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Chemical Analysis: Analysis of Bulk Materials. Various Analytical Techniques Can Be Used To Determine
Chemical Analysis: Analysis of Bulk Materials. Various Analytical Techniques Can Be Used To Determine
Chemical Analysis: Analysis of Bulk Materials. Various Analytical Techniques Can Be Used To Determine
Simulated-Service Testing
During the concluding stages of an investigation, it may be necessary to conduct tests that
attempt to simulate the conditions under which failure is believed to have occurred. Often,
simulated-service testing is not practicable because elaborate equipment is required, and even
when practicable, it is possible that not all of the service conditions are fully known or un-
derstood. Corrosion failures, for example, are difficult to reproduce in a laboratory, and many
attempts to reproduce them have given misleading results. Serious errors can arise when attempts
are made to reduce the time required for a test by artificially increasing the severity of one of the
factors, such as the corrosive medium or the operating temperature.
On the other hand, when its limitations are clearly understood, the simulated testing of the
effects of certain selected variables encountered in service may be helpful in planning corrective
action that will avoid similar failure or, at least, extend service life. The evaluation of the
efficiency of special additives to lubricants to counteract wear is an example of the successful
application of simulated-service testing using a selected number of service variables. The aircraft
industry has made successful use of such devices as the wind tunnel to simulate some of the
conditions encountered in flight, and naval architects have implemented tank tests to evaluate hull
modifications, power requirements, steerage, and other variables that might forestall component
failure or promote safety at sea.
Taken singly, most of the metallurgical phenomena involved in failures can be satisfactorily
reproduced on a laboratory scale, and the information derived from such experiments can be helpful
to the investigator provided the limitations of the tests are fully recognized. Such limitations are
discussed for a variety of test procedures in Volume 8 of the 9th Edition of Metals Handbook.
In general, the answers to these questions will be derived from a combination of records
and the examinations and tests previously outlined in this article. However, the cause or causes
of failure cannot always be determined with certainty. In this case, the investigation should
determine the most probable cause or causes of failure, distinguishing findings based on
demonstrated fact from conclusions based on conjecture.
Writing the Report. The failure analysis report should be written clearly, concisely, and
logically. One experienced investigator has proposed that the report be divided into the
following principal sections:
Appendix:
Use of Microanalytical Techniques in Failure Analysis and Problem Solving
By the ASM Committee on Failure Analysis
by Microanalytical Techniques*
Auger Electron Spectroscopy (AES). The acceptance of the transmission electron microscope,
the electron microprobe, and the scanning electron microscope as research and problem-solving
tools kept equipment manufacturers involved in making these instruments even more useful. The
improvements that were made in the electron optics, detectors, and vacuum systems for these
techniques assisted development of practical Auger analysis systems, which proved to be another
microanalytical technique of significant utility in materials science. In AES, an electron beam is
focused on the sample area of interest, and the weak Auger electrons, which result from a
secondary reaction of the x-rays with the electron orbitals, are detected.
Discovered by Pierre Auger in the 1920s, these electrons have specific energies that are
characteristic of the emitting elements. In 1953, Lander suggested the use of AES for identification
of surface impurities, but it was not until the late 1960s that Weber and Peria demonstrated a
useful Auger electron spectrometer, and Harris showed the high sensitivity of the technique by
using the now familiar differentiated energy spectrum, dN(E)ldE, to make small peaks visually
more apparent (Fig. 27).
The advantage of AES over EPMA is in its surface sensitivity: the electron microprobe an-
alyzes a layer of a pure element that can be from 300 to 3000 nm thick, depending on the sample
and the operating conditions, whereas AES analyzes a layer that ranges from 1 to 10 nm thick,
depending on the electron energy being analyzed (Fig. 28). The surface sensitivity of Auger analysis
results from the low energy of the Auger electrons (30 to 2000 eV). Because of these low energies,
only electrons generated near the surface will be able to escape unaltered from the sample. A brief
discussion of the analysis volumes of various techniques is presented in the section "Comparison
of Microanalytical Techniques" in this article.
