Gartner Tool

Tool: Semiconductor
Spending by Customer,
2020

This tool contains data for the semiconductor spending patterns of the global top 100 electronics companies at the design
level and the purchasing level in 2019 and 2020. The company spending data is presented by region, by chip type and by
electronic equipment type.
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© 2021 Gartner, Inc. and/or its affiliates. All rights reserved. Gartner is a registered trademark of Gartner, Inc. or its affiliates. This
presentation, including all supporting materials, is proprietary to Gartner, Inc. and/or its affiliates and is for the sole internal use of the
intended recipients. Because this presentation may contain information that is confidential, proprietary or otherwise legally protected, it may
not be further copied, distributed or publicly displayed without the express written permission of Gartner, Inc. or its affiliates.
Tool: Semiconductor Spending by Customer, 2020
Summary: This analysis contains the semiconductor spending patterns of the top global 100 companies at the design level and the purchasing level in
2019 and 2020. The company spending data is presented by region, by chip type and by electronic equipment type.

By Masatsune Yamaji

Table of Contents
1 Design TAM for the Top 100 OEM/ODM Companies
2 Purchasing TAM for the Top 100 OEM/ODM/EMS Companies
3 Data Segmentation and Structure

List of Tables
1-1 Design TAM for the Top 100 OEM/ODM Companies, 2020 (Millions of U.S. Dollars)
2-1 Purchasing TAM for the Top 100 OEM/ODM/EMS Companies, 2020 (Millions of U.S. Dollars)

For More Information...

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Design TAM for the Top 100 OEM/ODM Companies
List of Tables
1-1 Design TAM for the Top 100 OEM/ODM Companies, 2020 (Millions of U.S. Dollars)

Table 1-1 (Top) (Front Page)

Design TAM for the Top 100 OEM/ODM Companies, 2020 (Millions of U.S. Dollars)

Source: Gartner (April 2021)

© 2021 Gartner, Inc. and/or its Affiliates. All Rights Reserved.

Purchasing TAM for the Top 100 OEM/ODM/EMS Companies
List of Tables
2-1 Purchasing TAM for the Top 100 OEM/ODM/EMS Companies, 2020 (Millions of U.S. Dollars)

Table 2-1 (Top) (Front Page)

Purchasing TAM for the Top 100 OEM/ODM/EMS Companies, 2020 (Millions of U.S. Dollars)

Source: Gartner (April 2021)

© 2021 Gartner, Inc. and/or its Affiliates. All Rights Reserved.

Data Segmentation and Structure

Chip Aggregation

Total memory = DRAM, NAND flash memory, emerging memory, other memory
Total microcomponents = microcontrollers, microprocessors, digital signal processors
Total general-purpose logic = field-programmable gate arrays (FPGAs)/programmable logic devices (PLDs), display drivers, other logic
Total analog = voltage regulators/reference, data converters/switch/multiplexers, other analog
Total discrete = diodes, transistors, other discretes
Total optoelectronics = image sensors — charge-coupled device (CCD), image sensors — complementary metal-oxide semiconductor (CMOS), optoelectronics
Nonoptical sensors = nonoptical sensors
Total application-specific = discrete application/multimedia processors, discrete cellular baseband, discrete graphics processing units (GPUs), integrated
baseband/application processors, RF front end and transceivers, wireless connectivity, wired connectivity, power management, other application-specific

Region
Americas: North, Middle and South America
EMEA: Europe, Middle East and Africa
Japan: Japan
Greater China: China, Taiwan
Rest of Asia/Pacific: Asia/Pacific Countries excluding Japan, China and Taiwan

(Top)
Data Segmentation
Electronic Equipment

All Applications
Automotive Electronics Consumer Electronics
Advanced Driver Assistance Systems Appliances
Aftermarket Products Blue Laser DVD Players
Body Blue Laser DVD Recorders
Chassis Digital Camcorders
EVs/HEVs Digital Set-Top Boxes — Cable
Infotainment Digital Set-Top Boxes — IP/Other
Instrument Clusters Digital Set-Top Boxes — Satellite
Powertrains Digital Set-Top Boxes — Terrestrial
Safety Digital Still Cameras
Communications Electronics DVD Players/Recorders
Wired Communications Fitness Wearables
Enterprise Telephony Equipment Head-Mounted Displays
Enterprise WAN Portable Media Players
Service Provider Routers and Switches Smart Watches
DSL Broadband Access TVs - Smart
Enterprise LAN TVs - Standard
Fiber Broadband Access Video Game Consoles
Optical Transport Video Game Handhelds
Other Broadband Access Other Audio
Other Communications Other Consumer
Wireless Communications Other Video
Cellular Modems Other Wearables
Digital Cordless Data Processing Electronics
Mobile Infrastructure — Base Station Equipment Compute
Phones, Basic, Smart OS External Monitor
Phones, Basic, Traditional OS Graphics Cards

