3D Laser Scanning Confocal Microscope

VK-X Series

Precise Surface Analysis over a Large Area

 Measure across a 50 mm area
with nanometre resolution

Easy to use. Rapid results. Automated operation.

Introducing the new VK Series.

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16 times larger measurement area
than conventional KEYENCE models
Assured accuracy even with low-magnification lenses
The VK-X enables detailed profile measurement over a large area.

Measurement within as little as 5 seconds

Focus Variation ISO 25178-6

With the VK-X, measurement is possible within as little as 5 seconds.

Simple automatic measurement

RPDII / AI Scan
No need to worry about measurement settings. The VK-X utilises place-and-press
inspection for accurate measurement of microscopic structures.

3D Laser Scanning Confocal Microscope VK-X Series

3
 Basic Characteristics

Observation Measurement
Covering large magnification range High-accuracy measurement
in one device with pinhole confocal system

Magnification from 42× to 28800× No damage to targets

Fully-focused colour observation Precise measurements

No pre-processing or Measurement of transparent and

vacuum required tilted targets

4
 20 Years of Advancements

Analysis
AI-Scan - collects accurate data
with just one click
AI-Analyser - shows differences
between surfaces VF-7500

Quantification of surface structure

VK-8500

Easy comparison
of multiple samples
VK-9500

Roughness analysis

VK-9700

VK-X100

VK-X250

VK-X1000

History of KEYENCE’s
Laser Scanning Microscopes
Through continued pursuit of the highest performance,
KEYENCE’s laser scanning microscope lineup has
continued to evolve.

5
 Improved Functionality

16 times larger measurement area

compared to conventional KEYENCE models

Conventional
KEYENCE
models

VK-X1000

16× Larger Area

Compared to Conventional KEYENCE Models

6
 Assured Accuracy even
with Low-Magnification Lenses*
Conventional KEYENCE models

When measuring with a high-magnification When measuring with a low-magnification

lens, accuracy is high but measurement lens, measurement area is extensive but
area is limited. accuracy is low.

VK-X1000
High-Accuracy Measurement over a Large Area

Knurled surface (84×)

Precise measurement is possible even with a low-magnification lens.

Conventional KEYENCE models use higher magnification lenses to
increase the accuracy. The VK-X is able to perform the same
measurements at a lower magnification, without narrowing down the
measurement area.

* Measurement accuracy is now assured with a 5× lens, which was not available with conventional KEYENCE models.

7
 Improved Functionality

Measurement within as little as 5 seconds

As Little as
5 Seconds

8
 Fast Measurement
Conventional KEYENCE models
— Point-based scanning —

Approx. 60 seconds

VK-X1000
— Fast area measurement —

As little as 5 seconds

12× Measurement Speeds through Focus Variation *ISO 25178-6

Focus Variation Assured Accuracy

Focus Variation includes capturing multiple optical
images while the lens moves up and down. These
images are then used to construct a 3D shape
according to focus position.
Measurement results with Focus Variation are based
on a traceability system that complies with national
standards.
Z X-Y

National Institute of Advanced Industrial

National Physical Laboratory (NPL)
Science and Technology (AIST)

UKAS accredited organisation JCSS accredited organisation

Non-contact optical 3D profiler Coordinate measurement equipment

Standard step Reference scale

3D Laser Scanning Confocal Microscope VK-X Series

9
 Improved Functionality

Simple automatic measurement

A single click enables

user independent measurement

10
 Automatic Measurement
AI-SCAN
AAGII Function for Automatic Adjustment of Intensity of Received Laser Light
Optimisation of the received light intensity makes accurate measurement possible for targets with complex surfaces or
those with large differences in reflectance.

Conventional AAGII function

KEYENCE models

Diamond tool (400×)

Double Scan Function

If a surface cannot be measured accurately with a single scan, the sensitivity of the light-receiving element is
automatically adjusted and the object is scanned again to generate accurate results.

Conventional Double Scan function

KEYENCE models

Solder (100×)

New Light-Receiving Element and New RPDII Algorithm

Accurate ZI Profile Curve Calculation Accurate Peak Detection

The VK-X’s updated light-receiving element and With the VK-X, the peak position—the point of greatest
algorithm help to reduce noise. Accurate ZI profile reflected light along the ZI profile curve—is detected
curve calculations are possible even in dark locations accurately. This allows 3D shapes to be shown as they
or with low-magnification lenses. appear.

