David Christopher Ervine MSc | Principal Engineer
Location: flexible
New Product Introduction:
Full end-to-end delivery of IoT products,
Concept to Release for Sales, including:
1. Project management plan
2. Gate Milestone checklist & reviews
3. Verification & Validation Plan
4. FMEA (covering design, test, package,
product FMEA)
5. Project History/Lessons Learned
Document
6. Create end-to-end supply chain routing
from foundry to PCBA (Enovia)
7. Knowledge of product validation
8. Facilitate supplier contract agreements
9. Supplier selection and sensitivity
analysis.
Technical Skills
1. Deep knowledge of semiconductor
packaging, PCB module manufacture,
including:
a. Knowledge of IPC esp. IPC-HDBK-
830A
b. Gauge R&R, PFMEA & VSM
c. Translate design requirements to
manufacture
d. Exposure to WLCSP products
e. PCB manufacture and product
transfer China -> Taiwan
f. PCB Manufacture and technology
transfer to Delta Electronics
(Revenue $7bn, 83K employees)
2. Supply chain interface between R&D
and IBM foundry, Vermont in releasing
GDSII for prototype
3. Knowledge of process such as:
a. Wafer Probing (inc. vertical probing)
b. Die attach and wirebonding
technology both Au & Ag
c. Transfer moulding of epoxy and
silicone compounds
d. Product packaging configurations
e. Awareness of compliance standards
CE, FCC and IC ID
f. Module Product Reliability Strategy
g. Volume Ramp Up (VRU)
h. IPC standards tree
i. Parylene C coating onto PCBs
Telephone: 07392002392
Email: ervinemsc67@gmail.com
Professional profile
Extensive knowledge of NPI PCBA process, semiconductor
manufacture (CMOS, GaN and GaAs), and supply chain
management. In-depth realisation of New Product Introduction
(NPI) & change management (Enovia / Windchill) from engineering
concept to volume manufacture. Proven Lean and continuous
improvement skills (8Ds, Value Added Analysis, flow analysis,
CAPA)
Key Skills
▪Customer Focus: passionate and determined on customer and that
project deliverables are met.
▪Technical Aptitude: readily adapts to new and challenging situations.
Quickly grasps project deliverables and taking ownership.
▪Outsourcing: supplier selection of UK and Far East and technology
transfers where appropriate whilst delivering supplier agreements,
signed by legals.
▪International Experience: awareness and appreciation of customary
practises in Asia; Taiwan, China, South Korea and Malaysia in addition to
Europe.
▪Leadership: Project focused, communicating project vision, goal and
guidelines and expectations of others are understood.
▪Programme Management: adept at controlling multiple projects,
flexible in controlling resource and time management for each and
appreciation of TS16949, ISO 9000 and IPC-610/830A
Career History
Iconic RF, Belfast: NPI/Quality Manager. June 2020 – to date
A fabless semiconductor company developing innovative Gallium Nitride
semiconductors. Specialise in GaN/GaAs SiC MMIC amplifiers and
discrete HEMT transistors.
Quality Management System software selection and stage one ISO9001
certification achieved. Developed Quality and Business Management
System with Calibration, CAPA, Complaints Handling, Audits and NPI Life-
Cycle control by product.
Managed multi-level Bill of Materials structure and product cost
estimates maintained at all stages of the project.
Managed GaN bare die and package product qualification to Mil-Std 750,
JESD and AEC standards
Production released QFN 7x7mm Ka Band MMIC power amplifier package
with innovative assembly techniques. Managed project administration
and SOP documentation for product release. Defined a product sampling
shipping process with export control (die pick, evaluation boards).
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Ultra Electronics, Greenford: Nov 2019 (3month contract)

Manufacturing Engineer: Government baseline security clearance contract supporting the manufacture of
aerospace ITAR, JSF F35 embedded system.

Technical review, analyse and release of PCBA material backlog in excess of £200K. All materials, supplier
processes were extensively analysed, 8D compiled, Value Stream Mapping identified 60% of Necessary Non
Value Added Activities, PFMEA reviewed and updated by failure mechanism. Analytical data such as FTIR &
EDX compiled and summarised as multiple FA reports for submission to MRB – Material Review Board.

Process and product technology transfer recommendations of technical and operational standards in the
PCBA and Parylene C coating process. This was presented as an NPI gate stage checklist process detailing all
engineering and operational competences needed to be fulfilled from concept, supplier due diligence to
qualification/release-to-manufacture.

MBDA, Bolton: October 2017 to May 2018

Principal Manufacturing Engineer: I was appointed to review technology transfer of various complex circuit
card designs from the design centre in Stevenage to Bolton manufacturing facility. The project was reviewing
the SPEAR 3 seeker and GPS complex circuit card assemblies plus mechanical ancillaries to ensure fit for
manufacture and conformance to all design rules.

