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Mosfet: Optimos
Mosfet: Optimos
MetalOxideSemiconductorFieldEffectTransistor
OptiMOSTM
OptiMOSTMPower-MOSFET,30V
IPT004N03L
DataSheet
Rev.2.0
Final
PowerManagement&Multimarket
OptiMOSTMPower-MOSFET,30V
IPT004N03L
1Description HSOF
Features
Tab
•Optimizedfore-fuseandORingapplication
•Verylowon-resistanceRDS(on)@VGS=4.5V
•100%avalanchetested
•Superiorthermalresistance 12
34
•N-channel 56
78
•QualifiedaccordingtoJEDEC1)fortargetapplications
•Pb-freeleadplating;RoHScompliant
Table1KeyPerformanceParameters
Drain
Parameter Value Unit Tab
VDS 30 V
RDS(on),max 0.4 mΩ Gate
Pin 1
ID 300 A Source
Pin 2-8
QOSS 141 nC
QG(0V..10V) 252 nC
1)
J-STD20 and JESD22
Final Data Sheet 2 Rev.2.0,2014-10-08
OptiMOSTMPower-MOSFET,30V
IPT004N03L
TableofContents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
IPT004N03L
2Maximumratings
atTj=25°C,unlessotherwisespecified
Table2Maximumratings
at 25 °C
Values
Parameter Symbol Unit Note/TestCondition
Min. Typ. Max.
- - 300 VGS=10V,TC=25°C
- - 300 VGS=10V,TC=100°C
Continuous drain current ID - - 300 A VGS=4.5V,TC=25°C
- - 300 VGS=4.5V,TC=100°C
- - 72 VGS=10V,TA=25°C,RthJA=40K/W1)
Pulsed drain current2) ID,pulse - - 1200 A TC=25°C
Avalanche energy, single pulse3) EAS - - 830 mJ ID=150A
Gate source voltage VGS -20 - 20 V -
- - 300 TC=25°C
Power dissipation Ptot W
- - 3.8 TA=25°C,RthJA=40K/W1)
IEC climatic category; DIN IEC 68-1:
Operating and storage temperature Tj,Tstg -55 - 150 °C
55/150/56
3Thermalcharacteristics
Table3Thermalcharacteristics
Values
Parameter Symbol Unit Note/TestCondition
Min. Typ. Max.
Thermal resistance, junction - case RthJC - - 0.5 K/W -
- - 40 6 cm² cooling area1)
Device on PCB RthJA K/W
- - 62 minimum footprint
1)
Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm2 (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical in still air.
2)
See figure 3 for more detailed information
3)
See figure 13 for more detailed information
Final Data Sheet 4 Rev.2.0,2014-10-08
OptiMOSTMPower-MOSFET,30V
IPT004N03L
4Electricalcharacteristics
Table4Staticcharacteristics
Values
Parameter Symbol Unit Note/TestCondition
Min. Typ. Max.
Drain-source breakdown voltage V(BR)DSS 30 - - V VGS=0V,ID=10mA
Gate threshold voltage VGS(th) 0.7 - 2.2 V VDS=VGS,ID=250µA
- 0.1 10 VDS=30V,VGS=0V,Tj=25°C
Zero gate voltage drain current IDSS µA
- 10 100 VDS=30V,VGS=0V,Tj=125°C
Gate-source leakage current IGSS - 10 100 nA VGS=20V,VDS=0V
- 0.44 0.5 VGS=4.5V,ID=150A
Drain-source on-state resistance RDS(on) mΩ
- 0.37 0.4 VGS=10V,ID=150A
Gate resistance RG 1.4 2.7 5.4 Ω -
Transconductance gfs 160 320 - S |VDS|>2|ID|RDS(on)max,ID=30A
Table5Dynamiccharacteristics
Values
Parameter Symbol Unit Note/TestCondition
Min. Typ. Max.
