BTA204S-800E: 1. Product Profile

BTA204S-800E
AK
DP
3Q Hi-Com Triac
Rev. 6 — 10 May 2011 Product data sheet
1. Product profile
1.1 General description

Planar passivated high commutation three quadrant triac in a SOT428 (DPAK)
surface-mountable plastic package. This "series E" triac balances the requirements of
commutation performance and gate sensitivity and is intended for interfacing with low
power drivers and logic ICs including microcontrollers.
1.2 Features and benefits

3Q technology for improved noise Planar passivated for voltage
immunity ruggedness and reliability
Direct triggering from low power Sensitive gate for easy logic level
drivers and logic ICs triggering
High blocking voltage capability Surface-mountable package
High commutation capability Triggering in three quadrants only
1.3 Applications
AC solenoids Home appliances
General purpose motor control
1.4 Quick reference data

Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
VDRM repetitive peak off-state - - 800 V
voltage
ITSM non-repetitive peak full sine wave; Tj(init) = 25 °C; - - 25 A
on-state current tp = 20 ms; see Figure 4;
see Figure 5
IT(RMS) RMS on-state current full sine wave; Tmb ≤ 107 °C; - - 4 A
see Figure 1; see Figure 2;
see Figure 3
NXP Semiconductors BTA204S-800E
3Q Hi-Com Triac
Table 1. Quick reference data …continued

Static characteristics
IGT gate trigger current VD = 12 V; IT = 0.1 A; T2+ G+; - - 10 mA
Tj = 25 °C; see Figure 7
VD = 12 V; IT = 0.1 A; T2+ G-; - - 10 mA
VD = 12 V; IT = 0.1 A; T2- G-; - - 10 mA
2. Pinning information
Table 2. Pinning information
Pin Symbol Description Simplified outline Graphic symbol
1 T1 main terminal 1
mb
2 T2 main terminal 2 T2 T1
G
3 G gate sym051
mb T2 mounting base; main terminal 2
2
1 3
SOT428 (DPAK)
3. Ordering information
Table 3. Ordering information
Type number Package
Name Description Version
BTA204S-800E DPAK plastic single-ended surface-mounted package (DPAK); 3 leads SOT428
(one lead cropped)
BTA204S-800E All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 6 — 10 May 2011 2 of 14

3Q Hi-Com Triac
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDRM repetitive peak off-state voltage - 800 V
IT(RMS) RMS on-state current full sine wave; Tmb ≤ 107 °C; see Figure 1; - 4 A
see Figure 2; see Figure 3
ITSM non-repetitive peak on-state full sine wave; Tj(init) = 25 °C; tp = 20 ms; - 25 A
current see Figure 4; see Figure 5
full sine wave; Tj(init) = 25 °C; tp = 16.7 ms - 27 A
I2t I2t for fusing tp = 10 ms; sine-wave pulse - 3.1 A2s
dIT/dt rate of rise of on-state current IT = 6 A; IG = 0.2 A; dIG/dt = 0.2 A/µs - 100 A/µs
IGM peak gate current - 2 A
PGM peak gate power - 5 W
PG(AV) average gate power over any 20 ms period - 0.5 W
Tstg storage temperature -40 150 °C
Tj junction temperature - 125 °C
003aad615 003aag083
5 12
IT(RMS) I T(RMS )
(A) (A)
107 °C 10
4
8
3
2
4
1
2
0 0
-50 0 50 100 150 10-2 10-1 1 10
Tmb (°C) s urge duration (s)
Fig 1. RMS on-state current as a function of mounting Fig 2. RMS on-state current as a function of surge
base temperature; maximum values duration; maximum values

3Q Hi-Com Triac
003aag081
8 101
conduction form Tmb(max)
Ptot angle factor
(degrees) a 104 (°C)
(W)
30 4 a = 180 °
6 107
60 2.8
a 120 °
90 2.2
120 1.9 110
90 °
180 1.57
60 °
4 113
30 °
116
2 119
122
0 125
0 1 2 3 4 5
IT(RMS) (A)
Fig 3. Total power dissipation as a function of RMS on-state current; maximum values
003aag085
103
I TS M IT ITSM
(A)
t
tp
Tj(init) = 25 °C max
(1)
102
10
10-5 10-4 10-3 10-2 10-1
t p (s)
Fig 4. Non-repetitive peak on-state current as a function of pulse width; maximum values