Because of the extraordinary sensitivity of AES to surface layer composition, it was useful
to be able to compare the composition of the surface with that of the layers just below the surface.
To facilitate this type of depth profile analysis, equipment was developed to remove material
uniformly and controllably from the sample surface by using an ion beam, usually of argon ions.
With such an addition to an Auger system, the variation in composition with depth below the
surface can be determined by ion etching or ion sputtering away the original surface and
performing Auger analyses on the successively exposed new surfaces. Detailed information on the
principles, instrumentation, and applications of AES can be found in the article "Auger Electron
Spectroscopy" in Volume 10 of the 9th Edition of Metals Handbook.
Secondary Ion Mass Spectroscopy (SIMS). Almost simultaneous with the development
of commercial Auger systems with depth-profiling capability was the development of systems for
detecting the secondary ions created by the interaction of the ion beam with materials. Castaing
and Slodzian proposed such a technique in 1962, calling it secondary ion emission microanalysis.
It is now usually referred to as SIMS. The advantages of the SIMS techniques are:
• Detection of elements present in part per million quantities
• Detection of all elements, including hydrogen
• Determination of isotopic ratios
• Detection of molecular fragments generated by the sputtering process
The major disadvantages of SIMS are the high variation in detection sensitivity for various
elements, which extends over three orders of magnitude; the effect of matrix variations on this
detection sensitivity; and. as a result, the very poor quantification of results in all but the most
carefully controlled analytical samples.
The mass spectrometers used to detect the secondary ions can be either magnetic or
quadrupole instruments. Quadrupole mass spectrometers are simpler, smaller, and less expensive
than magnetic systems and are therefore preferred as a modular addition to an existing surface
analysis system. Such an addition to an Auger system equipped with an ion etching gun permits
simultaneous depth profile studies by AES and SIMS (Fig. 29). There are several different designs
of stand-alone dedicated SIMS systems. These systems have several advantages over the modular
add-on systems, including smaller ion beam diameters and greatly improved detection sensitivities
(Table 1). Detailed information on the principles, instrumentation, and applications of SIMS can be
found in the article '"Secondary Ion Mass Spectroscopy" in Volume 10 of the 9th Edition of Metals
Handbook.
X-Ray Photoelectron Spectroscopy (XPS). Although the photoelectric effect was
described by Einstein in 1905. and work was done on the transitions by Auger in the 1920s. the
commercial x-ray photoelectron spectrometer did not become available until 1969.
Siegbahn's group in Sweden during the 1950s and 1960s used XPS to study the orbital
electron energies. They showed that energy shifts occurred and were related to changes in the
chemical bonding of the elements, and they systematically measured the binding energies of many
elements and found that the chemical environment affected the core-level binding energies. This
led to an alternate name for the technique—electron spectroscopy for chemical analysis (ESCA).
Because the energies of the emitted photoelectrons are relatively low, the technique is very
sensitive to surface chemistry. For reasons analogous to AES, the thickness of the analyzed layer
depends on the energy of the emitted photoelectron.
In XPS, a collimated beam of soft x-rays that is directed onto the surface of a sample
results in the generation of photoelectrons whose energies are determined by the difference between
the x-ray energy and the binding energy of the electron. Historically, one of the drawbacks to XPS
derived from the difficulty of focusing an x-ray beam, which resulted in a large area of analysis.
Recent developments have successfully reduced the size of the analyzed area to as small as 150
µm in diameter, which is much more suitable for failure analysis and materials problem solving.
Detailed information on the principles, instrumentation, and applications of XPS can be found in
the article "X-Ray Photoelectron Spectroscopy" in Volume 10 of the 9th Edition of Metals
Handbook.