Conventional KEYENCE method

Z position

Conventional KEYENCE method RPDII

Z position

Z position

Detected focal point

Detection of the true focal point is
not possible.

RPDII

Intensity of reflected light Intensity of reflected light Intensity of reflected light Detected focal point
Detection of the true focal point is
possible.

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 High Accuracy

High-Accuracy 16-Bit Capturing

Thanks to a high-sensitivity photomultiplier, accurate 3D data can be captured.

Conventional KEYENCE models 16-bit

BGA (200×)

4 Times the Dynamic Range of Conventional

KEYENCE Models for Accurate Measurement of Measure Surfaces with Large Changes
Steep Angles in Reflectance or Colour
The VK-X provides accurate measurement for samples Utilising 16-bit (65536-shade) processing, the VK-X is
with steep angles or complicated shapes—which were capable of distinguishing different colours and mixed
difficult to analyse with conventional KEYENCE light and dark areas that proved difficult with
models—as well as wide areas at a low magnification. conventional KEYENCE models.

Receives diffuse reflected light Performance differences between Conventional KEYENCE 16-bit
accurately light-receiving elements
models

87.1 degrees

4× more
levels of grey

256× more
levels of grey

CCD With 14-bit scanning VK-X

(conventional KEYENCE model)
Blade edge (400×) 8-bit 14-bit 16-bit
(256 levels) (16384 levels) (65536 levels)

Glass + rubber: Sample with an extreme degree of reflectance variance (400×)

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 Precise 3D Measurements

MEMS actuator (1000×) Provided by Mita Laboratory, Graduate School of Engineering, University of Tokyo,
as part of the Nanotechnology Platform at the university’s VLSI Design and Education Center (VDEC)

0.5 nm Linear Scale Traceability

Using a high-precision linear scale, the Z-axis Laser confocal measurements are based on a
movement of objective lenses can be tracked with a traceability system that complies with national
0.5 nm resolution. This gives the VK-X very high standards, ensuring reliable precision, accuracy, and
performance for 3D measurements. repeatability.

Traceability System

Z X-Y

National Institute of Standards and National Institute of Advanced Industrial

Technology (NIST) Science and Technology (AIST)
Linear scale module

NVLAP accredited organisation JCSS accredited organisation

Coordinate measurement equipment

Standard step Reference scale

Step in the nanometre range (3000×)

3D Laser Scanning Confocal Microscope VK-X Series

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 Efficiency

Automatic Analysis
AI-ANALYSER
Multi-File Analyser visualises and quantifies the difference among multiple samples.

Multi-line Roughness
Horizon 1
Ra Rz RSm
Laser + Optical 3D
Profiles Ave. Ave. Ave.
μm μm μm
Total profile
Sample A

Roughness profile

Total profile

Sample B

Roughness profile

Total profile
Sample C

Roughness profile

Total profile

Sample D

Roughness profile

Roughness measurement of blasted surface (1000×)

By aligning the height range scales, the VK-X is able to perform the same measurements for
multiple data sources under identical conditions. This allows differences due to changes in
manufacturing conditions or over time to be quickly recognised for drastically reduced analysis
time.

Auto Arrange: 3D List Display:

Collective Analysis of Multiple Files Quickly and Clearly Find the Difference
The Auto Arrange function enables batch processing The VK-X is able to display 3D shapes side-by-side for
of various data with a single operation. This eliminates easier visual comparisons between samples. These
lost time and configuration errors for repeated comparison arrangements can then be saved as an
operations. image to assist in explanations to stakeholders.

Position alignment,
image processing,
and measurement
unification

Collective height
display setting

Collective graph
display setting

Corrosion evaluation of blasted surface (1000×)

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Automated and Fast Routine Inspections
Programming and batch measurement

Wire bonding (400×, image stitching)

The VK-X’s advanced motorised stage control allows measurements to be performed automatically at a specified XY coordinate
position. Taking advantage of this feature in combination with a special stage not only enables analysis of an increased number of
samples but also automates inspection work.