3Q Hi-Com Triac
003aag086
30
ITSM
(A)
20
IT ITSM
10
1/f
Tj(init) = 25 °C max
0
1 10 102 103
number of cycles
f = 50 Hz
Fig 5. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum
values

3Q Hi-Com Triac
5. Thermal characteristics
Table 5. Thermal characteristics
Rth(j-mb) thermal resistance from junction to full cycle; see Figure 6 - - 3 K/W
mounting base half cycle; see Figure 6 - - 3.7 K/W
Rth(j-a) thermal resistance from junction to in free air; printed circuit board - 75 - K/W
ambient (FR4) mounted
003aag087
10
Zth(j-mb) (1)
(K/W)
(2)
10-1
P
tp t
10-2
10-5 10-4 10-3 10-2 10-1 1 10
tp (s)
(1) Unidirectional (half cycle)

(2) Bidirectional (full cycle)
Fig 6. Transient thermal impedance from junction to mounting base as a function of pulse width

3Q Hi-Com Triac
6. Characteristics
Table 6. Characteristics
Static characteristics
IGT gate trigger current VD = 12 V; IT = 0.1 A; T2+ G+; Tj = 25 °C; - - 10 mA
see Figure 7
VD = 12 V; IT = 0.1 A; T2+ G-; Tj = 25 °C; - - 10 mA
see Figure 7
VD = 12 V; IT = 0.1 A; T2- G-; Tj = 25 °C; - - 10 mA
see Figure 7
IL latching current VD = 12 V; IG = 0.1 A; T2+ G+; - - 12 mA
VD = 12 V; IG = 0.1 A; T2+ G-; Tj = 25 °C; - - 18 mA
see Figure 8
VD = 12 V; IG = 0.1 A; T2- G-; Tj = 25 °C; - - 12 mA
see Figure 8
IH holding current VD = 12 V; Tj = 25 °C; see Figure 9 - - 12 mA
VT on-state voltage IT = 5 A; Tj = 25 °C; see Figure 10 - 1.4 1.7 V
VGT gate trigger voltage VD = 12 V; IT = 0.1 A; Tj = 25 °C; - 0.7 1.5 V
see Figure 11
VD = 400 V; IT = 0.1 A; Tj = 125 °C; 0.25 0.4 - V
see Figure 11
ID off-state current VD = 800 V; Tj = 125 °C - 0.1 0.5 mA
Dynamic characteristics
dVD/dt rate of rise of off-state voltage VDM = 536 V; Tj = 125 °C; exponential 30 - - V/µs
waveform; gate open circuit
dIcom/dt rate of change of VD = 400 V; Tj = 125 °C; IT(RMS) = 4 A; 8 - - A/ms
commutating current dVcom/dt = 0.1 V/µs; gate open circuit
VD = 400 V; Tj = 125 °C; IT(RMS) = 4 A; 2.1 - - A/ms
dVcom/dt = 10 V/µs; gate open circuit
tgt gate-controlled turn-on time ITM = 12 A; VD = 800 V; IG = 0.1 A; - 2 - µs
dIG/dt = 5 A/µs

3Q Hi-Com Triac
003aad600 003aad604
3 3
IGT IL
IGT(25°C) IL(25°C)
(1)
2 2
(2)
(3)
1 1
0 0
-50 0 50 100 150 -50 0 50 100 150
Tj (°C) Tj (°C)
(1) T2- G-
(2) T2+ G-
(3) T2+ G+
Fig 7. Normalized gate trigger current as a function of Fig 8. Normalized latching current as a function of
junction temperature junction temperature
003aad606 003aad611
3 12
IH IT (1) (2) (3)

IH(25°C) (A)
2 8
1 4
0 0
-50 0 50 100 150 0 1 2 3
Tj (°C) VT (V)
Vo = 1.27 V; Rs = 0.091 Ω
(1) Tj = 125 °C; typical values
(2) Tj = 125 °C; maximum values
(3) Tj = 25 °C; maximum values
Fig 9. Normalized holding current as a function of Fig 10. On-state current as a function of on-state
junction temperature voltage

3Q Hi-Com Triac
003aad596
1.6
VGT
VGT(25°C)
1.2
0.8
0.4
-50 0 50 100 150
Tj (°C)
Fig 11. Normalized gate trigger voltage as a function of junction temperature

3Q Hi-Com Triac
7. Package outline
Plastic single-ended surface-mounted package (DPAK); 3 leads (one lead cropped) SOT428
E A A
b2 A1 E1
mounting
base D2
D1
HD
2
L2 L
1 3 L1
b1 b w M A c
e1
0 5 10 mm
scale
DIMENSIONS (mm are the original dimensions)

