Download as pdf or txt
Download as pdf or txt
You are on page 1of 8

IDD06E60

Fast Switching EmCon


Emitter Diode
Controlled Diode Product Summary
VRRM 600 V
IF 6 A
VF 1.5 V
Feature T jmax 175 °C
• 600
600VV Emitter
EmConControlled
technologytechnology
• Fast recovery
• Soft switching
• Low reverse recovery charge
• Low forward voltage
• 175°C operating temperature
• Easy paralleling

Type Package Ordering Code Marking Pin 1 PIN 2,4 PIN 3


IDD06E60 PG-TO252-3 - D06E60 NC C A

Maximum Ratings, at Tj = 25 °C, unless otherwise specified


Parameter
Parameter Symbol
Symbol Value
Value Unit
Unit
Repetitive
Repetitive peak
peak reverse
reverse voltage
voltage VRRM
VRRM 600
600 VV
Continousforward
Continuous forward current
current IF A
TTCC==25°C
25C IF 14.7
14.7 A
TTC ==90°C
C
90C 1010
Surge non repetitive forward current
Surge non repetitive forward current I FSM
IFSM 2929 A
TC = 25C, tp = 10 ms, sine halfwave
TC=25°C, tp=10 ms, sine halfwave
Maximum repetitive forward current
IFRM 2222 A
TMaximum repetitive forward current
C = 25C, tp limited by tj,max, D = 0.5
I FRM
TC=25°C, tp limited by Tjmax, D=0.5
Power dissipation
TPower
C = 25Cdissipation PtotP t o t 46.8 WW
TTCC==25°C
90C 26.6
46.8
Operating
TC=90°C junction temperature Tj 26.6
-40…+175
Storage temperature Tstg -55...+150
-55...+175
Operating and storage temperature Tj , Tstg °C°C
Soldering
Soldering temperature
temperature TS T S 260 °C
260
1.6mm (0.063 in.) from
reflow soldering, case for 10 s
MSL3

Rev.2.2
Rev. 2.4 Page 1 2007-04-24
2013-12-05
IDD06E60

Thermal Characteristics
Parameter Symbol Values Unit
min. typ. max.
Characteristics
Thermal resistance, junction - case RthJC - - 3.2 K/W
SMD version, device on PCB: RthJA
@ min. footprint - - 75
@ 6 cm 2 cooling area 1) - - 50

Electrical Characteristics, at Tj = 25 °C, unless otherwise specified


Parameter Symbol Values Unit
min. typ. max.
Static Characteristics
Reverse leakage current IR µA
V R=600V, Tj=25°C - - 50
V R=600V, Tj=150°C - - 500
Forward voltage drop VF V
IF=6A, Tj=25°C - 1.5 2
IF=6A, Tj=150°C - 1.5 -

1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.

Rev.2.2
Rev. 2.4 Page 2 2007-04-24
2013-12-05
IDD06E60

Electrical Characteristics, at Tj = 25 °C, unless otherwise specified


Parameter Symbol Values Unit
min. typ. max.
Dynamic Characteristics
Reverse recovery time t rr ns
V R=400V, IF=6A, di/dt=550A/µs, Tj=25°C - 70 -
V R=400V, IF=6A, di/dt=550A/µs , Tj=125°C - 100 -
V R=400V, IF=6A, di/dt=550A/µs , Tj=150°C - 105 -
Peak reverse current I rrm A
V R=400V, IF=6A, di/dt=550A/µs, Tj=25°C - 6.5 -
V R=400V, IF=6A, di/dt=550A/µs, Tj=125°C - 7.4 -
V R=400V, IF=6A, di/dt=550A/µs, Tj=150°C - 7.9 -
Reverse recovery charge Q rr nC
V R=400V, IF=6A, di/dt=550A/µs, Tj=25°C - 240 -
V R=400V, IF=6A, di/dt=550A/µs, Tj=125°C - 360 -
V R=400V, IF=6A, di/dt=550A/µs, Tj=150°C - 400 -
Reverse recovery softness factor S
V R=400V, IF=6A, di F/dt=550A/µs, Tj=25°C - 4 -
V R=400V, IF=6A, di F/dt=550A/µs, Tj=125°C - 4.8 -
V R=400V, IF=6A, di F/dt=550A/µs, Tj=150°C - 4.9 -