Easy Programming-Free Configuration for Batch measurement of Various Factors through

Automatic Analysis of Volume, Size, Flatness, Automatic Detection of Condition-Specific Areas
Etc. within the Field of View
The VK-X is capable of applying its various analysis With the VK-X, conditions can be specified to extract
settings to each measurement point. This eliminates only a specific area according to the height from the
the need for professional programming and enables reference plane or colour information per pixel. This
consecutive measurement of various elements, makes it possible to quickly calculate the total number
including volume, area, dimensions, and flatness. or volume of the extracted areas, or the ratio of the
area within the field of view.
Volume & area
Laser + Optical Measured values
Volume C.S. area Surface area Surface area/C.S. area Area ratio Average height Max. height Perimeter Horz. Feret Vert. Feret Circle equivalent dia

Total
Max.
Min.
Ave.
Std. DV
3 Sigma

Volume C.S. area Surface area Surface area/C.S. area Area ratio Average height Max. height Perimeter Horz. Feret Vert. Feret Circle equivalent dia

Total
Max.
Min.
Ave.
Std. DV
3 Sigma

Volume C.S. area Surface area Surface area/C.S. area Area ratio Average height Max. height Perimeter Horz. Feret Vert. Feret Circle equivalent dia

Total
Max.
Min.
Ave.
Std. DV
3 Sigma

Volume C.S. area Surface area Surface area/C.S. area Area ratio Average height Max. height Perimeter Horz. Feret Vert. Feret Circle equivalent dia

Total
Max.
Min.
Ave.
Std. DV
3 Sigma

Embossing area ratio measurement (200×)

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 Analysis Abilities

Cross-Section Measurement of Any Location

Determine the shape of a desired location non-destructively and without contact

Facets on GaAs due to liquid phase growth (3000×) Provided by Prof. Tadaaki Kaneko, Department of Chemistry,
School of Science and Technology, Kwansei Gakuin University

The VK-X reproduces surface appearances with high accuracy through non-contact, non-
destructive means. Measurements of a target’s height, width, angle, and more are performed with
no damage to the target. Once the data has been obtained, users can re-measure any location as
often as needed.

Measurement Position Detection Functions:

Auxiliary Tools for Cross-Section
Measurements: Determination of Exact Points
The VK-X offers accurate detection for hard-to-see
aspects including sphere or cylinder centres, and
minimum heights. Measurement of the same location
is possible with reduced variation.
Reliable Measurement of a Sectional
Measurement Line
Measurement is as simple as clicking on the cross-
section waveform. Even if the clicked position deviates
from the line, the measurement position is automatically
corrected for accurate, unvarying results.

Conventional KEYENCE Models Conventional KEYENCE Models

Error occurs depending on the selected position

Measurement of same location is difficult

Cylinder axis function Measurement position detection function

Accurately measures the centre section of a hair

Accurately measures the centre section of a hair Hair (3000×)

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Intuitive and Reliable Roughness Analysis
Compliant with ISO standards. Evaluate the roughness of a variety of objects.

Cutting surface: Surface roughness measurement (1000×)

The VK-X is capable of surface roughness (ISO 25178) and line roughness (ISO 4287)
measurements. Acquisition of minute changes in appearance incapable of being detected with a
needle allow for high-accuracy measurement.

Parameter Suggestions for Defining Differences in Sample Roughness

42 parameters are used to automatically compare multiple samples. Values such as Ra and Rz are automatically
visualised in relation to each other. Quickly analyse previously undefined aspects used to quantify differences between
targets, from judgement between good and bad products to analysis of samples made through different processing
methods. Explanations attached to each parameter help users to analyse surface texture.

