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REN Icm7555-56 DST 20021014
REN Icm7555-56 DST 20021014
REN Icm7555-56 DST 20021014
Applications
• Precision timing
• Pulse generation
• Sequential timing
• Time delay generation
• Pulse width modulation
• Pulse position modulation
• Missing pulse detector
Pin Configurations
ICM7555 ICM7556
(8 LD PDIP, SOIC) (14 LD PDIP, CERDIP)
TOP VIEW TOP VIEW
DISCHARGE1 1 14 VDD
THRESHOLD1 2 13 DISCHARGE2
GND 1 8 VDD
CONTROL 3 12 THRESHOLD2
TRIGGER 2 7 DISCHARGE VOLTAGE1
RESET1 4 11 CONTROL
VOLTAGE2
OUTPUT 3 6 THRESHOLD
OUTPUT1 5 10 RESET2
RESET 4 5 CONTROL
VOLTAGE TRIGGER1 6 9 OUTPUT2
GND 7 8 TRIGGER2
Ordering Information
TEMP. RANGE TAPE AND REEL PACKAGE
PART NUMBER PART MARKING (°C) (UNITS) (RoHS COMPLIANT) PKG. DWG. #
ICM7555CBAZ-T (Notes 1, 2, 3) 7555 CBAZ 0 to +70 2.5k 8 Ld SOIC (Tape and Reel) M8.15
ICM7555IBAZ-T (Notes 1, 2, 3) 7555 IBAZ -25 to +85 2.5k 8 Ld SOIC (Tape and Reel) M8.15
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product
reliability and result in failures not covered by warranty.
NOTES:
4. Due to the SCR structure inherent in the CMOS process used to fabricate these devices, connecting any terminal to a voltage greater than V+ +0.3V
or less than V- -0.3V may cause destructive latch-up. For this reason it is recommended that no inputs from external sources not operating from the
same power supply be applied to the device before its power supply is established. In multiple supply systems, the supply of the ICM7555 and
ICM7556 must be turned on first.
5. JA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
6. For JC, the “case temp” location is taken at the package top center.
(Note 8)
TA = +25°C -55°C TO+125°C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX MIN TYP MAX UNIT
1717 2323 µs
Electrical Specifications Applies to ICM7555 and ICM7556, unless otherwise specified. (Continued)
(Note 8)
TA = +25°C -55°C TO+125°C
PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX MIN TYP MAX UNIT
Output Voltage VOL VDD = 15V, ISINK = 20mA 0.4 1.0 1.25 V
Discharge Output Voltage VDIS VDD = 5V, ISINK = 15mA 0.2 0.4 0.6 V
Supply Voltage (Note 7) VDD Functional Operation 2.0 18.0 3.0 16.0 V
NOTES:
7. These parameters are based upon characterization data and are not tested.
8. Applies only to military temperature range product (M suffix).
Functional Diagram
VDD
FLIP-FLOP
8 4
RESET
OUTPUT
R COMPARATOR DRIVERS
THRESHOLD A
6 +
5 OUTPUT
CONTROL - 3
VOLTAGE
R 7 DISCHARGE
n
+
TRIGGER 1
2 -
R COMPARATOR
B
1
GND
NOTE: This functional diagram reduces the circuitry down to its simplest equivalent components. Tie down unused inputs.
TRUTH TABLE
THRESHOLD VOLTAGE TRIGGER VOLTAGE RESET OUTPUT DISCHARGE SWITCH
Don’t Care Don’t Care Low Low On
>2/3(V+) >1/3(V+) High Low On
<2/3(V+) >1/3(V+) High Stable Stable
Don’t Care <1/3(V+) High High Off
NOTE: RESET will dominate all other inputs: TRIGGER will dominate over THRESHOLD.
Schematic Diagram
VDD
P P P P
R
THRESHOLD
N N NPN
CONTROL
VOLTAGE R
OUTPUT
P P
TRIGGER
R
N N N N N N N
GND
RESET DISCHARGE
R = 100kΩ ±20% (TYP)
Application Information The ICM7555 and ICM7556 produce supply current spikes of
only 2mA to 3mA instead of 300mA to 400mA and supply
General decoupling is normally not necessary. Also, in most instances,
the Control Voltage decoupling capacitors are not required
The ICM7555 and ICM7556 devices are, in most instances, since the input impedance of the CMOS comparators on chip
direct replacements for the SE/NE 555/556 devices. However, are very high. Thus, for many applications, two capacitors can
it is possible to effect economies in the external component be saved using an ICM7555 and three capacitors with an
count using the ICM7555 and ICM7556. Because the bipolar ICM7556.
SE/NE 555/556 devices produce large crowbar currents in the
output driver, it is necessary to decouple the power supply POWER SUPPLY CONSIDERATIONS
lines with a good capacitor close to the device. The ICM7555 Although the supply current consumed by the ICM7555 and
and ICM7556 devices produce no such transients (see ICM7556 devices is very low, the total system supply current
Figure 3). can be high unless the timing components are high
impedance. Therefore, use high values for R and low values for
500 C in Figures 4, 5, and 6.
TA = +25°C
VDD
SUPPLY CURRENT (mA)
400
ALTERNATE OUTPUT
GND VDD
300 10k
1 8
SE/NE 555 TRIGGER DISCHARGE
2 7
200
OUTPUT
THRESHOLD
3 6
VDD
CONTROL
100 4 5
VOLTAGE
RESET
0 OPTIONAL
R C
ICM7555/556 CAPACITOR
C OPTIONAL OPTIONAL
C
CAPACITOR CAPACITOR
VDD ≤18V
FIGURE 5. ALTERNATE ASTABLE CONFIGURATION
FIGURE 6. MONOSTABLE OPERATION
D = R A + R B R A + 2R B (EQ. 3)
MONOSTABLE OPERATION
In this mode of operation, the timer functions as a one-shot (see
Figure 6). Initially the external capacitor (C) is held discharged by
a transistor inside the timer. Upon application of a negative
Trigger pulse to pin 2, the internal flip-flop is set, which releases
the short-circuit across the external capacitor and drives the
Output high. The voltage across the capacitor now increases
exponentially with a time constant t = RAC. When the voltage
across the capacitor equals 2/3 V+, the comparator resets the
flip-flop, which in turn discharges the capacitor rapidly and also
drives the OUTPUT to its low state. Trigger must return to a high
state before the OUTPUT can return to a low state.
