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Chapter 4 - Vibration Assisted Milling
Chapter 4 - Vibration Assisted Milling
Chapter 4 - Vibration Assisted Milling
In addition to the aims of achieving tight tolerances and high quality surface finishes,
many applications also require the use of hard and brittle materials such as optical glass
and technical ceramics.
The materials for biomedical, e.g., brain implants are made of semiconductor materials
(silicon, gallium nitride, silicon carbide), automatics and robotics, made of piezoelectric
materials (aluminium nitride, lithium niobate).
There are two major bottlenecks which limit further development of micromilling
1. The deformation and vibration between the microcutter and the workpiece would interfere with
the machining accuracy.
2. The excessive tool wear and short tool life during micromilling.
With appropriate machining and vibration conditions the tool periodically loses contact
with the chip, which changes the cutting mechanics and can improve machining
performance.
VAM has been applied to several machining processes for the processing of hard
materials, including turning, milling, drilling, and grinding.
VAM reduces the machining forces, improved surface finish and accuracy, suppression of
burr formation, reduces tool wear and extends tool life.
……………………….(1)
Assume that vibration is applied to workpiece and the vibration trajectory becomes:
……………………….(2)
An appropriate pattern of toolworkpiece separation (TWS) is the key to the success of VAM
In position 3 the cutting direction component of the relative velocity is negative, i.e., in the opposite
direction to the tool rotation, and the tool separates from the workpiece the cutting direction
component of the relative velocity changes from zero to negative then to positive. In position 4 the tool
regains contact with the workpiece.
Micromanufacturing Lab, I.I.T. Kanpur
Type II TWS
Type II separation occurs in the current tool path, where
vibration displacement in the instantaneous cutting thickness
direction (i.e., tool radial direction) is larger than the
instantaneous uncut chip thickness, resulting in the tool being
cut out of the workpiece and hence TWS takes place.
When the tool advances to position 2 where the vibration displacement in the tool radial direction is
same as the instantaneous uncut chip thickness, and it is about to break contact with workpiece.
In position 3 the vibration displacement exceeds the instantaneous uncut chip thickness, and the tool
completely separates from the workpiece.
Until the vibration displacement is equal to the instantaneous uncut chip thickness in position 4 the tool
regains contact with the workpiece.
Micromanufacturing Lab, I.I.T. Kanpur
Type III TWS
It can be seen that the current tool path with vibration
assistance overlaps in some regions with the surface contour
left by previous cutting path(s).
It should be noted that in most cases during VAMILL, Type I, II, and III separation could happen
simultaneously.
Differentiating Eq. (1), the relative velocity of the tool tip without vibration assistance, i.e.,
the nominal cutting velocity, Vt, is obtained as
As shown in the simulation example, within a full circle of tool rotation, the region where
Type I separations is likely to occur is
where θ=θ1
Micromanufacturing Lab, I.I.T. Kanpur
(A) The region where Type 1 separation is likely to occur during
one circle of tool path
Rearrange Eq.
As shown in the simulation example, within a full circle of tool rotation, the region where
Type I separations are is likely to occur is
In a conventional milling process, the instantaneous uncut chip thickness, hD, can be
expressed by
when tanθ<yw=fz, hDV can be less than zero, thus Type II separation could occur as shown in
kinematic simulation results of Fig.B.
when fz -xw < 0, hDV can be less than zero, thus Type II separation will occur as shown in
kinematic simulation results of Fig.D.
It can be found that in order to
achieve periodic Type II
separation, the vibration should be
applied in the feed direction, and
the vibration amplitude should be
larger than the feed per tooth, but
large vibration amplitude will
affect the quality of processing,
increase the impact force on the
tool, and worsen the machining
quality.
Micromanufacturing Lab, I.I.T. Kanpur
Type III Separation Requirements
Type III separation depends on the surface contour generated by previous tool paths, for
which a mathematical expression is difficult to obtain.
The trajectory of the tool tip and instantaneous uncut chip thickness when the vibration
frequency is odd times of the spindle speed Micromanufacturing Lab, I.I.T. Kanpur
The trajectory of the tool tip and instantaneous uncut chip thickness when the vibration
frequency is even times of the spindle speed.
If the vibration amplitude is larger than half of the feed per tooth, the tool tip and the
workpiece are continuously periodically separated in the whole cutting process as shown in
Fig. B
Micromanufacturing Lab, I.I.T. Kanpur
When the applied vibration frequency is even times of the spindle rotation frequency, the
peaks (troughs) of waves in the ith tool tip trajectory overlap with the peaks (troughs) of
wave in the (i+1)th tool tip trajectory as shown in Fig. C
These overlaps make the uncut chip thickness fluctuate constantly, but no Type III
separation occurs during the whole cutting process as shown in Fig. D
Piezo-Actuator
Magneto-Strictive Actuator
Xiang et al. established a system that combined the milling process with 35 kHz 15 μm
longitudinal vibration generated by a magneto-strictive actuator as shown in Fig. during the
milling of SiCp/Al composites.
Reduction in both cutting forces and crack growth were reported.
➢ Resonant mode
➢ Nonresonant mode
In this mode the losses of energy in electromechanical conversion and self-heating are
quite low, and the vibration frequency can reach as high as up to several tens of kHz with
the amplitudes ranging from several to several hundred microns.
Experimental setup of two VAM systems where the vibration is applied at the workpiece holder
Micromanufacturing Lab, I.I.T. Kanpur
Nonresonant Mode
The nonresonant mode is usually used for 2D vibration-assisted milling in feed and cross-feed
directions.
The typical solution of the nonresonant mode is using the flexure mechanism driven by
piezo-actuators.
The nonresonant system is not limited to a fixed operating frequency and offers a more
precise motion control.
However, it is difficult to produce a high operating frequency due to low stiffness of the
structure (to allow it to be driven by piezo-actuators) and hence natural frequency.
A modular capacitive sensor system (DL6220, Microepsilon) and two capacitive sensors
(CS005, Microepsilon) with 1 nm resolution and 50 μm measuring range are used to measure
the displacement in both directions
The advantage of VAM, such as low cutting forces, long tool life, high surface integrity, and
excellent cutting accuracy, are also applicable to VAMILL.
Compared with vibration-assisted turning processes, the VAMILL process is more complex.
Tool tip trajectory, instantaneous uncut chip thickness, dynamic cutting forces, VAM duty
cycle, microtool wear, etc. are difficult to determine, so that accurate kinematic and
dynamic models are needed to guide the VAMILL.
Micromanufacturing Lab, I.I.T. Kanpur