Rev.2.2
Rev. 2.4 Page 3 2007-04-24
2013-12-05
IDD06E60
1 Power dissipation 2 Diode forward current
Ptot = f (TC) IF = f(TC)
parameter: Tj ≤ 175°C parameter: Tj ≤ 175°C
50 16
W
A

40
12
35
P tot

10

IF
30

25 8

20
6

15
4
10

2
5

0 0
25 50 75 100 125 °C 175 25 50 75 100 125 °C 175
TC TC

3 Typ. diode forward current 4 Typ. diode forward voltage


IF = f (VF) VF = f (Tj)

18 2

A V
12A

1.8
14 -55°C
25°C
100°C 1.7
12 150°C
VF
IF

1.6
10
1.5 6A
8
1.4
6
1.3
3A
4
1.2

2 1.1

0 1
0 0.5 1 1.5 V 2.5 -60 -20 20 60 100 °C 160
VF Tj

Rev.2.2
Rev. 2.4 Page 4 2007-04-24
2013-12-05
IDD06E60

5 Typ. reverse recovery time 6 Typ. reverse recovery charge


trr = f (diF/dt) Qrr =f(diF/dt)
parameter: V R = 400V, T j = 125°C parameter: VR = 400V, Tj = 125 °C
300 550
nC 12A

ns
500

12A 475
6A
200 3A 450

Qrr
trr

425

150 400
6A
375

100 350

325

50 300
3A
275

0 250
200 300 400 500 600 A/µs 800 200 300 400 500 600 A/µs 800
di F/dt diF/dt

7 Typ. reverse recovery current 8 Typ. reverse recovery softness factor


Irr = f (diF/dt) S = f(diF /dt)
parameter: V R = 400V, T j = 125°C parameter: VR = 400V, Tj = 125°C
11 11

9
12A 12A
9
6A 8 6A
3A 3A
8 7
Irr

6
7
5

6 4

3
5
2
4
1

3 0
200 300 400 500 600 A/µs 800 200 300 400 500 600 700 800 A/µs 1000
di F/dt diF/dt

Rev.2.2
Rev. 2.4 Page 5 2007-04-24
2013-12-05
IDD06E60
9 Max. transient thermal impedance
ZthJC = f (tp)
parameter : D = t p/T
10 1 IDD06E60

K/W

10 0
ZthJC

10 -1

D = 0.50
10 -2 0.20
0.10

single pulse 0.05


0.02
10 -3
0.01

10 -4 -7 -6 -5 -4 -3 -2 0
10 10 10 10 10 10 s 10
tp

Rev.2.2
Rev. 2.4 Page 6 2007-04-24
2013-12-05
IDD06E60

PG - TO252 - 3

Rev.2.2
Rev. 2.4 Page 7 2007-04-24
2013-12-05
IDD06E60

Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
Published by
Infineon Technologies AG
Attention
81726 please!Germany
Munich,
© 2013 Infineonherein
The information is given to describe
Technologies AG certain components and shall not be considered as warranted
characteristics.
All Rights Reserved.
Terms of delivery and rights to technical change reserved.

We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding
Legal circuits, descriptions and charts stated herein.
Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
Infineon Technologies
characteristics. is an approved
With respect to anyCECC
examplesmanufacturer.
or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all
Information
warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual
For further information on technology, delivery terms and conditions and prices please contact your nearest
property rights of any third party.
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).

Warnings
Information
Duefurther
For to technical requirements
information componentsdelivery
on technology, may contain
terms dangerous substances.
and conditions and prices, please contact the nearest
For information
Infineon on the types
Technologies in question
Office please contact your nearest Infineon Technologies Office.
(www.infineon.com).

Infineon Technologies Components may only be used in life-support devices or systems with the express
Warnings
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
Due to technical
or system requirements,
Life support components
devices or systems may contain
are intended dangerous
to be implanted substances.
in the human body,Fororinformation
to support on the types
in question, please contact the nearest Infineon Technologies Office.
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of theInfineon
The user or other persons may
Technologies be endangered.
component described in this Data Sheet may be used in life-support devices or
systems and/or automotive, aviation and aerospace applications or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the
failure of that life-support, automotive, aviation and aerospace device or system or to affect the safety or
effectiveness of that device or system. Life support devices or systems are intended to be implanted in the
human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to
assume that the health of the user or other persons may be endangered.

Rev. 2.4
Rev.2.2 Page 8 2007-04-24
2013-12-05

You might also like