Good sample: Ra = 1.8

Bad sample: Ra = 1.8

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 Quantification
Volume/Area Measurement
Along with the calculation of the volume of projections and
depressions relative to a reference plane, the measurement
of surfaces, sectional areas, area ratios, average heights,
and maximum heights, up to 3000 points can be processed
to produce data for averages, minimums and maximums.
Photoresist (1000×)
Line Roughness Measurement (ISO 4287) on
Individual Objects or Entire Batches
Roughness measurement for ISO-compliant shapes is
possible with the VK-X. With a spot diameter of 0.4 µm, the
laser light is able to accurately analyse even extra-detailed
shapes. The VK-X also features a contact-type roughness
metre mode that can be used to determine correlation with
measurements from conventional KEYENCE models.
Roughness gauge curve data
VK-X roughness gauge mode curve data
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Measurement of the Average Step Height
The VK-X measures how high a specified surface area is
with respect to the reference plane. In addition, detection of
the lowest and highest points within a specified area make it
possible to measure flatness from the difference.
Switch (400×)
Measurement of the degree of flatness in the specified area
Surface Roughness Measurement (ISO 25178)
The VK-X utilises data from the overall surface to achieve
ISO-based roughness measurements. Roughness can be
calculated from areas often overlooked by line measurement
for accurate and stable measurement.
Processed metal surface (400×)
Non-contact roughness measurement of the entire target plane on the screen
2D Measurements
Various XY measurements are possible including distance,
circular diameter, and angle. The wide selection of functions
helps to reduce variation through automatic extraction of
target contours and the creation of auxiliary lines and
intersections.
Film Thickness Measurement
The VK-X measures thickness by analysing the light reflected
from two locations of a transparent object—the top surface
and the bottom surface. The topmost and bottommost layers
of the film are converted to a 3D image, and the thickness is
measured from the image’s cross-sectional shape.

Transparent 3D image
coating

Surface of a cell phone

housing (1000×)

Surface of the
plastic housing

Transparent
Thickness of coating
the coating film
Surface of the
plastic housing

Gear: Dimension measurement (50×)

Topmost Surface Measurement

on Transparent Objects and Thin Films
With thin transparent film, the light reflects from both the top
and bottom layers, making measurement difficult. With the
VK-X’s Topmost Surface Measurement mode, accurate
measurement of the top layer is possible.
Without Topmost Surface Measurement mode
Automatic Measurement
Using reflected light intensity data makes it possible for the
VK-X to automatically determine various features such as the
highest point and the edge. Measurement of the height and
width can then be performed automatically. Samples can be
measured simply by clicking the mouse, improving
inspection productivity.

The top face of the transparent

object cannot be measured due to
the reflection from the bottom
face.

With Topmost Surface Measurement mode

The reflection from the top face of

a transparent body can be
identified.

Protective coating (1000×) Substrate (100×, stitching of 7 × 6 images)

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 Observation

Microscope Functions
High-quality optical observation for all users

PCB (42×, image stitching)

KEYENCE’s microscope
technology has been cultivated
over many years and allows
users to capture clear images
easily. This means the VK-X
also makes for a high-
performance observation
Through-hole (70×) Colour sensor (200×) Chip resistor (100×) instrument.

Depth Composition Ensures Fully Focused

HDR Function for Clearer Observation
The camera captures multiple images at different
brightness levels by varying the shutter speed,
and then produces an image with a high level of
colour gradation data. This allows for clear
observation of targets with glare or low contrast.
Images for Accurate Judgement
The VK-X can create fully focused images even for
targets that can only be partially observed in focus
with an optical microscope. This makes it possible for
users to analyse targets efficiently.

Without HDR Optical image

With HDR Ink toner (400×) Depth composition Chip resistor (100×)
image

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High-Resolution/High-Magnification
Fully-Focused Colour Observation
28800× magnification without the need for pre-processing or vacuum
Fully focused optical image
16-bit laser colour image
Auto-Navigation for Reliable Positioning
at High Magnification
The VK-X’s advanced navigation image prevents users
from losing sight of the observation position. Simply
select the desired location and watch as the stage
moves, the lenses switch, and the focus adjusts
completely automatically.
Click to move
Click to move the observation position
Abrasive (400×)
C-Laser Differential Interference Contrast (DIC)
Visualises Nano-Scale Undulations and Scratches
The Differential Interference Contrast (DIC) imaging
method makes it possible to see nano-level features
difficult to see with conventional KEYENCE
microscopes. Measurement can also be performed
directly on the 3D display for reliable analysis.
VK-X optical image
Measurement of a micro section
DIC image (differential MEMS (6000×)
interference contrast)
Nano-scale undulations or scratches can be specified as measurement targets.
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 Principle of Measurement and Observation

Colour CMOS camera X-Y scanning optical system Half mirror

Short wavelength
laser light source

Condensing lens

Half mirror
Pinhole

Light receiving element

(photomultiplier)

Half mirror
White light source
for illumination

Objective lens

Observed target object

Functional diagram of the measurement principle

Short-wavelength 1024×768
laser light pixels
Measurement range

1. The laser scans in the X and Y directions.

2. The objective lens moves in the Z direction and
the laser scans in the X and Y directions again.
3. This scanning procedure is repeated until the end of
the measurement depth is reached.
4. The measurement is then complete.