Laser microprobe mass analysis (LAMMA), which was developed during the past
decade, uses a finely collimated laser beam to vaporize and ionize a microvolume of the sample in
the area of interest. The ions created by the laser pulse are drawn into and analyzed by a time-of-
flight mass spectrometer. All elements of the periodic table and their isotopes can be detected with
a laser microprobe. In addition, the mass spectrum can contain molecular fragments that permit
the identification of organic, inorganic, and metalio-organic compounds in a manner analogous to
SIMS. A LAMMA device is shown in Fig. 30.
• Analysis area
• Analysis depth
• Elemental range detected
• Compositional range detected
• Elemental or molecular information
• Ease and reliability of quantification
• Spatial distribution of elements
• Probe beam—charged or neutral particles
• Sample damage by probe beam
Some of the characteristics of these microanalytical techniques are compared in Table 1. For most
of the techniques, two sets of characteristics are listed: the optimum available on the latest systems
and the values generally attained by more standard systems. In selecting which techniques should be
implemented to obtain the desired data, the capabilities of the particular equipment available are
more important than an academic evaluation of the state of the art possible with that
microanalytical technique.
The choice of technique has some secondary implications that are often overlooked. One of
these is the time necessary to accomplish the required analyses. Not only do the various techniques
require different times simply to acquire a spectrum, but the quality of the data required (sensitivity,
resolution, and so on) affects the acquisition time. For example, it may require only a few
seconds to obtain a general idea of the composition of a sample using EPMA or LAMMA, but it
may take 30 min to obtain a complete XPS analysis of a thin-film surface layer with sufficient
counting statistics to obtain reliable quantitative and binding energy information.
If depth profiles are required, then the time taken to ion etch the crater must be added to the
spectra acquisition time. To obtain accurate depth profiles, the surface analyzed must be flat and
parallel to the original surface. Because the intensity of the ion beams used for etching during the
depth profiles varies across their cross section, it is necessary to raster the ion beam to achieve a
flat-bottomed crater (Fig. 31). If the analysis desired involves a relatively large surface area, the
ion beam has to be rastered over an even larger area, which again increases the time required to
complete the analysis.
The outstanding aspects of the microanalytical techniques that are normally used in
failure analysis and materials problem solving can be summarized as follows:
The following examples have been selected to illustrate the selection of microanalysis techniques
and, more importantly, the use of these techniques in failure analysis and problem solving.
Examples
Example 1: Use of EPMA to Identify Microconstituents in a Failed Extrusion Press.
The energy-dispersive x-ray analyzer, in conjunction with the scanning electron microscope, is
valuable to the practicing failure analyst. These techniques will resolve the distinct fractographic
information necessary to determine the fracture mode and mechanism and will determine
whether location variations in chemical composition of the bulk material have resulted in any
unusual microconstituents or contaminants at the origin.
In this example, EPMA was used to determine the composition of the fatigue fracture-
origin site that was not a normal origin site based on stress analysis or stress concentrations. An
unusually high concentration of inclusions was present in the fracture-origin area, which by cyclic
crack growth finally led to the catastrophic failure of an extrusion press.
Investigation. The 230-mm (9-in.) thick casing of a 450-Mg (500-ton) extrusion press
failed after 27 years of service. The casing, shown schematically in Fig. 32, ruptured along the
full longitudinal axis during normal operating conditions. The casing had been fabricated from
ASTM 235-55 low-carbon steel. Initial visual examination revealed an area that exhibited
multiple origins and classic beach marks radiating out approximately 75 mm (3 in.) from the
origin along the wall of a hydraulic-oil bleed hole (Fig. 33). The rest of the fracture surface was
very flat and in the same longitudinal plane. The focus of the beach marks was not at the comers
of the bleed hole on the inside diameter of the hydraulic cylinder, which a stress analysis revealed
as the most likely origin for a fatigue crack. Because of the unusual origin site, material
deficiencies had to be considered.
