highlights

· Fourth generation Beam Positioner,

providing 2000 points per second
capability
· High power diode-pumped UV
laser for high productivity
· Repetition frequency of up to
70 kHz
· High quality vias as small as
25 microns
· High accuracy for improved wiring
density
· Beam shaping capability
· Automatic mode change
· Open-architecture roll-to-roll
interface matches to any PLC-based
handler

F l e x 5330 TM
UV Laser Drilling System

your productivity solution

ESI's Flex5330 UV Laser Drilling System is the premier choice for high-quality microvias in flexible circuits and rigid-flexible
printed circuit boards. The Flex5330 incorporates ESI's patented fourth generation coordinated motion Beam Positioner,
delivering high speed processing with galvo capability of 2000 points per second.

The Flex5330 also incorporates a high power diode pumped laser with pulse repetition frequency of up to 70 kHz. The
optical system is designed to support the various optical configurations required to meet the needs of the Flex industry.
The combination of a high power, high pulse frequency laser with a high speed Beam Positioner enables the system to
cut copper clad dielectrics with excellent quality, with productivity rates of up to 15,000 vias per minute for typical
copper clad material constructions.

The optional shaped beam capability guarantees excellent quality for direct ablation of non-reinforced dielectrics by
means of a highly circular beam of uniform intensity. It produces highly circular vias with excellent bottom copper quality
with no resin residue, with productivity rates of up to 30,000 vias per minute for typical unclad single layer materials.

An optional feature, Mode Change, allows the system to automatically switch between the gaussian beam and the shaped
beam, allowing the system to be dynamically configured to match the material requirements.

The Flex5330 incorporates a universal, open architecture roll-to-roll interface, allowing the system to be easily integrated
with third party or customer built Roll to Roll handlers. No external cooling water or gas is needed allowing for easy
installation and low operating costs.
 specifications summary

laser beam positioning automatic alignment and roll-to-roll capability

Type: Cross-axis with galvanometer
illumination Software, mechanical and
(Laser beam moves in XY, part moves in Y electrical modifications provide
Camera Field of View: Coarse is 30 mm
axis) the capability to attach and
and Fine is 1.5 mm diagonal
Panel Size: 533 mm x 635 mm interface web handlers to the
Detection Device: CCD, monochrome
Accuracy: ± 20 µm over entire panel area system with very little effort for
Illumination: LED
Maximum Average Velocity: 500 mm/s continuous roll processing (web
Peak Point-to-Point Move Speed: 2,000 handler not provided by ESI)
points per second laser
Controller: DSP based, single-board 4 axis Type: Diode pumped, repetitively shaped beam (option)
Q-switched solid state laser Top Via Roundness: > 90%
main stage Pulse Rate for Via Formation: 30-70 kHz Top Via Size: > = 25 µm
Average Power: > 5.7 W @ 30 kHz at
Type: Cross axis
work surface
Motor Type: Brushless linear motors mode change (option)
The system automatically switches
secondary stage system control computer between the gaussian and shaped
Type: IBM® PC compatible beams. This switch is programmable
Type: XY deflection
Processor: Pentium® Class through the system software giving
Controller: High-speed digital control
Monitor: 15" LCD flat panel the versatility to drill blind or through
Input Devices: Keyboard and trackball vias in copper clad materials using the
programmable z stage guassian beam and blind vias in unclad
Resolution: ± 5 µm
system software non reinforced materials using the
Accuracy: ± 25 µm shaped beam.
Operating System: Realtime UNIX
Maximum Average Velocity: > 10 mm/s
(LynxOS)
Repeatability: ± 25 µm
Travel: 25 mm
Operator Interface: X-windows/Motif zoom beam expander
Network Compatibility: TCP/IP, NFS
Toolpath Generation Software: esiCAM (option)
laser power control Drill File Formats: DXF, ASCII, Excellon I The Zoom Beam Expander (ZBE ) allows
Long Term Stability: ± 2.5% + 50 mW and II, Sieb & Meier and Gerber for automatic changing of a shaped
Feedback: Closed loop beam spot size without realigning the
optics. Through the system software the
user can select any spot size (to a ± 2 um
resolution) within the 40 um-105 um
range. For smaller vias, a 25um to 75 um
Rear Doors
229 cm Open
range ZBE is also available.
98"

high accuracy (option)

± 10 µm over 300 mm x 300 mm

Side Doors
Side Doors
Open
Open

Front Doors
Open
contact us
Crawley, United Kingdom: 44-1293-582415
249 cm Jubei, Taiwan, R.O.C.: 886-3-552-6788
98"
Portland, Oregon U.S.A.: 800-547-5746 or 503-641-4141
Seoul, Republic of Korea: 822-3473-9900
Shanghai, China: 86-21-5237-1288
Tokyo, Japan: 81-3-3533-8444

13900 NW Science Park Drive, Portland, OR 97229-5497, www.esi.com

© 2006 Electro Scientific Industries, Inc. Printed in U.S.A. ESI reserves the right to change specifications and other product information without notice. Effective May 2006. System and prod-
ucts offered by ESI and its subsidiaries are covered by issued and pending US and foreign patents. Products mentioned are for identification purposes only and may be trademarks or regis-
tered of their respective companies. ESI, the ESI logo, and Electro Scientific Industries, Inc. are registered trademarks of Electro Scientific Industries, Inc.
Flex5330-May 2006 Electro