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Two Light Sources
The VK-X uses two light sources: laser light and white light. The high-speed, quiet laser scanning of a
surface in the X, Y, and Z directions allows image capture and height measurement with high horizontal
resolution. The use of white light also makes it possible to capture the colour of the sample surface.

380 400404 500 600 661 700 780

Laser source: Two types of laser sources are available for the VK-X: a 404 nm violet
semiconductor laser and a 661 nm red semiconductor laser. Customers can select a laser
based on the characteristics of each wavelength and their suitability for the intended
application.

Three Types of Images

The laser beam, transmitted through an X-Y optical scanning system, scans the area within the field of
view, which is divided into 2048 × 1536 pixels. This scanning procedure is repeated for each
measurement height to obtain both the reflected laser light data and the colour information data for
each individual pixel. Then, the colour data from precisely focused positions is used to generate a
high-definition colour image showing height differences.

Data for colour and Data for laser intensity Data for height difference
laser intensity

Pinhole Confocal Optical System

The VK-X incorporates a pinhole confocal optical system. The small pinhole completely eliminates all
influences of ambient light and light that is reflected from positions other than the focal point. This
assures that the position at which the beam is reflected with the highest energy density represents the
exact height. In addition to measurement using precise positioning, high-accuracy and high-
magnification observation is also possible by stitching images after removing out-of-focus sections.

Detection of the peak (focal point) by means of the pinhole confocal optical system in comparison to
systems using a CCD chip without a pinhole

Z-I curve (light intensity) The peak of the light intensity is broader
of systems without PMT in conventional KEYENCE optical
(received intensity
of the reflected light)
Intensity

and pinhole systems because there is no pinhole.

Ambient light from points other

Z-I curve of the pinhole than the peak (focal point)
confocal optical system

Focal point Z position

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 Measurement & Analysis Software Module (Option)

Analysis Expansion Module VK-H1XP

This module increases efficiency by offering flexible analysis for a larger number of samples.

Measurement of Depressions Measurement of Spheres

and Projections
The Analysis Expansion Module can capture
regions which lie above (projections) or
below (depressions) certain defined limit
values. Accordingly, area ratios and
volumes can also be measured.
and Surface Angles
The radii of circular structures can be
extracted automatically from a specified
area. This greatly reduces measurement
variations because these extractions are
performed automatically instead of visually
by the user.
Position Compensation
If a standard sample has been saved
beforehand and a different image is opened
in a template, the Analysis Expansion
Module automatically compensates the
image position so that the image is opened
at the same position as the saved sample.

Projection Measurement Sphere Measurement Automatic Position Compensation

Tilted image After automatic position

compensation

Wire bond (2000×) Microlens (1000×)

Particle Analysis Module VK-H1XG

For samples that have many particles (circles) within the microscope’s field Particles can be counted and analysed based on
of view, the number of particles, their diameters, the major and minor axes, accurate 3D surface data. The results can be
the area and the area ratio are all measured automatically. There are also output to Microsoft®Excel® or other software for
automatic functions for operations such as circular shape separation, easy analysis or statistical processing.
expansion, and degeneration.

Metal surface with particles (1000×)

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 Large Stands and Stages / Lenses (Optional Accessories)

VK spacer Motorised stage

Using dedicated, high-rigidity spacers behind the microscope The high-accuracy, motorised XY stage enables fast and
makes it possible to measure even large samples. precise movement, programmable measurement, and image
stitching capabilities.

Spacer

300 mm wafer stage Additional stand and stage versions

The entire surface of a 300 mm wafer can be examined and Upon request, there is also a large selection of optional stages
analysed. Easy-to-mount design. Please contact KEYENCE for to choose from for measuring larger samples.
other sample stage sizes.