Results. Examination of the origin site with the scanning electron microscope revealed cor-
rosion pits along the bleed hole wall. Micro-fractographic details, such as fatigue striations. could
not be resolved in the electron microscope because of the excessive oxidation/corrosion present
on the fracture surfaces.
A portion of the bleed hole was vacuum encapsulated in epoxy and sectioned parallel to the
fracture surface. Metallographic examination of this section revealed a microstructure that
generally consisted of a matrix of pearlite and ferrite with bands of slightly finer pearlite. A large
concentration of inclusion stringers was observed in the area corresponding to the fracture origin.
Both the grain and stringer orientations were transverse to the longitudinal axis of the bleed hole
and parallel to the major axis of the extrusion press housing, that is, in the same plane and
direction as the fracture.
Analysis of the stringers using the SEM/EDX svstem revealed high concentrations of
sulfur and manganese, indicating the presence of manganese sulfide inclusions (Fig. 34a to c).
No other unusual microconstituents were observed .
Conclusions. The fracture appeared to have resulted from corrosion-assisted fatigue. The
fatigue initiated at the corrosion pits associated with a concentration of manganese sulfide
stringers that were exposed on the inside diameter bleed hole. Crack propagation then proceeded
because of cyclic loading of the press in operation; the stress concentration was caused by the
inclusions/corrosion pits. In addition, the presence of the local concentration of inclusions would
be expected to result in poor mechanical properties of the steel in the region. The final overload
fracture of the remaining material was related to its low fracture toughness. Although the bulk
chemical analysis conformed to the specification requirements for this alloy, the inclusion
concentration in the fracture-initiated area indicated that the chemical-composition limits for
sulfur and manganese would have greatly exceeded the specification.
Recommendations. A higher-quality steel was recommended for the replacement unit to
lessen the possibility of such gross inclusion segregation and to improve the fracture toughness of
the cylinder.
Light-Element Detection Using EPMA. A typical EDX detector can detect a limited
range of x-ray energies (Fig. 35). At the low-energy end, the limitation is caused by the absorption
of x-rays by the beryllium window (Fig. 26) placed in front of the detector to protect it from
contamination. At the high-energy end of the spectrum, the limitation is caused by the increasing
probability of the x-rays passing directly through the detector without being absorbed. The
elements with high-energy x-rays that might pass directly through the detector (K lines) have other
lower-energy characteristic x-rays that can be detected (L or M lines). However, low atomic
number elements emit only low-energy characteristic x-rays. If these x-rays do not have sufficient
energy to pass through the beryllium window, the element will not be detected.
In the last few years, two improvements have enabled the use of EDX detectors without
beryllium windows. First, the vacuum capabilities of the scanning electron microscope have
improved, reducing the contamination rate of the unprotected detector. Second, the electronics of
the detectors have improved; low-end noise has been reduced so that the low-energy x-rays can
be detected with good signal-to-noise ratios, and the electronics have been made more stable,
permitting cycling to room temperature to allow decontamination of the detector surface.
The development of EDX detectors in which the beryllium window can be removed
permits a more complete metallurgical evaluation with the ability to identify the presence of
fluorine, oxygen, nitrogen, carbon, and (in some of the most recent detectors) boron. The
following three examples of the use of windowless detectors demonstrate the usefulness of this
capability in failure analysis and problem solving.
Example 2: Identification of Iron Oxide Inclusions. A steel pot used to melt
magnesium alloys leaked (Fig. 36), releasing about 35 kg (80 lb) of molten magnesium onto the
foundry floor and causing an extensive fire. After the fire, the hole at the bottom of the pot was
irregular and several inches across; the hole appeared to have been increased in size by erosion
from the molten magnesium and ensuing fire. No evidence of the original leaking hole remained
for analysis.
In an attempt to obtain some data that would explain the failure, samples were removed
from various areas of the failed pot and examined. Cross sections of the pot wall were polished and
etched and, in general, were found to be composed of ferrite and pearlite mixtures, as would be
expected for hot-rolled low-carbon steel. However, the sample taken from a location about 75
mm (3 in.) from the hole contained a cluster of unusually large inclusions (Fig. 37).
