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Electronics Cooling Applications With ANSYS Icepak 12.0
Electronics Cooling Applications With ANSYS Icepak 12.0
applications with
ANSYS Icepak 12.0
• What is SIwave?
– Hybrid 2.5D full wave EM
field solver
– Models layered structures
– Analyses performed
• Signal Integrity
• Power Integrity
• Electromagnetic
Compatibility/Interference
Multi-level hex-dominant mesh on a heat sink- Pin fin heat sink, mesh follows the
fan assembly geometry without any approximation.
© 2009 ANSYS, Inc. All rights reserved. 6 ANSYS, Inc. Proprietary
Integration of Tools
Package
Sink
Locations
Specify .out
files from
SIwave for
each layer.
© 2009 ANSYS, Inc. All rights reserved. 12 ANSYS, Inc. Proprietary
Results: Current Density from SIwave
& ANSYS Icepak Temperature
Contours
71%
U6
Temperature (C )
U5 21%
U7
U1 U2
U13
U9 U10
Temperature (C) Temperature (C)
Without Joule heat With Joule heat
PCB 70 120 U2 70 85
U1 63 64 U3 43 44
U10 40 42 U4 68 67
U5 32 32
U11 52 52
U6 31 31
U12 57 55
U7 53 57
U13 31 33 U8 47 50
U14 59 63 U9 38 40
© 2009 ANSYS, Inc. All rights reserved. 14 ANSYS, Inc. Proprietary
Sensitivity Analysis on Electric
Conductivity
Reference:
http://www.ndt-ed.org/EducationResources/CommunityCollege/Materials/Physical_Chemical/Electrical.htm
1.77v 1.77v
Case#1 Case#4
Temperature (C)
Temperature (C )
Case#1 Case#2 Case#3 Case#4
Component Name
Fan Object
Type A Type B
Fan object : 1.41M
Type A (MRF): 1.55M
Type B (MRF): 1.44M
© 2009 ANSYS, Inc. All rights reserved. 25 ANSYS, Inc. Proprietary
Advanced Fan Modeling:
Case Study 1: Results
MRF
Fan object
MRF Fan object