Extensive lens lineup

An extensive lineup of VK-X lenses is available, from 2.5× to

150×. All lenses undergo special tuning and inspection before Comprehensive lineup including lenses with long working
distances for a clear space to place samples
being shipped with each system. The lineup includes lenses
with long working distances and those for targets with a high
Examples of lenses with Monitor Working
aspect ratio. long working distances magnification distance

Standard 5× lens 120× 22.5 mm

Extra-long working
distance 480× 20.5 mm
20× lens
Extra-long working
distance 1200× 13.8 mm
50× lens
Extra-long working
distance 2400× 4.7 mm
100× lens

Fluorite, which has low refraction

and colour aberration, is used as
the lens material.

25
 Measurement Examples

Automotive and Metal

Fracture surface: Measurement of the maximum height difference (400×) Processed metal surface: Surface roughness comparison (400×)

Drill bit: Radius measurement (100×) Throw-away chip: Wear analysis (100×)

26
 Precision Processing and Chemical

Film: Surface roughness measurement (3000×) Light guide plate: Surface area and volume measurement (3000×)

Microlens: Radius measurement (1000×) Film: Fish eye imperfection measurement (1000×)

27
 Measurement Examples

Semiconductor and Electronic Components

Inductor: Sectional measurement Provided by Mita Laboratory, Graduate School of Engineering, PCB (42×, image stitching)
(1000×) University of Tokyo, VLSI Design and Education Centre (VDEC) (P5)

Bottom of a wafer: Surface roughness measurement (1000×) MEMS: Sectional Provided by Dr. Matthieu Denoual (GREYC/CNRS, ENSI de Caen, France) and Mita
measurement (1000×) Laboratory, Graduate School of Engineering, University of Tokyo, VLSI Design and
Education Centre (VDEC) (Front)

28
 Further Examples

Surface of paper: Degree of flatness measurement (100×) Clock movement (100×, image stitching)

Metal fracture surface: Scoring (200×) Hair: Hair cuticle comparison (3000×)

29
 Products

16-bit 3D Laser Scanning Confocal Microscope 16-bit 3D Laser Scanning Confocal Microscope
Controller VK-X1000 Controller VK-X1000
Measurement head VK-X1100 Measurement head VK-X1050
Stage (motorised/manual) Stage (motorised/manual)
VK-D1/VK-S1 VK-D1/VK-S1

Violet semiconductor laser: Red semiconductor laser:

wavelength = 404 nm wavelength = 661 nm

Z display resolution: 0.5 nm Z display resolution: 5 nm

System Configuration

Optional Accessories Stage Measurement head Controller

Motorised XY stage:
VK-S2100
Stage for 300 mm wafers:
OP-88231 (optional) Motorised stage: VK-D1 VK-X1100 VK-X1000
VK spacer:
OP-88232 (optional)
Ring illumination for targets
at 2.5×:
OP-88230 (optional)
VK reference gauge:
OP-88248 (optional) Manual stage: VK-S1 VK-X1050 Control PC Monitor (optional)
Extension cable set:
OP-88249 (optional)
Observation/analysis software set: VK-H2X Particle analysis module: VK-H1XG (optional)
* Please contact KEYENCE for a
stage suitable for large-sized Image stitching application: ISO 25178 Surface texture measurement module:
samples. VK-H2J (optional) VK-H1XR (optional)
Analysis expansion module:
VK-H1XP (optional)

