International Journal of Advanced Engineering Research and

Science (IJAERS)
Peer-Reviewed Journal
ISSN: 2349-6495(P) | 2456-1908(O)
Vol-8, Issue-8; Aug, 2021
Journal Home Page Available: https://ijaers.com/
Article DOI: https://dx.doi.org/10.22161/ijaers.88.35

Thermoelectric Effects on MoSi2 with Finite Element

Analysis using COMSOL
Sarabjeet Singh1, Yogesh Chandra Sharma2

1Research Scholar, Department of Electronics & Communication, Vivekananda Global University, Jaipur, Rajasthan, India
2Innovation, Research and Development, DR CBS Cyber Security Services LLP, Jaipur, Rajasthan, India

Received: 05 Jul 2021,
Received in revised form: 08 Aug 2021,
Accepted: 15 Aug 2021,
Available online: 24 Aug 2021
© 2021 The author(s). Published by AI Publication.
This is an open access article under the CC BY
license
(https://creativecommons.org/licenses/by/4.0/)
Keywords— Thermoelectric effect, peltier effect,
COMSOL simulation, thermoelectric cooler
thermoelectric generator.
Abstract— Realization of the thermoelectric effects within finite
element analysis (FEA) by means of the COMSOL-Multiphysics
platform is offered. It lets thermoelectric calculations among
temperature dependent material traits on random geometries.
Further, the calculations can be pooled with structural analysis
plus convection can also be taken in report. Thermoelectric cooler
employs Peltier effect for dissipating heat in an electronic casing
structure. It shows exceptional rewards over conservative cooling
skill via quiet process, extended life span, and effortless integration.
Nevertheless, Joule heating results in the accumulation of internal
heat thereby exposes thermoelectric cooler towards the risk of
thermo-mechanical breakdown all through continuous operations in
pragmatic thermal surroundings. In this paper, a 3D module of
thermoelectric material MoSi2 is designed on the way to examine
the thermoelectric effect of the material taking into consideration
the temperature reliant TE material traits. The transient behavior is
also observed. The results can be openly used intended for
consistent design considerations and optimized thermoelectric
devices in engineering.

I. INTRODUCTION coefficient, σ indicates the electric conductivity and λ

The thermoelectric effects within finite element analysis indicates the thermal conductivity. Generally the material
(FEA) can be realized by means of the COMSOL- traits rely on the temperature moreover may perhaps be
Multiphysics platform. It lets thermoelectric calculations anisotropic. At this juncture simply isotropic substance
among temperature dependent material traits on random traits are worn. For anisotropic resources, the appropriate
geometries [1]. The field equations in thermoelectric matrices are taken in consideration. The transient
coupled intended for temperature as well as electric magnetic fields are also not taken in consideration. The
potential under steady state calculations are described as projected equations are as a consequence to the coupled
2
equations in [2] or the text referred within [3].
⃗ ((𝜎𝛼 2 𝑇 + 𝜆)∇
−∇ ⃗ 𝑇) − ⃗∇(σα𝑇∇
⃗ 𝑉) = σ((∇
⃗ 𝑉) +
⃗ 𝑇∇
α∇ ⃗ 𝑉) (1) II. GEOMETRICAL MODEL
and COMSOL Multi-physics allows the execution of ordinary
⃗ (σα∇
∇ ⃗ T) + ∇
⃗ (σ∇
⃗ V) = 0 (2) random partial differential equations (PDEs) intended for
the field variable u over a one to 3D section Ω. Two PDE
where the material traits α indicate the seebeck-
modes are worn: The “Coefficient-Form” as well as the

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Sarabjeet Singh et al. International Journal of Advanced Engineering Research and Science, 8(8)-2021

“General Form”.
𝜕2 𝑢 𝜕𝑢
𝑐𝑎 + 𝑑𝑎 + (−𝑐𝛻𝑢 − 𝛼𝑢 + 𝛾) + 𝛽. 𝛻𝑢 + 𝑎𝑢 = 𝑓
𝜕𝑡 2 𝜕𝑡
(3)
The thermoelectric field equations at this instant are
altered into the “coefficient form” as follows. In the midst,
the vector value of the field variable is defined by
𝑇
𝑢
⃗ =( ) (4)
𝑉
the coefficient c in (3) is
2
(𝜆 + 𝜎𝛼 𝑇 𝜎𝛼𝑇) (5)
𝜎𝛼 𝜎
Intended for transient calculations the capacitive influence
need to be neglected. Generally it is satisfactory to mull
over merely the thermal capacity (heat capacity C, density
ρ). Then d in equation (3) is
Fig.2: Temperature dependent thermal conductivity of
𝜌𝐶
𝑑= ( ) (6) MoSi2.
0
The subsequent examples show outcomes of calculations
for characteristic thermoelectric applications. The material
traits for the calculations with temperature independent
values are depicted in table 1. Here characteristic values
for Molybdenum Silicide MoSi2 were taken from [4] and
Copper was taken from [2]. Temperature dependent
material traits were interpolated by means of cubic splines
(figure 1-3).