D2 E1 L1 y
UNIT A A1 b b1 b2 c D1 E e e1 HD L L2 w
min min min max
2.38 0.93 0.89 1.1 5.46 0.56 6.22 4.0 6.73 4.45 10.4 2.95 0.5 0.9
mm 2.285 4.57 0.2 0.2
2.22 0.46 0.71 0.9 5.00 0.20 5.98 6.47 9.6 2.55 0.5
OUTLINE REFERENCES EUROPEAN

ISSUE DATE
VERSION IEC JEDEC JEITA PROJECTION
06-02-14
SOT428 TO-252 SC-63
06-03-16
Fig 12. Package outline SOT428 (DPAK)

3Q Hi-Com Triac
8. Revision history
Table 7. Revision history
Document ID Release date Data sheet status Change notice Supersedes
BTA204S-800E v.6 20110510 Product data sheet - BTA204S_SER_D_E_F v.5
Modifications: • The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Type number BTA204S-800E separated from data sheet BTA204S_SER_D_E_F v.5.
BTA204S_SER_D_E_F v.5 20060216 Product data sheet - BTA204S_SER_D_E_F v.4

3Q Hi-Com Triac
9. Legal information
9.1 Data sheet status

Document status [1] [2] Product status [3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product development.
Preliminary [short] data sheet Qualification This document contains data from the preliminary specification.
Product [short] data sheet Production This document contains the product specification.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term 'short data sheet' is explained in section "Definitions".
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product
status information is available on the Internet at URL http://www.nxp.com.
9.2 Definitions Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
Preview — The document is a preview version only. The document is still limitation specifications and product descriptions, at any time and without
subject to formal approval, which may result in modifications or additions. notice. This document supersedes and replaces all information supplied prior
NXP Semiconductors does not give any representations or warranties as to to the publication hereof.
the accuracy or completeness of information included herein and shall have
no liability for the consequences of use of such information. Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
Draft — The document is a draft version only. The content is still under safety-critical systems or equipment, nor in applications where failure or
internal review and subject to formal approval, which may result in malfunction of an NXP Semiconductors product can reasonably be expected
modifications or additions. NXP Semiconductors does not give any to result in personal injury, death or severe property or environmental
representations or warranties as to the accuracy or completeness of damage. NXP Semiconductors accepts no liability for inclusion and/or use of
information included herein and shall have no liability for the consequences of NXP Semiconductors products in such equipment or applications and
use of such information. therefore such inclusion and/or use is at the customer’s own risk.
Short data sheet — A short data sheet is an extract from a full data sheet Quick reference data — The Quick reference data is an extract of the
with the same product type number(s) and title. A short data sheet is intended product data given in the Limiting values and Characteristics sections of this
for quick reference only and should not be relied upon to contain detailed and document, and as such is not complete, exhaustive or legally binding.
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales Applications — Applications that are described herein for any of these
office. In case of any inconsistency or conflict with the short data sheet, the products are for illustrative purposes only. NXP Semiconductors makes no
full data sheet shall prevail. representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between Customers are responsible for the design and operation of their applications
NXP Semiconductors and its customer, unless NXP Semiconductors and and products using NXP Semiconductors products, and NXP Semiconductors
customer have explicitly agreed otherwise in writing. In no event however, accepts no liability for any assistance with applications or customer product
shall an agreement be valid in which the NXP Semiconductors product is design. It is customer’s sole responsibility to determine whether the NXP
deemed to offer functions and qualities beyond those described in the Semiconductors product is suitable and fit for the customer’s applications and
Product data sheet. products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
9.3 Disclaimers applications and products.
Limited warranty and liability — Information in this document is believed to NXP Semiconductors does not accept any liability related to any default,
be accurate and reliable. However, NXP Semiconductors does not give any damage, costs or problem which is based on any weakness or default in the
representations or warranties, expressed or implied, as to the accuracy or customer’s applications or products, or the application or use by customer’s
completeness of such information and shall have no liability for the third party customer(s). Customer is responsible for doing all necessary
consequences of use of such information. testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
In no event shall NXP Semiconductors be liable for any indirect, incidental, the products or of the application or use by customer’s third party
punitive, special or consequential damages (including - without limitation - lost customer(s). NXP does not accept any liability in this respect.
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such Limiting values — Stress above one or more limiting values (as defined in
damages are based on tort (including negligence), warranty, breach of the Absolute Maximum Ratings System of IEC 60134) will cause permanent
contract or any other legal theory. damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
Notwithstanding any damages that customer might incur for any reason the Recommended operating conditions section (if present) or the
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards Characteristics sections of this document is not warranted. Constant or
customer for the products described herein shall be limited in accordance repeated exposure to limiting values will permanently and irreversibly affect
with the Terms and conditions of commercial sale of NXP Semiconductors. the quality and reliability of the device.