Dimensions

Unit: mm

125 328 306 468

Controller: Measurement
VK-X1000 head:
VK-X1100/
184
227.8

213

X1050

Installation 317.7 50.3

surface 181
116
25 1 6
8×M0
th 1
R (Dep less)
De 2.5 or
pth
7 R2.5 Depth 7
94

195
84
80
62

39

98
71

52.5

24.5
38

92.5
88
112 116 Hatching
installation
surface

Motorised stage: VK-D1 Manual stage: VK-S1

288
288

30
30

77
77

307 45 307 45
192 ø75 218 192 ø75 218
348 428 48 348 428 48

526

30
 Specifications

Basic Functions
Model (controller/measurement head) VK-X1000/X1100 VK-X1000/X1050
Total magnification*1 Up to 28800×
Field of view (minimum range) 11 to 7398 µm
Frame rate*2 (laser measurement speed) 4 to 125 Hz, 7900 Hz
Optical system Pinhole confocal optical system, Focus variation
Measurement Light-receiving element 16-bit sensing: photomultiplier, High-definition colour CMOS
principle Scanning method (during general Automatic upper/lower limit setting, rapid laser light intensity setting (AAGII),
measurement and image stitching) automatic detection and rescanning in case of poor reflection (double scan)
Display resolution 0.5 nm 5 nm
Linear scale 0.5 nm 5 nm
Dynamic range 16 bits
Height measurement Laser confocal 20×, 40 nm; 50×, 12 nm 20×, 40 nm; 50×, 20 nm
Repeatability σ
Focus variation 5×, 500 nm; 10×, 100 nm; 20×, 50 nm; 50×, 20 nm 5×, 500 nm; 10×, 100 nm; 20×, 50 nm; 50×, 30 nm
Height data acquisition range 0.7 million steps
Accuracy*3 0.2 + L/100 μm or better
Display resolution 1 nm 10 nm
Laser confocal 20×, 100 nm; 50×, 40 nm 20×, 100 nm; 50×, 50 nm
Width measurement Repeatability 3σ
Focus variation 5×, 400 nm; 10×, 400 nm; 20×, 120 nm; 50×, 50 nm 5×, 400 nm; 10×, 400 nm; 20×, 120 nm; 50×, 65 nm
Accuracy*3 ±2%
XY stage Manual: Moving range 70 mm × 70 mm
configuration Motorised: Moving range 100 mm × 100 mm
High-definition colour CMOS image
16-bit laser colour confocal image
Image options
Observation Confocal optical system with ND filter
C-laser DIC image (differential interference image)
Illumination Ring illumination, coaxial illumination
Wavelength Violet semiconductor laser, 404 nm Red semiconductor laser, 661 nm
Laser light source for
Maximum output power 1 mW
measurements
Laser class Class 2 laser product (IEC60825-1)
Voltage 100 to 240 VAC, 50/60 Hz
Power supply
Consumption 150 VA
Measurement head Approx. 13.0 kg
Weight Stage Approx. 16.0 kg (+2.5 kg with motorised stage attached)
Controller Approx. 3.0 kg
*1 23 inch full-screen display.
*2 At maximum speed when using a combination of measurement mode/measurement quality/lens magnification. When the line scan is within a measurement pitch of 0.1 μm.
*3 When measuring a standard sample (standard scale) with a 20× objective lens (or higher).

Measuring Lenses
W/D
Objective lens Field of view VK-X1100 VK-X1050
(mm)
2.5× 8.8 675 × 506 µm to 7398 × 5545 µm Optional Optional
5× 22.5 337 × 253 µm to 3699 × 2773 µm Included in scope of delivery Included in scope of delivery
10× 16.5 168 × 126 µm to 1849 × 1386 µm Included in scope of delivery Included in scope of delivery
20× 3.1 84 × 63 µm to 924 × 693 µm Included in scope of delivery Included in scope of delivery
50× 0.54 33.7 × 25.2 µm to 370 × 277 µm Not supported Included in scope of delivery
100× 0.35 16.8 × 12.6 µm to 185 × 138 µm Not supported Optional
×50 Plan Apo 0.35 33.7 × 25.2 µm to 370 × 277 µm Included in scope of delivery Optional
×100 Plan Apo 0.32 16.8 × 12.6 µm to 185 × 138 µm Optional Optional
×150 Plan Apo 0.2 11 × 8.3 µm to 123 × 92 µm Optional Optional
Long working distance, 20× 11.0 84 × 63 µm to 924 × 693 µm Optional Optional
Long working distance, 50× 8.7 33.7 × 25.2 µm to 370 × 277 µm Optional Optional
Long working distance, 100× 2 16.8 × 12.6 µm to 185 × 138 µm Optional Optional
Extra-long working distance, 20× 20.5 84 × 63 µm to 924 × 693 µm Optional Optional
Extra-long working distance, 50× 13.8 33.7 × 25.2 µm to 370 × 277 µm Optional Optional
Extra-long working distance, 100× 4.7 16.8 × 12.6 µm to 185 × 138 µm Optional Optional
Lens replacement Can be replaced by the user.

* Microsoft®Excel® is either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries.

31
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Copyright © 2018 KEYENCE CORPORATION. All rights reserved. VKX1000-KD-C-GB 1078-3 622E40 L