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LM397 Single General-Purpose Voltage Comparator: 1 Features 3 Description
LM397 Single General-Purpose Voltage Comparator: 1 Features 3 Description
LM397
SNOS977F – MAY 2001 – REVISED MAY 2016
RPULL-UP
VIN -
R1
VO
R3
R2
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM397
SNOS977F – MAY 2001 – REVISED MAY 2016 www.ti.com
Table of Contents
1 Features .................................................................. 1 7.3 Feature Description................................................... 7
2 Applications ........................................................... 1 7.4 Device Functional Modes.......................................... 8
3 Description ............................................................. 1 8 Application and Implementation .......................... 9
4 Revision History..................................................... 2 8.1 Application Information.............................................. 9
8.2 Typical Application ................................................... 9
5 Pin Configuration and Functions ......................... 3
6 Specifications......................................................... 4 9 Power Supply Recommendations...................... 11
6.1 Absolute Maximum Ratings ...................................... 4 10 Layout................................................................... 11
6.2 ESD Ratings.............................................................. 4 10.1 Layout Guidelines ................................................. 11
6.3 Recommended Operating Conditions....................... 4 10.2 Layout Example .................................................... 11
6.4 Thermal Information .................................................. 4 11 Device and Documentation Support ................. 12
6.5 Electrical Characteristics........................................... 5 11.1 Community Resources.......................................... 12
6.6 Typical Characteristics .............................................. 6 11.2 Trademarks ........................................................... 12
7 Detailed Description .............................................. 7 11.3 Electrostatic Discharge Caution ............................ 12
7.1 Overview ................................................................... 7 11.4 Glossary ................................................................ 12
7.2 Functional Block Diagram ......................................... 7 12 Mechanical, Packaging, and Orderable
Information ........................................................... 12
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
• Changed incorrect Pin Functions table entries. Pins 4 and 5 were swapped. ....................................................................... 3
• Added ESD Rating table, Feature Description section, Device Functional Modes, Application and Implementation
section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and
Mechanical, Packaging, and Orderable Information section. ................................................................................................ 1
DBV Package
5-Pin SOT-23
Top View
-
1 5
VIN VS
2
GND
3 4
+
VIN OUTPUT
Pin Functions
PIN
TYPE DESCRIPTION
NAME NO.
GND 2 P Ground
OUTPUT 4 O Output
VIN+ 3 I Noninverting Input
VIN– 1 I Inverting Input
VS 5 P Supply
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted) (1) (2)
MIN MAX UNIT
VIN differential 30 30 V
Supply voltages ±15 30 V
Voltage at input pins −0.3 30 V
Junction temperature (3) 150 ºC
Soldering Infrared or Convection (20 sec.) 235 ºC
information Wave Soldering (10 sec.) 260 ºC
Storage Temperature, Tstg −65 150 ºC
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) – TA)/ RθJA . All numbers apply for packages soldered directly onto a PCB.
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) Human Body Model, applicable std. MIL-STD-883, Method 3015.7. Machine Model, applicable std. JESD22-A115-A (ESD MM std. of
JEDEC) Field-Induced Charge-Device Model, applicable std. JESD22-C101-C (ESD FICDM std. of JEDEC).
(1) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) – TA)/ RθJA . All numbers apply for packages soldered directly onto a PCB.
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
(2) The maximum power dissipation is a function of TJ(MAX), RθJA. The maximum allowable power dissipation at any ambient temperature is
PD = (TJ(MAX) – TA)/ RθJA . All numbers apply for packages soldered directly onto a PCB.
0.45 14
-40°C
0.4 -40°C
12
0.2 6
0.15
4
0.1
0.05 2
0 0
0 5 10 15 20 25 30 0 5 10 15 20 25 30
SUPPLY VOLTAGE (V) SUPPLY VOLTAGE (V)
Figure 1. Supply Current vs Supply Voltage Figure 2. Input Bias Current vs Supply Current
1 2.5
R -40°C
OUTPUT SATURATION VOLTAGE (V)
-40 C R
25 C
25°C
0.1 R
85 C
1.5
0.01 1 2
1 10 100 0 5 10 15 25 30
0
OUTPUT SINK CURRENT (mA) SUPPLY VOLTAGE (V)
Figure 3. Output Saturation Voltage vs Output Sink Current Figure 4. Input Offset Voltage vs Supply Voltage
7 Detailed Description
7.1 Overview
A comparator is often used to convert an analog signal to a digital signal. The comparator compares an input
voltage (VIN) at the noninverting pin to the reference voltage (VREF) at the inverting pin. If VIN is less than VREF
the output (VO) is low (VOL). However, if VIN is greater than VREF, the output voltage (VO) is high (VOH). Refer to
Figure 6.
VS
VOLTS
VO
RPULL-UP
VREF -
VO
VIN VREF
+
- TIME
V
VIN
Figure 5. Basic Comparator
VS
VIN+
OUTPUT
VIN-
GND
5
-40°C
3.5
25°C
3
2.5
2
1.5
1
0.5
0
1 10 100
OUTPUT SINK CURRENT (mA)
VO
VT2 VT1
0 VIN
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
RPULL-UP
VIN -
R1
VO
R3
R2
10 10
OUTPUT (V)
8 8
CL = 15pF TO GND CL = 15pF TO GND
6 6
4 4
VOD = 5mV 2
2
VOD = 50mV
0 0 VOD = 5mV
10 VOD = 50mV 10
0 0
INPUT (mV)
INPUT (mV)
50 50
0 0
OVERDRIVE - OVERDRIVE
-
50 VOLTAGE (VOD) 50 VOLTAGE (VOD)
-100 -100
200 400 800 1200 1400 2000 200 400 800 1200 1400 2000
TIME (ns) TIME (ns)
Figure 10. Response Time for Various Input Overdrives – Figure 11. Response Time for Various Input Overdrives –
tPHL tPLH
10 Layout
IN+ IN+
V+ GND
VS± or GND
V±
OUT OUT
IN- IN-
GND
11.2 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
11.3 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.4 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
www.ti.com 6-Feb-2020
PACKAGING INFORMATION
Orderable Device Status Package Type Package Pins Package Eco Plan Lead/Ball Finish MSL Peak Temp Op Temp (°C) Device Marking Samples
(1) Drawing Qty (2) (6) (3) (4/5)
LM397MF ACTIVE SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 85 C397
LM397MF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS SN Level-1-260C-UNLIM -40 to 85 C397
& no Sb/Br)
LM397MFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS SN Level-1-260C-UNLIM -40 to 85 C397
& no Sb/Br)
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com 6-Feb-2020
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Sep-2019
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com 25-Sep-2019
Pack Materials-Page 2
PACKAGE OUTLINE
DBV0005A SCALE 4.000
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
C
3.0
2.6 0.1 C
1.75 1.45
B A
1.45 0.90
PIN 1
INDEX AREA
1 5
2X 0.95
3.05
2.75
1.9 1.9
2
4
3
0.5
5X
0.3
0.15
0.2 C A B (1.1) TYP
0.00
0.25
GAGE PLANE 0.22
TYP
0.08
8
TYP 0.6
0 TYP SEATING PLANE
0.3
4214839/E 09/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0005A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
2X (0.95)
3 4
SOLDER MASK
SOLDER MASK METAL METAL UNDER OPENING
OPENING SOLDER MASK
4214839/E 09/2019
NOTES: (continued)
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0005A SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
2 (1.9)
2X(0.95)
3 4
(R0.05) TYP
(2.6)
4214839/E 09/2019
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
www.ti.com
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