Product Information

TECASINT 5000 – Cost-effective polyimide types

for the semiconductor industry
TECASINT 5000 - Product family TECASINT 5111
The TECASINT 5000 product family is based on non-melt- Unfilled grade with good mechanical properties, better
ing, amorphous polyimides that are characterised by high toughness and machinability compared to previous grade.
thermal stability. Furthermore outstanding dimensional Electrically insulating.
stability and exceptional mechanical properties are addi-
tional advantages for typical parts in the semiconductor TECASINT 5051
industry. TECASINT 5000 products do not melt or soften 30% glassfibre reinforced grade with low thermal expan-
even if they are briefly exposed to temperatures up to 330°C. sion and high glass transition temperature. Excellent wear
resistance and good dimensional stability. Electrically in-
Typical properties sulating.
With a higher glass transition temperature compared to
competitive products, this offers a technical solution for TECASINT 5501 (SD-grade)
moderate temperature requirements up to 280°C. Electrostatically dissipative polyimide grade with a surface
TECASINT 5000 offers significant advantages versus resistance of 10 6 to 10 8 ohm. Low thermal expansion.
compression molded polyamidimides (PAI) and polyeth-
erimides (PEI). TECASINT 5511 (SD-grade)
Electrostatically dissipative polyimide grade with a
ˌˌ High creep strength surface resistance of 10 9 to 10 12 ohm.
ˌˌ Excellent dimensional stability
ˌˌ High ball indentation and Rockwell hardness Both SD-grades are characterised by low thermal expan-
ˌˌ Very good wear resistance sion and good dimensional stability.
ˌˌ Long lifetime
Glass transition
340 °C
100%
280 °C
97 Mpa 75%
85 MPa
50% CLTE (Coefficient of
Rockwell hardness
25% Linear Thermal Expansion)
0%
2,9 10 -5/K
3,5 10 -5/K

362 Mpa
275 MPa Sensor housing TECASINT 5011:
Ball indentation hardness 5,1 kJ/m² Notched impact strength Thermal resistance up to 300 °C.
3,5 kJ/m² Very good electrical insulation.
TS 5051
Competition
Applications and target industries Thermal expansion
Typical applications can be found in the semiconductor
and electronics industry and in the field of automation.
TS 5000 - CLTE comparison
6
TECASINT 5000 products are used for contactors, lead 23 - 100 °C 50 - 200 °C
5
backers and test sockets for microchip test equipment
4

CLTE [10-5/K]
These materials are mainly intended for use in Wafer 3

handling systems and for sensitive electronic compo- 2

nents.
1

0
TS 5051 TS 5501 TS 5511 TS 5111

Summary
The TECASINT 5000 family offers cost-effective solutions For applications with even higher requirements in terms
for high temperature requirements, unrivalled compared to of temperature and dimensional stability we recommend
other thermoplastic materials. our TECASINT 2000 and TECASINT 4000 product families.

Test socket
TECASINT 5011:
Thermal resistance up to 300 °C.
High strength.
Good electrical insulation.

Ensinger SINTIMID GmbH

Ensingerplatz 1
Lead Backer 4863 Seewalchen
TECASINT 5051: Austria
Low thermal expansion.
Thermal resistance up to 300 °C. Phone +43 7662 88788-401
Wear resistant. Fax +43 7662 88788-173
info@tecasint.com
tecasint.com