Achievements Include:

• Identified major project flaws in equipment releases and qualification after conduction a Design for
Manufacturing study and root cause analysis. The study concluded new equipment releases
impacted product quality and scrap est. £85,000 over the previous 12 months.
• Programme managed the first iteration of circuit card designs, conducted design risk planning and
aligned all mitigation tasks to the team of seven engineers whilst liaising with design services
ensuring risk mitigation in designs are implemented.
• Within 3 months introduced a gate stage process specific for manufacturing, a checklist criterion
focused on V-model engineering activity and design releases of circuit card assemblies. Defined the
milestones at unit level (PCB level) linked to major system and subsystem designs. Process allowed
manufacturing to determine the maturity level of all designs and plan for subsequent manufacturing
readiness activity.
• Developed a PCB complexity factor for all design releases, linked to current manufacturing yields and
expected scrap costs. This allowed management to allocate resource and teams to focus on sub
optimal process engineering and mitigate risks and tasks.

Peak Venue, Glossop: January 2016 to October 2017

Venue Owner: Established a marquee wedding venue in the heart of the Peak District. The business consisted
of two marquees 80ft x 40ft and a side annex for greeting of size 20ft x 40ft. The business was validated by
Hitched.co.uk as a premium venue and established eight wedding functions in year 1, twelve in year 2.

In addition to the marquee, wooden flooring was used throughout and carpeted, a large dancefloor and a
large bar facility. In the colder evening, heating was provided to maintain the whole structure at 22Deg C. All
marketing, sales and contracts plus managing key suppliers were managed. The business did not promote
events for 2018 due to planning issues.

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NXP (Jennic), Sheffield: October 2005 to January 2014

Project Industrial Engineer: Managing the definition, scheduling and delivery of new product from concept
to final delivery stage. Facilitate product and materials cost reductions through supply-based development
and strategic execution of subcontractor capability. The broad remit of this role also has responsibility for
volume ramp-up, production planning and forecasting, inventory management, vendor selection and cost
control of assets. Responsibility for three PCBA suppliers, UK, China & Taiwan and managed all technical issue
and engineering prototyping. Provide technical and some logistic responsibility to foundry and packaging
assembly house.

Achievements Include:

• Transfer Zigbee module product from UK to large CEM in China and finally to Taiwan. Phase 1 transfer
yielded a product cost reduction of 80% whilst providing improvements in capacity, logistics and BoM
sourcing capability. Phase 2 provided integration into NXP global engineering and distribution
network.
• Lead project engineer launching NXP “Internet Of Things” gateway solution based on the JN5168
transceiver and ARM9 based host controller. Project managed all design release and subsequent
VRU (Vol. Ramp Up) activity.
• Facilitated new 3PL warehouse facility supporting a business delivering product worldwide >$4M

Key achievements/projects

• Reengineered EBOMs with subcontractors, design and software yielded a cost saving of 40% and
improvement in cycle time.
• Drove cost base of development kits down by 37% with roadmap to 43% saving $250Kpa
• Vendor selection and technology transfer yielded a cost reduction of 5 to 30% on finished product,
allowing a reduction in ASPs to gain market share whilst maintaining >50 %GM

Zetex Semiconductors (now Diodes Inc), Oldham: September 1991 to October 2005

Manufacturing Group Leader: Responsible for all operational aspects of the UK testing and packaging
operation. With a reporting structure of 70 people from semi- skilled, team leaders and engineers, these
departments were an integral part of the company’s manufacturing capability, contributing to nearly 50% of
Zetex’s world-wide capacity needs of 10 million devices per week. Key to the success was the optimisation of
all aspects of performance by effective use of resources and techniques such as Value-Added Analysis, flow
analysis, and line balancing with the use of Kanban’s and bottleneck management.

Achievements Include:

• With support from Cranfield Institute introduced a Kanban system, reducing batch sizes typically 30K
to 5K lot size. Reduced cycle time from 7 days to 2 days, yield improvement identifying failures earlier
in production and allowed cell-based manufacture increasing labour productivity.
• Product transfer of discrete semiconductor assembly line from UK to China. Processes transferred
included eutectic die attach, wirebond, moulding, backfill operation, laser marking, test and tape
process. Transfer yielded a reduction in labour by 20 per cent through UK redundancies and
reorganisation of new process flow, combined with a 5% increase in overall process yield.

Education and qualifications

o PRINCE2 2009 Foundation Certified - 2016
o Member of the Chartered Institute of Purchasing and Supply - 2009
o (MSc) Master of Science in Manufacturing, Management and Technology - 2004
o Member of the Chartered Institute of Purchasing and Supply - 2009
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 o PGD (Tech Mgmt) (Open) Postgraduate Diploma in Manufacturing, Management and Technology -
2000
o Higher National Diploma in Electronics and Microelectronics, Swansea Institute - 1985

Personal Details

Date of Birth: 2nd Oct 1967

Nationality: British
Marital Status: Widowed April 2015 (married for 19 years)
Leisure: Current affairs, travel, pets, photography, Photoshop, Illustrator.
Health: Excellent

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