Input capacitance Ciss - 18000 24000 pF VGS=0V,VDS=15V,f=1MHz
Output capacitance Coss - 5400 7200 pF VGS=0V,VDS=15V,f=1MHz
Reverse transfer capacitance Crss - 590 - pF VGS=0V,VDS=15V,f=1MHz
VDD=15V,VGS=10V,ID=30A,
Turn-on delay time td(on) - 30 - ns
RG,ext=1.6Ω
VDD=15V,VGS=10V,ID=30A,
Rise time tr - 17 - ns
RG,ext=1.6Ω
VDD=15V,VGS=10V,ID=30A,
Turn-off delay time td(off) - 149 - ns
RG,ext=1.6Ω
VDD=15V,VGS=10V,ID=30A,
Fall time tf - 37 - ns
RG,ext=1.6Ω
Table6Gatechargecharacteristics1)
Values
Parameter Symbol Unit Note/TestCondition
Min. Typ. Max.
Gate to source charge Qgs - 40 53 nC VDD=15V,ID=30A,VGS=0to4.5V
Gate charge at threshold Qg(th) - 29 - nC VDD=15V,ID=30A,VGS=0to4.5V
Gate to drain charge Qgd - 28 36 nC VDD=15V,ID=30A,VGS=0to4.5V
Switching charge Qsw - 38 - nC VDD=15V,ID=30A,VGS=0to4.5V
Gate charge total Qg - 122 163 nC VDD=15V,ID=30A,VGS=0to4.5V
Gate plateau voltage Vplateau - 2.2 - V VDD=15V,ID=30A,VGS=0to4.5V
Gate charge total Qg - 252 336 nC VDD=15V,ID=30A,VGS=0to10V
Gate charge total, sync. FET Qg(sync) - 105 - nC VDS=0.1V,VGS=0to4.5V
Output charge Qoss - 141 188 nC VDD=15V,VGS=0V
1)
See ″Gate charge waveforms″ for parameter definition
Final Data Sheet 5 Rev.2.0,2014-10-08
OptiMOSTMPower-MOSFET,30V
IPT004N03L
Table7Reversediode
Values
Parameter Symbol Unit Note/TestCondition
Min. Typ. Max.
Diode continuous forward current IS - - 300 A TC=25°C
Diode pulse current IS,pulse - - 1200 A TC=25°C
Diode forward voltage VSD - 0.83 1 V VGS=0V,IF=150A,Tj=25°C
Reverse recovery charge Qrr - 100 - nC VR=15V,IF=100A,diF/dt=400A/µs
IPT004N03L
5Electricalcharacteristicsdiagrams
Diagram1:Powerdissipation Diagram2:Draincurrent
350 350
300 300
250 250
200 200
Ptot[W]
100 100
50 50
0 0
0 40 80 120 160 200 0 40 80 120 160 200
TC[°C] TC[°C]
Ptot=f(TC) ID=f(TC);VGS≥10V
Diagram3:Safeoperatingarea Diagram4:Max.transientthermalimpedance
4
10 101
1 µs
103
10 µs
100
100 µs
1 ms
102 0.5
10 ms
ZthJC[K/W]
ID[A]
10-1 0.2
DC
0.1
101
0.05
0.02
10-2
0
10 0.01
single pulse
10-1 10-3
10-1 100 101 102 10-6 10-5 10-4 10-3 10-2 10-1 100
VDS[V] tp[s]
ID=f(VDS);TC=25°C;D=0;parameter:tp ZthJC=f(tp);parameter:D=tp/T
IPT004N03L
Diagram5:Typ.outputcharacteristics Diagram6:Typ.drain-sourceonresistance
1200 0.6
10 V 3.2 V
4.5 V
4V 3.5 V
1000 5V 3.2 V 0.5
3.5 V 4V
4.5 V
5V
800 0.4 7V 8V
10 V
3V
RDS(on)[mΩ]
ID[A]
600 0.3
2.8 V
400 0.2
200 0.1
0 0.0
0 1 2 3 0 100 200 300 400 500 600 700
VDS[V] ID[A]
ID=f(VDS);Tj=25°C;parameter:VGS RDS(on)=f(ID);Tj=25°C;parameter:VGS
Diagram7:Typ.transfercharacteristics Diagram8:Typ.forwardtransconductance
1200 800
700
1000
600
800
500
gfs[S]
ID[A]
600 400
300
400
200
175 °C
25 °C
200
100
0 0
0 1 2 3 4 5 0 40 80 120 160
VGS[V] ID[A]
