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Document Change Proposal: Affected Areas
Document Change Proposal: Affected Areas
AFFECTED AREAS
APPROVERS
Allan Manio/Cavite/PH/Astec
QS-Manager
Approved on 10/15/2009 10:51:47 AM
Maricel Rascano/Cavite/PH/Astec
Doccon Personnel
Notified on 10/15/2009 10:51:47 AM
Edit History
Revision History
DATE: 11/04/2009
Summary :
Model
Parts List
Workplace
Layout
Revision History
Illustration
Revision
History : List of changes from initial release up to latest
4.2 Refer to the Work Instruction Sheet(WIS) for the correct location
of the PCB assembly where and what type of adhesive should be used.
a) Board is cleaned.
b) Protected areas like terminal pins, connectors are masked off or
removed.
c) Coating is applied using any suitable method on both sides of the PCB
and its edges.
d) Coating is cured using oven according to the coating type.
e) Masking is removed and any removed parts are reassembled.
f) Board undergoes full production testing to ensure
functionality of board is not affected by the process.
Emerson Network Power Confidential
Training Module No. : TM-G60
Revision No. : 00 Page 09 of 13
9.4 Check if tools, jigs & equipment are within the prescribed
preventive maintenance schedule or calibration
schedule.