By removing the beryllium window from in front of the detector, EPMA spectra were ob-
tained from the inclusions and from the steel matrix (Fig. 38). The inclusion spectrum (Fig. 38a)
contained primarily iron and oxygen, whereas the matrix spectrum (Fig. 38b) contained primarily
iron. X-ray maps were made to show the distribution of iron and oxygen (Fig. 39a to c). These
results indicated that the inclusions were iron oxide. A similar inclusion at the failure site in the
melting pot may have reacted violently with the molten magnesium, causing the leak.
Example 3: Identification of Carbonitrides. The identification of complex inclusions in
steels and superalloys is often critical to the understanding of the steelmaking practice and its
adequacy. Titanium carbonitride inclusions are usually identified by their cubic shape and pinkish-
orange color (Fig. 40). The EPMA spectra obtained using a typical EDX detector is shown in Fig.
41(a); only an x-ray peak for titanium can be seen. With a windowless EDX detector, the spectrum
showed titanium, carbon, and nitrogen (Fig. 41b). It should be noted that titanium emits an x-ray at
about the same energy as nitrogen; therefore, both nitrogen and titanium contributed to the
intensity of this peak.
Example 4: Combined EDX/AES Analysis of Failed Inconel 600 Steam Line
Bellows. Within the first few months of operation of a 8-km (5-mile) long 455-mm (18-in.) diam
high-pressure steam line between a coal-fired electricity-generating plant and a paper mill,
several of the Inconel 600 bellows failed. The steam line operated at 6030 kPa (875 psi) and 420
°C (790 °F). Each bellows was of a three-ply design; each ply contained two longitudinal gas
tungsten arc welds and was cold formed with 13 convolutions. The welds had been inspected
with dye penetrant. The Inconel 600 had been received as 1.5-mm (0.060-in.) thick sheets, hot
rolled to final thickness at 900 °C (1650 °F) and cooled to room temperature, resulting in a
hardness ranging from 78 to 86 HRB. After assembly, each set of bellows was tested to ensure
that each of the elements stroked uniformly. The bellows design resulted in the maximum stress
being a circumferential membrane stress of 108 MPa (15.7 ksi), which is well below the ASME-
assigned design limit of 138 MPa (20 ksi) for Inconel 600 at~420 °C (790 °F).
Because of the high-pressure high-temperature application for the Inconel 600, which was
specified by the customer, both the material supplier and the bellows manufacturer expressed
concern about the purity of the steam, especially with regard to alkali contents. Analyses
provided by the power plant generating the steam indicated that the steam purity would not pose a
problem to the Inconel 600.
In operation, the high-pressure steam was in contact with the outside surface of the
bellows, and condensate was drained from the expansion joint to an adjacent 205-mm (8-in.) diam
condensate return line through a steam trap.
Investigation and Results. Sections of the failed bellows and sections of bellows contam-
inated with a white material were submitted for analysis. The outer ply of the failed bellows had
fractured circumferentially along the outer ridges of several of the convolutions, whereas the
middle ply had cracked on only two convolutions (Fig. 42). The inner ply had only one crack in it.
None of the fractures emanated from the longitudinal weld; in fact, several of the cracks
terminated at the weld zone.
Metallographic sections through the fracture showed the intergranular nature of the failure
(Fig. 43). Careful metallographic and electron microprobe examinations of the grain boundaries of
the Inconel 600 bellows sheets did not reveal any abnormal conditions. Chemical analysis and
tensile tests conducted on samples taken from the failed bellows met all of the specifications for
the material.