Fig.3: Temperature dependent electric conductivity of

MoSi2.

Table.1 Numerical material properties. [4]

Material Properties MoSi2
Fig.1: Temperature dependent Seebeck coefficient of Density 6240 Kg / m3
MoSi2 and cubic spline interpolation.
Thermal Conductivity 66.2 W / (m.K)
Electric conductivity 3.28e6 S/m
Seebeck Coefficient 3.9e-6 V/K
Heat capacity at constant pressure 430 J / (kg.K)

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Sarabjeet Singh et al. International Journal of Advanced Engineering Research and Science, 8(8)-2021

Table 2: Temperature dependent material properties. 350 230 1.4 0.58

σ( 10 5
400 228 1.8 0.73
T (K) α ( 10-6 V/K ) λ (W/m/K)
A/V/m)
100 80 2.7 2 III. THERMOELECTRIC COOLER
150 130 2.3 1.55 The geometry of a straightforward thermoelectric cooler
200 180 1.6 1.05 comprises of solo p-type semiconductor component with
dimensions 1 x 1 x 6 mm³. It is sandwiched by two copper
250 210 1.4 0.75
electrodes of 0.1 mm in thickness (Figure 4).
300 228 1.35 0.65

Fig.4: A p-type thermoelectric element.

The base is kept back at temperature 300 K along with 0V about 3K. Such super cooling effects are also described in
of voltage. At the top of the upper electrode, a current of [5].
0.7A was applied. The resultant distribution of
temperature is revealed in the middle. A temperature
difference of nearly 70 K is achieved. Table 1 shows the
(constant) material properties. Figure 4 shows the result of
the calculation. In the center, the temperature distribution
shows that the cold side temperature is at 230K. The
associated voltage is shown right. To drive the current, a
voltage of 50 mV is needed.

IV. TRANSIENT OPERATION

Figure 5 shows the outcome of a time reliant computation.
The chart reveals the transient cold side temperature with
temperature dependent material parameters. The short
current pulse leads to a momentary temperature plunge of
Fig.5: Transient calculation of Peltier super cooling.

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Sarabjeet Singh et al. International Journal of Advanced Engineering Research and Science, 8(8)-2021
A tiny current pulse leads to momentarily lesser
temperatures at the cold end. In such transient
computation, barely the thermal capacities as suggested
by equation (6) in the midst of the heat capacities in
addition to densities are represented in table 1.
V. THERMOELECTRIC GENERATION
In order to simulate a thermoelectric generator, the earlier
mentioned semiconductor component was worn yet again
by means of the changeable material traits (figure 1 – 3).
The top side of the higher electrode was adjusted to 373K,
whereas the base of the lower electrode was adjusted to
273K along with 0V. Figure 6 displays the outcome of the
current - voltage characteristics of the thermoelectric
material and Figure 7 displays the outcome of the current
power characteristics of the material.
Fig.6: Current-voltage characteristics of the
thermoelectric material
Fig.7: Current- -power characteristics of the
thermoelectric material
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In accordance to the properties, it was observed that the
open circuit voltage of the component is computed to be
about 21mV, whereas the short-circuit current is
computed around 220mA. The highest power output is
observed as 1.22mW.
VI. SUMMARY
The accomplishment of the thermoelectric field equations
using COMSOL multi physics 5.2 is projected.
Thermoelectric computations may perhaps be finished for
arbitrary geometries too. Anisotropy (not revealed here)
as well as temperature reliance of the materials can also
be incorporated. In addition, transient computations were
made. It is probable in adding the structural analysis or
convection effortlessly (not exposed here).
REFERENCES
[1] COMSOL Multiphysics 5.2a Documentation,
www.comsol.com.
[2] Antonova E.E., Looman D.C; Finite Elements for
Thermoelectric Device Analysis in ANSYS; Int.
Conference on Thermoelectrics; 2005 pp. 200.
[3] Landau, L. D. and Lifshitz, E. M.; Electrodynamics of
Continous Media, 2nd Edition, Butterworth Heinemann
(Oxford, 1984).
[4] K. Kurosaki., et al., Enhanced Thermoelectric Properties
of Silicon via Nanostructuring. Materials Transactions.
2016.
[5] Snyder, G.J. et al; Supercooling of Peltier cooler using a
current pulse; J. Appl. Phys; Vol. 92, No. 3; pp. 1564-
1569, 2002.
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