1000
160 320
900
140 280
800
TA = -20°C
120 240
700
600 100 200
TA = +25°C
500 80 160
400 VDD = 2V
60 TA = +70°C 120
300
200 40 80
VDD = 5V VDD = 18V
100 20 40
0 0 0
0 10 20 30 40 0 2 4 6 8 10 12 14 16 18 20
LOWEST VOLTAGE LEVEL OF TRIGGER PULSE (%VDD) SUPPLY VOLTAGE (V)
FIGURE 7. MINIMUM PULSE WIDTH REQUIRED FOR TRIGGERING FIGURE 8. SUPPLY CURRENT vs SUPPLY VOLTAGE
-0.1 100
TA = +25°C TA = -20°C
OUTPUT SOURCE CURRENT (mA)
VDD = 5V
VDD = 2V
-10.0 1.0
VDD = 18V
-100 0.1
-10 -1.0 -0.1 -0.01 0.01 0.1 1.0 10.0
OUTPUT VOLTAGE REFERENCED TO VDD (V) OUTPUT LOW VOLTAGE (V)
FIGURE 9. OUTPUT SOURCE CURRENT vs OUTPUT VOLTAGE FIGURE 10. OUTPUT SINK CURRENT vs OUTPUT VOLTAGE
100 100
TA = +70°C
TA = +25°C
OUTPUT SINK CURRENT (mA)
OUTPUT SINK CURRENT (mA)
VDD = 2V VDD = 2V
1.0 1.0
0.1 0.1
0.01 0.1 1.0 10.0 0.01 0.1 1.0 10.0
OUTPUT LOW VOLTAGE (V) OUTPUT LOW VOLTAGE (V)
FIGURE 11. OUTPUT SINK CURRENT vs OUTPUT VOLTAGE FIGURE 12. OUTPUT SINK CURRENT vs OUTPUT VOLTAGE
TA = +25°C TA = +25°C
2
RA = RB = 10kΩ 1.0
4 C = 0.1µF
8 0.1
0.1 1.0 10.0 100.0 0.01 0.1 1.0 10.0
SUPPLY VOLTAGE (V) DISCHARGE LOW VOLTAGE (V)
FIGURE 13. NORMALIZED FREQUENCY STABILITY IN THE ASTABLE FIGURE 14. DISCHARGE OUTPUT CURRENT vs DISCHARGE OUTPUT
MODE vs SUPPLY VOLTAGE VOLTAGE
600 +1.0
+0.7
400 +0.6
VDD = 5V
+0.5
300
+0.4
TA = +70°C +0.3 VDD = 18V
200
TA = +25°C +0.2 VDD = 2V
100 TA = -20°C +0.1
0 VDD = 2V
0 -0.1
0 10 20 30 40 -20 0 20 40 60 80
LOWEST VOLTAGE LEVEL OF TRIGGER PULSE (%VDD) TEMPERATURE (°C)
FIGURE 15. PROPAGATION DELAY vs VOLTAGE LEVEL OF TRIGGER FIGURE 16. NORMALIZED FREQUENCY STABILITY IN THE ASTABLE
PULSE MODE vs TEMPERATURE
1.0 1.0
100m TA = +25°C 100m TA = +25°C
10m RA
10m
1m (RA + 2RB) 1kΩ 1m 1kΩ
CAPACITANCE (F)
CAPACITANCE (F)
10kΩ 10kΩ
100µ 100µ
100kΩ 100kΩ
10µ 1MΩ 10µ 1MΩ
1µ 10MΩ 10MΩ
1µ
100MΩ 100MΩ
100n 100n
10n 10n
1n 1n
100p 100p
10p 10p
1p 1p
0.1 1 10 100 1k 10k 100k 1M 10M 100n 1µ 10µ 100µ 1m 10m 100m 1 10
FREQUENCY (Hz) TIME DELAY (s)
FIGURE 17. FREE RUNNING FREQUENCY vs RA, RB AND C FIGURE 18. TIME DELAY IN THE MONOSTABLE MODE vs
RA AND C
Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted.
Please go to the web to make sure that you have the latest revision.
About Intersil
Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products
address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets.
For the most updated datasheet, application notes, related documentation and related parts, please see the respective product
information page found at www.intersil.com.
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DETAIL "A"
1.27 (0.050)
0.40 (0.016)
8°
1 2 3 0°
0.25 (0.010)
0.19 (0.008)
TOP VIEW SIDE VIEW “B”
2.20 (0.087)
1 8
SEATING PLANE
3 6
-C-
4 5
1.27 (0.050) 0.25(0.010)
0.10(0.004)
0.51(0.020)
0.33(0.013) 5.20(0.205)
NOTES:
1. Dimensioning and tolerancing per ANSI Y14.5M-1994.
2. Package length does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
3. Package width does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
4. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
5. Terminal numbers are shown for reference only.
6. The lead width as measured 0.36mm (0.014 inch) or greater above the
seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch).
7. Controlling dimension: MILLIMETER. Converted inch dimensions are not
necessarily exact.
8. This outline conforms to JEDEC publication MS-012-AA ISSUE C.