The fracture surfaces were discolored, apparently by the formation of oxide films after the
cracks had been generated. The color of these films varied from blue to brown, which was probably
due to variations in thickness. In most areas, however, the film thickness was not sufficient to
obscure the intergranular nature of the fracture (Fig. 44). Energy-dispersive x-ray spectra obtained
from most of the fracture surfaces showed only the major alloying elements of Inconel 600 and
oxygen, but on one fracture area, small x-ray peaks for sodium, silicon, chlorine, and potassium
were also present. In addition, on an area that was so heavily contaminated with foreign material
that the intergranular fracture was almost completely obscured, the EDX spectrum included
carbon, sodium, magnesium, aluminum, silicon, phosphorus, sulfur, and calcium in quantities
exceeding the levels expected for the alloy (Fig. 45).
These results indicated that a more careful analysis should be conducted on the apparently
clean fracture areas. This was done using the scanning Auger microscope on several portions of the
various fractures. The Auger spectra obtained from one fracture, as received in the laboratory and
after argon ion etching for 12 min (equal to about 120 nm). showed that the entire oxide
thickness was contaminated with relatively large amounts of sodium, calcium, potassium,
aluminum, and sulfur. All of the Auger analyses that were performed gave similar indications of
alkali, alkali earth, and other contaminants that completely permeated even the thin oxides on the
fracture surfaces.
Conclusions. Because the unusual contaminants were found completely through the oxide
layers on the fracture surfaces, it was concluded that the operating environment of the bellows must
have contained detrimental contaminants far in excess of the expected levels. Alkali-induced
failure of Inconel 600 at temperatures in the range of 420 °C (790 °F) have occurred previously
and were the cause of the concern raised by the manufacturers of the materials and the bellows.
This type of failure might be classified as an elevated-temperature stress-corrosion failure.
Considering the forewarning of this type of problem and the careful analysis of the steam products
by the customer, it was surprising that these failures had occurred. A careful analysis of the steam
and the operating procedures that had been used was therefore undertaken. This verified that the
steam normally met the purity levels specified, but during of metals. Although care and experience
must be exercised in making such judgments, these techniques provide the trained failure analyst
with the best and most direct information on the cause of the fracture. In most cases, if the fracture
surfaces have not been altered by mechanical damage or corrosion, the fractographic interpretation
is almost unambiguous. However, if the fracture surface is inter-granular, the type and mode of
the fracture is not unambiguous. Several causes of intergranular fracture are listed below:
With knowledge of the operating history of the part, some of the possibilities can be eliminated. In
many cases, microanalytical techniques provide information that is crucial to understanding the
failure cause and sequence. Auger analysis has proved to be the most useful in this regard because it
can detect thin-film residues, which may include traces of the stress-corrosion environment, and
because it has high spatial resolution for documenting the fractographic features and selecting areas
for microanalysis.
Investigation. Cracks were observed in a niobium alloy (Nb-106) part when it was
pulled from storage for assembly into a rocket nozzle. The part had been in protective storage for
several months after heat treating. No other evidence of damage was observed.
Results. The part was carefully sectioned to permit opening of the crack and was examined
in a scanning electron microscope. The crack surfaces were found to be intergranular, with
contaminant particles on a large number of the grain facets (Fig. 49a). Energy-dispersive x-ray
analysis of several of these particles showed them to consist of niobium and fluorine.
To determine how these elements were combined in these small particles, plastic replicas
were applied and pulled from the fracture surface, removing many of the particles. These replicas
were prepared by standard TEM techniques and were analyzed with selected-area electron
diffraction (additional information on selected-area diffraction is provided in the article "Analytical
Transmission Electron Microscopy" in Volume 10 of the 9th Edition of Metals Handbook). The
diffraction pattern obtained most closely matched the pattern for niobium tetrafluoride.
Auger analyses were conducted on several grain facet areas that did not have any contam-
inant particles. Without removing any of the contaminant layer, the Auger electron spectra were
similar to that shown in Fig. 49(b), with peaks representing carbon, oxygen, nitrogen, fluorine, and
chlorine.