3Q Hi-Com Triac
Terms and conditions of commercial sale — NXP Semiconductors In the event that customer uses the product for design-in and use in
products are sold subject to the general terms and conditions of commercial automotive applications to automotive specifications and standards, customer
sale, as published at http://www.nxp.com/profile/terms, unless otherwise (a) shall use the product without NXP Semiconductors’ warranty of the
agreed in a valid written individual agreement. In case an individual product for such automotive applications, use and specifications, and (b)
agreement is concluded only the terms and conditions of the respective whenever customer uses the product for automotive applications beyond
agreement shall apply. NXP Semiconductors hereby expressly objects to NXP Semiconductors’ specifications such use shall be solely at customer’s
applying the customer’s general terms and conditions with regard to the own risk, and (c) customer fully indemnifies NXP Semiconductors for any
purchase of NXP Semiconductors products by customer. liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
No offer to sell or license — Nothing in this document may be interpreted or standard warranty and NXP Semiconductors’ product specifications.
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights. 9.4 Trademarks
Export control — This document as well as the item(s) described herein may Notice: All referenced brands, product names, service names and trademarks
be subject to export control regulations. Export might require a prior are the property of their respective owners.
authorization from national authorities.
Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,
Non-automotive qualified products — Unless this data sheet expressly FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,
states that this specific NXP Semiconductors product is automotive qualified, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,
the product is not suitable for automotive use. It is neither qualified nor tested QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,
in accordance with automotive testing or application requirements. NXP TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications. HD Radio and HD Radio logo — are trademarks of iBiquity Digital
Corporation.
10. Contact information

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com

3Q Hi-Com Triac
11. Contents
1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.1 General description . . . . . . . . . . . . . . . . . . . . . .1
1.2 Features and benefits . . . . . . . . . . . . . . . . . . . . .1
1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1
1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . .1
2 Pinning information . . . . . . . . . . . . . . . . . . . . . . .2
3 Ordering information . . . . . . . . . . . . . . . . . . . . . .2
4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .3
5 Thermal characteristics . . . . . . . . . . . . . . . . . . .6
6 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . .7
7 Package outline . . . . . . . . . . . . . . . . . . . . . . . . .10
8 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 11
9 Legal information. . . . . . . . . . . . . . . . . . . . . . . .12
9.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . .12
9.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
9.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .12
9.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .13
10 Contact information. . . . . . . . . . . . . . . . . . . . . .13
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2011. All rights reserved.

For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 10 May 2011
Document identifier: BTA204S-800E

BTA204S-800E: 1. Product Profile

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BTA204S-800E

1.1 General description

1.2 Features and benefits

1.4 Quick reference data

Table 1. Quick reference data …continued

mb T2 mounting base; main terminal 2

Product data sheet Rev. 6 — 10 May 2011 2 of 14

Product data sheet Rev. 6 — 10 May 2011 3 of 14

Product data sheet Rev. 6 — 10 May 2011 4 of 14

Product data sheet Rev. 6 — 10 May 2011 5 of 14

(1) Unidirectional (half cycle)

Product data sheet Rev. 6 — 10 May 2011 6 of 14

Product data sheet Rev. 6 — 10 May 2011 7 of 14

IH IT (1) (2) (3)

Product data sheet Rev. 6 — 10 May 2011 8 of 14

Fig 11. Normalized gate trigger voltage as a function of junction temperature

Product data sheet Rev. 6 — 10 May 2011 9 of 14

DIMENSIONS (mm are the original dimensions)

OUTLINE REFERENCES EUROPEAN

Fig 12. Package outline SOT428 (DPAK)

Product data sheet Rev. 6 — 10 May 2011 10 of 14

Product data sheet Rev. 6 — 10 May 2011 11 of 14

9.1 Data sheet status

Product data sheet Rev. 6 — 10 May 2011 12 of 14

10. Contact information

For sales office addresses, please send an email to: salesaddresses@nxp.com

Product data sheet Rev. 6 — 10 May 2011 13 of 14

© NXP B.V. 2011. All rights reserved.

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