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Assembly Process Induced Stress Analysis For New FLMP Package by 3D FEA Powerpoint
Assembly Process Induced Stress Analysis For New FLMP Package by 3D FEA Powerpoint
Assembly Process Induced Stress Analysis For New FLMP Package by 3D FEA Powerpoint
• Motivation
• FEA Framework-Concept to Product
• Problems Defined
• Material Constitutive Relations
• Simulation Strategies
• Results of Flip Chip Attach and Clamping
• Conclusions and Further Work
Motivation
“Try-out” process by simulation first
To improve quality
To reduce time to market
To reduce manufacturing costs
Virtual characterization
Detailed - full models for accuracy
Package
- thermal analysis (Ja, Jc, heat dissipation)
Design
- moisture absorption and diffusion
- electrical analysis
Clamping pressure
• Materials models
Assume that solder joint is non-linear, all others are elastic
• Numerical algorithms
Material Constitutive Relations
ε&vp
m
s Q
f ANAND = σ = sinh exp
−1
ξ A kT
With the evolution equation
s dε vp
a
ds s
= h0 1 − ∗ sign(1 − ∗ )
dt s s dt
dε vp dt
n
∗ Q
s = s
ˆ exp
A kT
Material Constitutive Relations
−Q n
ε&creep = c exp σ
kT
(Norton’s law)
Numerical Strategies
Numerical Strategies
• Simple Progressive solution
• Implicit algorithm
• Solver Technology
∆ε n
vp [(
= ∆t n 1 − α ε& + α ε&
*
) n
vp
* n +1
vp ]
α∗ is in the range of [0,1]
α∗ = 1, fully implicit algorithm
α∗ = 0, explicit algorithm
Solver Technology
DOFs within 500K use direct solver (e.g.,sparse solver)
C3
C2 C4
C1
Reflow loading
max: 285C
Flip Chip Attach Modeling
Assume:
• Chip placement is done perfectly by the machine
• The solder paste stress is free from room temp to reflow temp
285C (it almost fully melts at this temp).
Results of Flip Chip Attach
L/F stress
25 250
Temperature (C)
Elastic plastic model
Anand viscoplastic model
15 150
Plastic with creep model
Max shear stress Sxz (Mpa) Temperature
10 100
5 50
0 0
0 50 100 150 200
t (secs)
30 300
25 250
Temperature (C)
Elastic Plastic Model
Anand Viscoplastic Model
15 150
Max shear stress (Mpa) Plastic with Creep Model
Temperature
10 100
5 50
0 0
90 100 110 120 130 140 150 160 170 180
t (secs)
25
Max Von-Mises Stress (MPa)
20
Continuum Model
15
Elements Birth and Dead Model
10
0
0 50 100 150 200
t (secs)
• Pre-heating 175C
• Clamping 3 mils
• Die thickness 8 mils
Results of Clamping
Solder Joint Deformation
25
10
0
0 10 20 30 40 50 60 70
t (secs)
Further work:
• Modeling work needs to be further validated by test results
• Material behavior is the function of both time and temp
• New methodologies such as stabilized FEA (see next page)
Numerical Example of Stabilized FEA
∇s ⋅ v − g (ε&, s, Θ ) = 0 where τ =
βh
2v
[ ]
T( v , s ) ( s * ) = ∫ ∇s ⋅ v − g (ε&, s, Θ ) s *dV + Sτ = 0
∆
B
(See Franca, Frey and Hughes, 1992)
[ ](
Sτ = ∑ ∫ τ ∇s ⋅ v − g (ε&, s, Θ ) v ⋅ ∇s * dV )
N el
B
e =1
Case (1) Pressure with stabilization Case (2) Pressure without stabilization
Acknowledgments