Conclusions. With these results, the processing history of the part was searched. It was
quickly learned that, although the part had been heat treated in a vacuum, the affinity of niobium
for oxygen is so great that a tenacious oxide film forms. This film was removed by using a
combination of strong acids: nitric, hydrochloric, hydrofluoric, and lactic. The contaminants found
on the fracture surface by AES analysis represent contributions from each of these: fluorine from
the hydrofluoric, chlorine from the hydrochloric, nitrogen from the nitric, and carbon and oxygen
from the lactic.
Based on these findings, it was concluded that residues of the cleaning acid on the part had
caused SCC during storage. The tensile stresses necessary to generate SCC were not explicitly
identified, but were assumed to have been residual stresses from the heat treatment.
Recommendations. To prevent the recurrence of this problem, more stringent cleaning proce-
dures were instituted to remove any trace of the cleaning acids.
Investigation and Results. The microhardness traverse through a nitrided Nitralloy part
did not follow the normal decreasing pattern, but had an undesirable steplike pattern (Fig. 50).
Examination of the etched cross section showed that a 0.005-mm (0.0002-in.) thick white layer
did exist on the part, but in the region in which the step occurred in the hardness traverse, no
microstructural anomaly was observed. Laser microprobe mass analyses were obtained from
areas adjacent to each of the microhardness indentations. Typical LAMMA spectra from the
hardened case and from the Nitralloy matrix are illustrated in Fig. 51. Shown on these spectra are
peaks at atomic masses corresponding to carbon, nitrogen, oxygen, aluminum, silicon, chromium,
and iron. When the intensity of the nitrogen peaks from each spectra was plotted on the same
graph as the hardness profile (Fig. 52), a step in the nitrogen intensity was found that
corresponded to the step in the hardness traverse.
Conclusions. The anomaly in the hardness traverse was found to be related to a similar
anomaly in the nitrogen concentration profile. This probably resulted from an unusual nitrid-ing
cycle, but it was not possible to determine the precise heat-treating lot for this Dart. Laser
microprobe mass analysis is a powerful technique for investigating processing variables in
nitriding.
Investigation. A batch of bimetal foil/cpoxy laminates was rejected because of poor peel
strength. The laminates were manufactured by sintering a nickel/phosphorus powder layer to a
copper foil, cleaning, then chromate conversion coating the nickel-phosphorus surface, and
laminating the nickel-phosphorus side of the clad bimetal onto an epoxy film, so that the end
product contained nickel-phosphorus sandwiched between copper and epoxy, with a chromate
conversion layer on the epoxy side of the nickel-phosphorus. Peel test samples were prepared by
masking and etching the copper (Fig. 53). Testing revealed abnormally low adhesion strength for
the bad batch of peel test samples. These samples were compared with normal-strength samples
using XPS by analyzing the surface chemistry of the exposed underside of the conversion-coated
nickel-phosphorus layer after it was peeled away from the epoxy for both good and bad samples.
X-ray photoelectron spectroscopy was used because the results would not be affected by the
nonconducting epoxy.
Results of the XPS analyses indicated an 8.8% Na concentration on the surface of the bad
sample; the good sample contained less than 1% Na on the surface (Fig. 54a and b). Depth
profiling was used to determine whether the sodium was present on the surface of the chromate
conversion coating or whether it was present before the conversion coating was applied. After 15
min of argon ion etching, corresponding to approximately 45 nm of material removed, high
concentrations of sodium were still evident, indicating that the sodium was present before the
chromate conversion treatment was performed. A review of the manufacturing procedures showed
that sodium hydroxide was used as a cleaning agent before the chromate conversion coating.
Apparently, the sodium hydroxide had not been properly removed during water rinsing. This result
determined the exact stage in the process to be modified, thus eliminating unnecessary expense.
Example 9: Analysis of a Plating Peeling Problem on an integrated Circuit
Leadframe by XPS. Peeling of a 90Sn-10Pb solder coating from a 1.25-u,m (50-uin.) thick
copper underplating on an Alloy 42 (Fe-42Ni) leadframe was observed during the lead-bending
operation. The plating separation was at the solder/copper interface, and the exposed copper
plating was dark and stained.
