaN Blue Blue Transparent 470 30 3.5 4.0 550 1100 30

Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
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PART NO. LA16B/DBK-S19-PF Page 3/5

Typical Electro-Optical Characteristics Curve

DBK CHIP

Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current

1000 3.0
Forward Current(mA)

2.5

Normalize @20mA
Relative Intensity
100
2.0

10 1.5

1.0
1
0.5

01 0.0
1.0 2.0 3.0 4.0 5.0 1 10 100 1000

Forward Voltage(V) Forward Current(mA)

Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature

1.2 3.0
Forward Voltage@20mA

Relative Intensity@20mA

2.5
Normalize @25℃

Normalize @25℃

1.1
2.0

1.0 1.5

1.0
0.9
0.5

0.8 0.0
-40 -20 0 20 40 60 80 100 -40 -20 0 20 40 60 80 100

Ambient Temperature( ℃) Ambient Temperature( ℃)

Fig.5 Relative Intensity vs. Wavelength

1.0
Relative Intensity@20mA

0.5

0.0
400 450 500 550

Wavelength (nm)
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PART NO. LA16B/DBK-S19-PF Page 4/5

Soldering Condition(Pb-Free)

1.Iron:
Soldering Iron:30W Max
Temperature 350 °C Max
Soldering Time:3 Seconds Max(One time only)
Distance:2mm Min(From solder joint to case)

2.Wave Soldering Profile

Dip Soldering
Preheat: 120° C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260° C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to case)

Temp(° C)

260° C3sec Max

260°
5° /sec
max

120°

2° /sec
25° max
0° 0
50 100 150
Preheat
Time(sec)
60 Seconds Max

Note: 1.Wave solder should not be made more than one time.
2.You can just only select one of the soldering conditions as above.

PART NO. LA16B/DBK-S19-PF
Reliability Test:
Test Item Test Condition
1.Under Room Temperature
Operating Life Test 2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
High Temperature 1.Ta=105 ℃±5 ℃
Storage Test 2.t=1000 hrs (-24hrs, +72hrs)
Low Temperature 1.Ta=-40 ℃±5℃
Storage Test 2.t=1000 hrs (-24hrs, +72hrs)
High Temperature 1.Ta=65 ℃±5℃
High Humidity Test 2.RH=90 %~95 %
3.t=240hrs ±2hrs
1.Ta=105 ℃±5 ℃&-40 ℃±5℃
Thermal Shock Test (10min) (10min)
2.total 10 cycles
Solder Resistance 1.T.Sol=260 ℃±5℃
Test 2.Dwell time= 10 ±1sec.
1.T.Sol=230 ℃±5℃
Solderability Test
2.Dwell time=5 ±1sec
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Reference
Description
Standard
This test is conducted for the purpose MIL-STD-750: 1026
of detemining the resistance of a part MIL-STD-883: 1005
in electrical and themal stressed. JIS C 7021: B-1
The purpose of this is the resistance of
the device which is laid under condition MIL-STD-883:1008
of high temperature for hours. JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
JIS C 7021: B-12
condition of low temperature for hours.
The purpose of this test is the resistance MIL-STD-202:103B
of the device under tropical for hours. JIS C 7021: B-11
The purpose of this is the resistance of MIL-STD-202: 107D
the device to sudden extreme changes MIL-STD-750: 1051
in high and low temperature. MIL-STD-883: 1011
This test intended to determine the
thermal characteristic resistance MIL-STD-202: 210A
of the device to sudden exposures MIL-STD-750: 2031
at extreme changes in temperature JIS C 7021: A-1
when soldering the lead wire.
MIL-STD-202: 208D
This test intended to see soldering well MIL-STD-750: 2026
performed or not. MIL-STD-883: 2003
JIS C 7021: A-2