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 Phones, Premium, Smart OS PCs, Desk-based
Phones, Utility, Smart OS Printers/Copiers
Wireless LAN Infrastructure RS3 — Flash Cards
Other Wireless Communications RS3 — USB Flash Drives
Industrial Electronics Servers, 1 CPU Socket
Automation Servers, 2 CPU Sockets
Medical/Healthcare Servers, 4 CPU Sockets and Over
Security Smart Cards
Energy Management Traditional Notebook
Test/Measurement Ultramobile, Clamshell, Basic
Transportation Ultramobile, Clamshell, Premium
Commercial Amusement Ultramobile, Hybrid, Basic
Solid-State Lighting (LED Lighting) Ultramobile, Hybrid, Premium
Military/Civil Aerospace Ultramobile, Tablet, Basic
Other Industrial Ultramobile, Tablet, Premium
Subsystems Ultramobile, Tablet, Utility
Camera Modules Other Data Processing
Large Display Panels Storage
Optical Pick-Up Modules DAS/FAS Storage
Optical Transceiver Modules Disk Drives, RDDs
Small/Medium Display Modules Solid-State Drives
Batteries Storage Network Infrastructure
Special Light Modulators Other Storage
Switching Power Modules
RF Modules/Tuners

CPE = customer premises equipment; CRT = cathode-ray tube; DAS = direct-attached storage; EV = electric vehicle; FAS = fabric-attached storage; FTTx = fiber to the x;
HEV = hybrid electric vehicle; LOM = LAN on motherboard; MFP = multifunction product; NIC = network interface card; RF = radio frequency; RDD = rigid-disk drive;
RS3 = removable solid-state storage

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 (Front Page) Rounding

Due to rounding, certain companies, which may have had semiconductor content in our analysis, appear to be zeroes due
Ds), display drivers, other logic categories. For example, Dell and HP Inc. have consumer businesses with TVs and other products, yet their semiconducto
for the purposes of our overall study.

y metal-oxide semiconductor (CMOS), optoelectronics Definitions

te graphics processing units (GPUs), integrated Design total available market (Design TAM): The total value of the silicon content in all products designed by electronic e
power management, other application-specific for the electronic equipment manufacturer (EEM) only, or for one or more third parties. The EEM may be a pure design firm
be an OEM offering design and manufacturing services.

Purchasing TAM: The total value of the silicon content in all products purchased by EEMs. A purchase may be for the EEM
be a pure design firm or an ODM, an electronics manufacturing service (EMS) company, or an OEM offering design and ma

Electronic equipment manufacturer (EEM): EEM is the general term for all firms engaged in branding, marketing, design
Business models that EEMs may implement include original equipment manufacturing, original design manufacturing and E

Original equipment manufacturer (OEM): The most inclusive business model an EEM firm may adopt is that of an OEM.
entire semiconductor value chain. First, it can create demand through its branding and marketing activities. Second, by des
it has the key say in decisions about the bill of materials and list of approved vendors. Third, it may purchase semiconducto
thereby becoming a focus for chip vendors' sales personnel and field application engineers. Fourth, when an EEM acting a
it decides which ODMs and EMS firms to work with.

Original design manufacturer (ODM): With both this and the EMS model, the EEM does not generate demand. Instead, i
taking this approach design significant aspects of electronic equipment, which gives them a key say in decisions about the
EEM using the ODM model may also purchase semiconductors and manufacture the electronic equipment, thereby becom
field application engineers.

Electronics manufacturing service (EMS): An EEM implementing the EMS model does not generate demand or design t
model may determine portions of the bill of materials and may select semiconductor vendors from its approved vendor list,
devices. It may also purchase semiconductors and manufacture the electronic equipment, thereby becoming a focus espec

Subsystem
Gartner removes the semiconductors bought by subsystem manufacturers, not the final set of manufacturers, from the tota
of semiconductors removed from the final set of equipment is included in a separate application category called "subsystem
 

Semiconductor Devices

Total Semiconductor
Total General-Purpose
Total Memory
DRAM
Flash Memory, NAND
Emerging Memory
Other Memory
Total Microcomponents
Total Microcontrollers
Microcontrollers 8-Bit
Microcontrollers 16-Bit
Microcontrollers 32-Bit
Total Microprocessors
Microprocessors Compute
Microprocessors Embedded
Digital Signal Processors
Total General-Purpose Logic
FPGAs/PLDs
Display Drivers
Other Logic
Total Analog
Voltage Regulators/Reference
Data Converters/Switches/Multiplexers
Other Analog
Total Logic
FPGAs/PLDs
Display Drivers
Other Logic

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 Total Discrete
Diodes
Transistors
Other Discretes
Total Optoelectronics
Image Sensor, CCD
Image Sensor, CMOS
Optoelectronics
Nonoptical Sensors
Total Application-Specific
Discrete Application/Multimedia Processors
Discrete Cellular Baseband
Discrete Graphics Processing Units (GPUs)
Integrated Baseband/Application Processors
RF Front End and Transceivers
Wireless Connectivity (NFC, Wi-Fi, Bluetooth, GPS, Combo)
Wired Connectivity (All Interface Functions and Controllers)
Power Management
Other Application-Specific

= fabric-attached storage; FTTx = fiber to the x;

= radio frequency; RDD = rigid-disk drive;

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