Investigation and Results. The leadframe was bent to peel the plating, and the freshly
exposed surfaces, that is, exposed copper plating and the underside of the solder plating, were
analyzed for surface chemistries by XPS. Both surfaces were analyzed in the as-received condition
and after 10 min of argon ion etching to a depth level of approximately 20 nm below the original
surface. The XPS spectra are shown in Fig. 55(a) to 55(d).
The surface of the exposed copper plating on the leadframe revealed oxidized copper along
with carbon, nitrogen, sulfur, potassium, tin, and lead, in order of decreasing concentration. At
approximately 20 nm below the original surface, the carbon and oxygen levels were reduced
considerably, nitrogen and sulfur were not present, and metallic copper, with small amounts of
potassium, tin, and lead, was observed.
The underside of the solder plating revealed carbon, oxygen, nitrogen, copper, and potas-
sium, in order of decreasing concentration. The sodium and potassium levels were much higher
than those observed on the mating copper underplating surface. Analysis by XPS at a depth of
approximately 20 nm below the surface indicated an increase in the amount of metallic copper and a
decrease in carbon, oxygen, nitrogen, and potassium. Further ion etching for 30 min revealed only
metallic copper. No lead or tin from the solder was observed on the underside of the peeled solder
plating at the failed surface, indicating that a copper-rich surface layer from the copper
underplating had separated with the 90Sn-10Pb.
The copper underplating was performed using a copper cyanide bath containing potassium
cyanide, carbonate and hydroxide, Rochelle salt (potassium-sodium tartarate), and proprietary
organic brighteners. Therefore, the presence of potassium, carbon, nitrogen, and oxygen at the
failed interface can be explained as an accumulation of plating salts. The solder plating was fused
at elevated temperature, which caused countercurrent diffusion of lead and tin into the copper
piating and diffusion of copper into the 90Sn-10Pb solder plating.
Conclusions. The 90Sn-10Pb solder plating peeled from the copper underplated leadframe.
Excessive accumulation of plating salts and organic brighteners. as well as associated oxidation of
copper on the surface of the copper underplating by these agents (by moisture absorption), caused
the plating peeling problem.
Investigation and Results. Scanning electron microscopy of the separated interfaces (under-
side of the lead joints) revealed gold-palladium metallization on the hydrogen-treated samples,
whereas the untreated control samples revealed a ductile overload fracture in the 63Sn-37Pb
solder.
Metallography and EPMA of the cross-section mounts did not reveal any differences
between the hydrogen-exposed and the unexposed control samples. Therefore, the underside of
the pulled leads were examined with SIMS to detect the differences in composition of the failed
interfaces between the hydrogen-treated and the control samples. The SIMS positive ion depth
profiles for 'H + , 108Pd + , 120Sn + , and 208Pb+ were plotted for 20 scans (2 min/scan) at an etch rate of
approximately 10 nm/min set on an Si02 standard (Fig. 56). The hydrogen concentration was found
to be approximately eight to ten times higher for the hydrogen-treated sample as compared to the
control sample (comparing the full scales of Fig. 56a and b). In addition, palladium was
associated with hydrogen in the hydrogen-treated sample.
It should be noted that the solubility of hydrogen in palladium at 1205 kPa (175 psig) and
at 85 °C (185 °F) was in the 25 to 30% range. The hydrogen atoms dissolved intersti-tially in the
palladium lattice, causing volume expansion, phase change, and distortion, without loss of the
metallic character.
Conclusions. The resistor network exposed to the hydrogen atmosphere dissolved a large
amount of hydrogen in the gold-palladium metallization layer, causing volume expansion, dis-
tortion, and eventual lifting of the lead. The higher palladium content on the hydrogen-embrittled
fracture was caused by the fracture propagating through the palladium-rich embrittled phase.