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HEF4050B: 1. General Description
HEF4050B: 1. General Description
1. General description
The HEF4050B provides six non-inverting buffers with high current output capability
suitable for driving TTL or high capacitive loads. Since input voltages in excess of the
buffers’ supply voltage are permitted, the buffers may also be used to convert logic levels
of up to 15 V to standard TTL levels. Their guaranteed fan-out into common bipolar logic
elements is shown in Table 3.
3. Applications
LOCMOS (Local Oxidation CMOS) to DTL/TTL converter
HIGH sink current for driving two TTL loads
HIGH-to-LOW level logic conversion
4. Ordering information
Table 1. Ordering information
All types operate from 40 C to +85 C.
Type number Package
Name Description Version
HEF4050BP DIP16 plastic dual in-line package; 16 leads (300 mil) SOT38-4
HEF4050BT SO16 plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
NXP Semiconductors HEF4050B
Hex non-inverting buffers
5. Functional diagram
1A 1Y
3 2
2A 2Y
5 4
3A 3Y
7 6
4A 4Y
9 10
5A 5Y
11 12
input
6A 6Y
14 15
1A 1Y
VSS
001aae605 001aae607 001aae604
Fig 1. Logic symbol Fig 2. Logic diagram for one gate Fig 3. Input protection circuit
6. Pinning information
6.1 Pinning
HEF4050B
VDD 1 16 n.c.
1Y 2 15 6Y
1A 3 14 6A
2Y 4 13 n.c.
2A 5 12 5Y
3Y 6 11 5A
3A 7 10 4Y
VSS 8 9 4A
001aae606
HEF4050B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
7. Functional description
Table 3. Guaranteed fan-out
Driven element Guaranteed fan-out
Standard TTL 2
74 LS 9
74 L 16
8. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VDD supply voltage 0.5 +18 V
IIK input clamping current VI < 0.5 V or VI > VDD + 0.5 V - 10 mA
VI input voltage 0.5 VDD + 0.5 V
IOK output clamping current VO < 0.5 V or VO > VDD + 0.5 V - 10 mA
II/O input/output current - 10 mA
IDD supply current - 50 mA
Tstg storage temperature 65 +150 C
Tamb ambient temperature 40 +85 C
Ptot total power dissipation Tamb 40 C to +85 C
DIP16 package [1] - 750 mW
SO16 package [2] - 500 mW
P power dissipation per output - 100 mW
[1] For DIP16 package: Ptot derates linearly with 12 mW/K above 70 C.
[2] For SO16 package: Ptot derates linearly with 8 mW/K above 70 C.
HEF4050B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
HEF4050B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
[1] The typical values of the propagation delay and transition times are calculated from the extrapolation formulas shown (CL in pF).
HEF4050B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
12. Waveforms
tr tf
VI
90 %
input VM
10 %
0V
tPLH tPHL
VOH
90 %
output VM
10 %
VOL
tTLH tTHL
001aai337
VDD
VI VO
G DUT
RT CL
001aag182
HEF4050B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
D ME
seating plane
A2 A
L A1
c
Z e w M
b1
(e 1)
b b2
16 9 MH
pin 1 index
E
1 8
0 5 10 mm
scale
UNIT
A A1 A2
b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1)
max. min. max. max.
1.73 0.53 1.25 0.36 19.50 6.48 3.60 8.25 10.0
mm 4.2 0.51 3.2 2.54 7.62 0.254 0.76
1.30 0.38 0.85 0.23 18.55 6.20 3.05 7.80 8.3
inches 0.068 0.021 0.049 0.014 0.77 0.26 0.14 0.32 0.39
0.17 0.02 0.13 0.1 0.3 0.01 0.03
0.051 0.015 0.033 0.009 0.73 0.24 0.12 0.31 0.33
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
95-01-14
SOT38-4
03-02-13
SO16: plastic small outline package; 16 leads; body width 3.9 mm SOT109-1
D E A
X
y HE v M A
16 9
Q
A2
(A 3) A
A1
pin 1 index
θ
Lp
1 8 L
e w M detail X
bp
0 2.5 5 mm
scale
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
99-12-27
SOT109-1 076E07 MS-012
03-02-19
14. Abbreviations
Table 11. Abbreviations
Acronym Description
DTL Diode Transistor Logic
DUT Device Under Test
LOCMOS Local Oxidation CMOS
TTL Transistor-Transistor Logic
HEF4050B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Limited warranty and liability — Information in this document is believed to Limiting values — Stress above one or more limiting values (as defined in
be accurate and reliable. However, NXP Semiconductors does not give any the Absolute Maximum Ratings System of IEC 60134) will cause permanent
representations or warranties, expressed or implied, as to the accuracy or damage to the device. Limiting values are stress ratings only and (proper)
completeness of such information and shall have no liability for the operation of the device at these or any other conditions above those given in
consequences of use of such information. the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
In no event shall NXP Semiconductors be liable for any indirect, incidental,
repeated exposure to limiting values will permanently and irreversibly affect
punitive, special or consequential damages (including - without limitation - lost
the quality and reliability of the device.
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such Terms and conditions of commercial sale — NXP Semiconductors
damages are based on tort (including negligence), warranty, breach of products are sold subject to the general terms and conditions of commercial
contract or any other legal theory. sale, as published at http://www.nxp.com/profile/terms, unless otherwise
Notwithstanding any damages that customer might incur for any reason agreed in a valid written individual agreement. In case an individual
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards agreement is concluded only the terms and conditions of the respective
customer for the products described herein shall be limited in accordance agreement shall apply. NXP Semiconductors hereby expressly objects to
with the Terms and conditions of commercial sale of NXP Semiconductors. applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without No offer to sell or license — Nothing in this document may be interpreted or
limitation specifications and product descriptions, at any time and without construed as an offer to sell products that is open for acceptance or the grant,
notice. This document supersedes and replaces all information supplied prior conveyance or implication of any license under any copyrights, patents or
to the publication hereof. other industrial or intellectual property rights.
Suitability for use — NXP Semiconductors products are not designed, Export control — This document as well as the item(s) described herein
authorized or warranted to be suitable for use in life support, life-critical or may be subject to export control regulations. Export might require a prior
safety-critical systems or equipment, nor in applications where failure or authorization from competent authorities.
HEF4050B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Non-automotive qualified products — Unless this data sheet expressly NXP Semiconductors’ specifications such use shall be solely at customer’s
states that this specific NXP Semiconductors product is automotive qualified, own risk, and (c) customer fully indemnifies NXP Semiconductors for any
the product is not suitable for automotive use. It is neither qualified nor tested liability, damages or failed product claims resulting from customer design and
in accordance with automotive testing or application requirements. NXP use of the product for automotive applications beyond NXP Semiconductors’
Semiconductors accepts no liability for inclusion and/or use of standard warranty and NXP Semiconductors’ product specifications.
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer 16.4 Trademarks
(a) shall use the product without NXP Semiconductors’ warranty of the
Notice: All referenced brands, product names, service names and trademarks
product for such automotive applications, use and specifications, and (b)
are the property of their respective owners.
whenever customer uses the product for automotive applications beyond
HEF4050B All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
18. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Ordering information . . . . . . . . . . . . . . . . . . . . . 1
5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2
7 Functional description . . . . . . . . . . . . . . . . . . . 3
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
9 Recommended operating conditions. . . . . . . . 3
10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 4
11 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5
12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
14 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9
16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
16.2 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
16.3 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
17 Contact information. . . . . . . . . . . . . . . . . . . . . 11
18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.