ID=f(VGS);|VDS|>2|ID|RDS(on)max;parameter:Tj gfs=f(ID);Tj=25°C
IPT004N03L
Diagram9:Drain-sourceon-stateresistance Diagram10:Typ.gatethresholdvoltage
1.0 2.5
0.8 2.0
0.6 1.5
1 mA
RDS(on)[mΩ]
VGS(th)[V]
0.4 typ 1.0
0.2 0.5
0.0 0.0
-60 -20 20 60 100 140 180 -60 -20 20 60 100 140 180
Tj[°C] Tj[°C]
RDS(on)=f(Tj);ID=150A;VGS=10V VGS(th)=f(Tj);VGS=VDS;ID=1mA
Diagram11:Typ.capacitances Diagram12:Forwardcharacteristicsofreversediode
5
10 104
103
Ciss
104
C[pF]
IF[A]
Coss
102
25 °C
103 175 °C
1
10
Crss
102 100
0 5 10 15 20 25 0.0 0.5 1.0 1.5
VDS[V] VSD[V]
C=f(VDS);VGS=0V;f=1MHz IF=f(VSD);parameter:Tj
IPT004N03L
Diagram13:Avalanchecharacteristics Diagram14:Typ.gatecharge
103 12
15 V
10
6V
24 V
102 25 °C 8
100 °C
125 °C
VGS[V]
IAV[A]
101 4
100 0
100 101 102 103 0 50 100 150 200 250 300
tAV[µs] Qgate[nC]
IAS=f(tAV);RGS=25Ω;parameter:Tj(start) VGS=f(Qgate);ID=30Apulsed;parameter:VDD
32
30
28
VBR(DSS)[V]
26
24
22
20
-60 -20 20 60 100 140 180
Tj[°C]
VBR(DSS)=f(Tj);ID=10mA
IPT004N03L
6PackageOutlines
Figure1OutlinePG-HSOF-8-1
IPT004N03L
RevisionHistory
IPT004N03L
Revision:2014-10-08,Rev.2.0
Previous Revision
Revision Date Subjects (major changes since last revision)
2.0 2014-10-08 Release of final version
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InfineonTechnologiesAG
81726München,Germany
©2014InfineonTechnologiesAG
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Theinformationgiveninthisdocumentshallinnoeventberegardedasaguaranteeofconditionsorcharacteristics.With
respecttoanyexamplesorhintsgivenherein,anytypicalvaluesstatedhereinand/oranyinformationregardingtheapplication
ofthedevice,InfineonTechnologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithout
limitation,warrantiesofnon-infringementofintellectualpropertyrightsofanythirdparty.
Information
Forfurtherinformationontechnology,deliverytermsandconditionsandpricespleasecontactyournearestInfineon
TechnologiesOffice(www.infineon.com).
Warnings
Duetotechnicalrequirements,componentsmaycontaindangeroussubstances.Forinformationonthetypesinquestion,
pleasecontactthenearestInfineonTechnologiesOffice.
TheInfineonTechnologiescomponentdescribedinthisDataSheetmaybeusedinlife-supportdevicesorsystemsand/or
automotive,aviationandaerospaceapplicationsorsystemsonlywiththeexpresswrittenapprovalofInfineonTechnologies,ifa
failureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-support,automotive,aviationand
aerospacedeviceorsystemortoaffectthesafetyoreffectivenessofthatdeviceorsystem.Lifesupportdevicesorsystemsare
intendedtobeimplantedinthehumanbodyortosupportand/ormaintainandsustainand/orprotecthumanlife.Iftheyfail,itis
reasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered.