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RK3326 Datasheet V1.1
RK3326 Datasheet V1.1
RK3326 Datasheet V1.1
Rockchip
RK3326
Datasheet
Revision 1.1
April. 2018
Revision History
Date Revision Description
Table of Content
Table of Content ...................................................................................................... 3
Figure Index ........................................................................................................... 4
Table Index............................................................................................................. 5
Warranty Disclaimer ................................................................................................. 6
Chapter 1 Introduction ..................................................................................... 7
1.1 Overview ............................................................................................... 7
1.2 Features ................................................................................................ 7
1.3 Block Diagram ...................................................................................... 17
Chapter 2 Package Information.........................................................................18
2.1 Order Information ................................................................................. 18
2.2 Top Marking ......................................................................................... 18
2.3 TFBGA395LDimension ............................................................................ 18
2.4 Ball Map .............................................................................................. 20
2.5 Pin Number List .................................................................................... 25
2.6 Power/Ground IO Description .................................................................. 31
2.7 Function IO Description .......................................................................... 33
2.8 IO Pin Name Description ........................................................................ 42
Chapter 3 Electrical Specification ......................................................................47
3.1 Absolute Ratings ................................................................................... 47
3.2 Recommended Operating Condition ......................................................... 47
3.3 DC Characteristics ................................................................................. 48
3.4 Electrical Characteristics for General IO .................................................... 49
3.5 Electrical Characteristics for PLL .............................................................. 50
3.6 Electrical Characteristics for USB 2.0 Interface .......................................... 51
3.7 Electrical Characteristics for DDR IO......................................................... 51
3.8 Electrical Characteristics for TSADC.......................................................... 52
3.9 Electrical Characteristics for MIPI DSI....................................................... 52
3.10 Electrical Characteristics for MIPI CSI ..................................................... 53
Chapter 4 Thermal Management .......................................................................54
4.1 Overview ............................................................................................. 54
4.2 Package Thermal Characteristics ............................................................. 54
Figure Index
Fig.1-1 Block Diagram ..................................................................................... 17
Fig.2-1Package definition ................................................................................. 18
Fig.2-2Package Top View ................................................................................. 18
Fig.2-3Package bottom view............................................................................. 19
Fig.2-4Package side view ................................................................................. 19
Fig.2-5Package dimension................................................................................ 20
Fig.2-6Ball Map-1 ........................................................................................... 21
Fig.2-7Ball Map-2 ........................................................................................... 22
Fig.2-8Ball Map-3 ........................................................................................... 23
Fig.2-9Ball Map-4 ........................................................................................... 24
Table Index
Table 2-1 Pin NumberList Information ................................................................ 25
Table 2-2 Power/Ground IO information ............................................................. 31
Table 2-3 Function IO description ...................................................................... 33
Table 2-4 IO function description list ................................................................. 42
Table 3-1 Absolute ratings................................................................................ 47
Table 3-2 Recommended operating condition ...................................................... 47
Table 3-3 DC Characteristics............................................................................. 48
Table 3-4 Electrical Characteristics for Digital General IO ...................................... 49
Table 3-5 Electrical Characteristics for PLL .......................................................... 50
Table 3-6 Electrical Characteristics for USB 2.0 Interface ...................................... 51
Table 3-7 Electrical Characteristics for DDR IO .................................................... 51
Table 3-8 Electrical Characteristics for TSADC ..................................................... 52
Table 3-9 Electrical Characteristics for MIPI DSI .................................................. 52
Table 3-10 Electrical Characteristics for MIPI CSI ................................................. 53
Table 4-1 Thermal Resistance Characteristics ...................................................... 54
Warranty Disclaimer
Rockchip Electronics Co., Ltd makes no warranty, representation or guarantee (expressed, implied, statutory, or otherwise)
by or with respect to anything in this document, and shall not be liable for any implied warranties of non-infringement,
merchantability or fitness for a particular purpose or for any indirect, special or consequential damages.
Information furnished is believed to be accurate and reliable. However, Rockchip Electronics Co., Ltd assumes no
responsibility for the consequences of use of such information or for any infringement of patents or other rights of third
parties that may result from its use.
Rockchip Electronics Co., Ltd’s products are not designed, intended, or authorized for using as components in systems
intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other
application in which the failure of the Rockchip Electronics Co., Ltd’s product could create a situation where personal injury or
death may occur, should buyer purchase or use Rockchip Electronics Co., Ltd’s products for any such unintended or
unauthorized application, buyers shall indemnify and hold Rockchip Electronics Co., Ltd and its officers, employees,
subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, expenses, and reasonable attorney fees
arising out of, either directly or indirectly, any claim of personal injury or death that may be associated with such unintended
or unauthorized use, even if such claim alleges that Rockchip Electronics Co., Ltd was negligent regarding the design or
manufacture of the part.
Rockchip Electronics Co., Ltd does not convey any license under its patent rights nor the
rights of others.
All copyright and patent rights referenced in this document belong to their respective owners
and shall be subject to corresponding copyright and patent licensing requirements.
Trademarks
Rockchip and RockchipTM logo and the name of Rockchip Electronics Co., Ltd’s products are trademarks of Rockchip
Electronics Co., Ltd. and are exclusively owned by Rockchip Electronics Co., Ltd. References to other companies and their
products use trademarks owned by the respective companies and are for reference purpose only.
Confidentiality
The information contained herein (including any attachments) is confidential. The recipient hereby acknowledges the
confidentiality of this document, and except for the specific purpose, this document shall not be disclosed to any third party.
Chapter 1 Introduction
1.1 Overview
RK3326 is a high-performance Quad-core application processor designed for personal tablet
and smart audio device.
Many embedded powerful hardware engines are provided to optimize performance for high-
end application. RK3326 supports almost full-format H.264 decoder by 1080p@60fps,
H.265 decoder by 1080p@60fps, also support H.264 encoder by 1080p@30fps, high-quality
JPEG encoder/decoder.
1.2 Features
The features listed below which may or may not be present in actual product, may be
subject to the third party licensing requirements. Please contact Rockchip for actual product
feature configurations and licensing requirements.
1.2.1 Microprocessor
Quad-core ARM Cortex-A35 CPU
Full implementation of the ARM architecture v8-A instruction set
ARM Neon Advanced SIMD (single instruction, multiple data) support for accelerated
media and signal processing computation
ARMv8 Cryptography Extensions
In-order pipeline with symmetric dual-issue of most instructions
256KB unified system L2 cache
Include VFP v3 hardware to support single and double-precision operations
Integrated 32KB L1 instruction cache, 32KB L1 data cache with 4-way set associative
TrustZone technology support
Separate power domains for CPU core system to support internal power switch and
externally turn on/off based on different application scenario
PD_A35_0: 1st Cortex-A35 + Neon + FPU + L1 I/D Cache
PD_A35_1: 2nd Cortex-A35 + Neon + FPU + L1 I/D Cache
PD_A35_2: 3rd Cortex-A35 + Neon + FPU + L1 I/D Cache
PD_A35_3: 4th Cortex-A35 + Neon + FPU + L1 I/D Cache
One isolated voltage domain to support DVFS
SYSTEM_SRAM
Size: 16KB
PMU_SRAM
Size: 8KB
eMMC Interface
Compatible with standard iNAND interface
Support eMMC ver4.51, compatible with 4.41, 5.0 and 5.1
Support three data bus width: 1-bit, 4-bit or 8-bit
Support up to HS200, but not support CMD Queue
SD/MMC Interface
Compatible with SD3.0, MMC ver4.51
Data bus width is 4bits
Timer
Six 64bits timers with interrupt-based operation for non-secure application
Two 64bits timers with interrupt-based operation for secure application
Support two operation modes: free-running and user-defined count
Support timer work state checkable
PWM
Two on-chip PWMs with interrupt-based operation
Programmable pre-scaled operation to bus clock and then further scaled
Embedded 32-bit timer/counter facility
Support capture mode
Support continuous mode or one-shot mode
Provides reference mode and output various duty-cycle waveform
Watchdog
32-bit watchdog counter
Counter counts down from a preset value to 0 to indicate the occurrence of a
timeout
WDT can perform two types of operations when timeout occurs:
Generate a system reset
First generate an interrupt and if this is not cleared by the service routine by
the time a second timeout occurs then generate a system reset
Programmable reset pulse length
Totally 16 defined-ranges of main timeout period
One Watchdog for non-secure application
One Watchdog for secure application
Interrupt Controller
Support 3 PPI interrupt source and 128 SPI interrupt sources input from different
components
Support 16 software-triggered interrupts
Two interrupt outputs (nFIQ and nIRQ) separately for each Cortex-A35, both are
low-level sensitive
Support different interrupt priority for each interrupt source, and they are always
software-programmable
DMAC
Micro-code programming based DMA
The specific instruction set provides flexibility for programming DMA transfers
Linked list DMA function is supported to complete scatter-gather transfer
Support internal instruction cache
Embedded DMA manager thread
Support data transfer types with memory-to-memory, memory-to-peripheral,
peripheral-to-memory
Signals the occurrence of various DMA events using the interrupt output signals
Mapping relationship between each channel and different interrupt outputs is
Secure system
TrustZone based Trusted Execution Environment (TEE) for the following
components
Cortex-A35, support security and non-security mode, switch by software
System general DMAC, support some dedicated channels work only in security
mode
Secure OTP, only can be accessed by Cortex-A35 in secure mode and secure
key reader block
SYSTEM_SRAM, part of space is addressed only in security mode, detailed size
is software-programmable together with TZMA (TrustZone memory adapter)
eight secure address space in DDR device, the start address and end address
for each address scope is configurable, maximum 4GB secure address are
supported
Cipher engine
Support SHA-1, SHA-256/224, SHA-512/384, MD5 with hardware padding
Support HMAC of SHA-1, SHA-256, SHA-512, MD5 with hardware padding
Support AES-128, AES-192, AES-256 encrypt & decrypt cipher
Support DES & TDES cipher
Support AES ECB/CBC/OFB/CFB/CTR/CTS/XTS/CCM/GCM/CBC-MAC/CMAC
mode
Support DES/TDES ECB/CBC/OFB/CFB mode
Support up to 4096 bits PKA mathematical operations for RSA/ECC
Support hardware key loader from secure OTP, which is not accessable by other
devices, including Cort4ex-A35
Support data scrambling for DDR3/DDR3L/DDR4/LPDDR2/LPDDR3
Support up to 256 bits TRNG Output
Support secure OTP
Support secure boot
Support secure debug
Video Encoder
Support H.264 video encoder at BP/MP/HP@level4.2
Resolution and frame rate are up to 1920x1080@30FPS
1x1080p@30fps or 2x720p@30fps encoding
2D Graphics Engine:
Data format
Support input of ARGB/RGB888/RGB565/RGB4444/RGB5551/YUV420/YUV422
Support input of YUV422SP10bit/YUV420SP10bit(YUV-8bits out)
Support output of ARGB/RGB888/RGB565/RGB4444/RGB5551/YUV420/YUV422
Pixel Format conversion, BT.601/BT.709
Dither operation
Max resolution: 8192x8192 source, 4096x4096 destination
Scaling
Down-scaling: Average filter
Up-scaling: Bi-cubic filter(source>2048 would use Bi-linear)
Arbitrary non-integer scaling ratio,from 1/8 to 8
Rotation
0, 90, 180, 270 degree rotation
x-mirror, y-mirror& rotation operation
BitBLT
Block transfer
Color palette/Color fill, support with alpha
Transparency mode (color keying/stencil test, specified value/value range)
Two source BitBLT:
A+B=B only BitBLT, A support rotate&scale when B fixed
A+B=C second source (B) has same attribute with (C) plus rotation function
Alpha Blending
New comprehensive per-pixel alpha(color/alpha channel separately)
Fading
SRC1(R2Y)&&SRC0(YUV)—alpha->DST(YUV)
DPI Interface
Support 8bit input
Support up to 150MHz input data
VIP
Support YCbCr422 8bit input
Support Raw 8bit/10bit/12bit input
Support CCIR656(PAL/NTSC) input
Support JPEG input
Support YCbCr422/420 output
Support UYVY/VYUY/YUYV/YVYU configurable
Support up to 8192x8192 resolution source
Support picture in picture
Support arbitrary size window crop
ISP
Generic Sensor Interface with programmable polarity for synchronization signals
ITU-R BT 601/656 compliant video interface supporting YCbCr or RGB Bayer data
12 bit camera interface
12 bit resolution per color component internally
YCbCr 4:2:2 processing
Flash light control
Mechanical shutter support
Windowing and frame synchronization
Frame skip support for video (e.g. MPEG-4) encoding
Macro block line, frame end, capture error, data loss interrupts and sync. (h_start,
v_start) interrupts
Luminance/chrominance and chrominance blue/red swapping for YUV input signals
Continuous resize support
Semi planar storage format
Color processing (contrast, saturation, brightness, hue, offset, range)
Power management by software controlled clock disabling of currently not needed
sub-modules
Four channel Lens shade correction (Vignetting)
Auto focus measurement
White balancing and black level measurement
Auto exposure support by brightness measurement in 5x5 sub windows
Defect pixel cluster correction unit (DPCC) supports on the fly and table based pixel
correction
De-noising pre filter (DPF)
Enhanced color interpolation (RGB Bayer demosaicing)
Chromatic aberration correction
Combined edge sensitive Sharpening / Blurring filter (Noise filter)
Color correction matrix (cross talk matrix)
Global Tone Mapping with wide dynamic range unit (WDR)
Image Stabilization support and Video Stabilization Measurement
Flexible Histogram calculation
Digital image effects (Emboss, Sketch, Sepia, B/W (Grayscale), Color Selection,
Negative image, sharpening)
Solarize effect through gamma correction
Maximum input resolution of 3264x2448 pixels
Main scaler with pixel-accurate up- and down-scaling to any resolution between
3264x2448 and 32x16 pixel in processing mode
Self scaler with pixel-accurate up- and down-scaling to any resolution between
1920x1080 and 32x16 pixel in processing mode
MIPI_DSI interface
Compatible with MIPI Alliance Interface specification v1.0
Support 4 data lane, 1.0Gbps maximum data rate per lane
Up to 1080p@60fps display output
Support HS and LP mode
LVDS interface
Compliant with the TIA/EIA-644-A LVDS specification
Compliant with LVTTL IO, support direct RGB data output
Support RGB888 and RGB666 for LVDS interface
Support VESA/JEIDA LVDS data format transfer
Up to 1280x800@60fps
PDM
Up to 8 channels
Audio resolution from 16bits to 24bits
Sample rate up to 192KHz
Support PDM master receive mode
TDM
supports up to 8 channels for TX and 8 channels RX path
Audio resolution from 16bits to 32bits
Sample rate up to 192KHz
Provides master and slave work mode, software configurable
Support 3 I2S formats (normal, left-justified, right-justified)
Support 4 PCM formats (early, late1, late2, late3)
USB 2.0
Built-in one USB 2.0 OTG interfaces
Compatible with USB 2.0 specification
Supports high-speed(480Mbps), full-speed(12Mbps) and low-speed(1.5Mbps) mode
Provides 16 host mode channels
Support periodic out channel in host mode
SPI interface
Support two SPI Controller
Support serial-master and serial-slave mode, software-configurable
I2C interface
Support four I2C interface(I2C0/I2C1/I2C2)
Support 7bits and 10bits address mode
Software programmable clock frequency
Data on the I2C-bus can be transferred at rates of up to 100 kbit/s in the Standard-
mode, up to 400 kbit/s in the Fast-mode or up to 1 Mbit/s in Fast-mode Plus.
UART Controller
Support 2 UART interface(UART1/UART2)
Embedded two 64-byte FIFO for TX and RX operation respectively
Support 5bit,6bit,7bit,8bit serial data transmit or receive
Standard asynchronous communication bits such as start, stop and parity
Support different input clock for UART operation to get up to 4Mbps baud rate
Support auto flow control mode for UART1TCK
1.2.14 Others
Multiple group of GPIO
All of GPIOs can be used to generate interrupt to CPU
Support level trigger and edge trigger interrupt
Support configurable polarity of level trigger interrupt
Support configurable rising edge, falling edge and both edge trigger interrupt
Temperature Sensor(TS-ADC)
Up to 50KS/s sampling rate
Support two temperature sensor
-20~120℃ temperature range and 5℃ temperature resolution
OTP
Support 4K bit Size, 3.5K bit for secure application
Support Program/Read/Idle mode
Package Type
TFBGA395L (body: 14mm x 14mm; ball size: 0.3mm; ball pitch: 0.65mm)
Notes:
System Peripheral
PWMx2 I2S/TDM(8ch)
Crypto
UARTx2
Multi-Media Processor
SAR-ADC
Dvalin-2EE SPI(M/S) x2
2D Graphics Engine
GPU
Interrupt Controller
SDIO 3.0
JPEG Decoder JPEG Encoder
DMAC
I2C x3
1080p Video Encoder 1080p Video Decoder
Multi-Media Interface
8MP ISP GPIO
LCD Controller
(1920x1080
Scale Down/Up)
Fig.2-1Package definition
2.3 TFBGA395LDimension
Fig.2-5Package dimension
DDR3_R
DDR3_B DDR3_A DDR3_ DDR3_A DDR3_A
ESETN/D DDR3_BA2/D DDR3_A10/D
A VSS_1 A0/DDR4 5/DDR4 A14/DD 4/DDR4 12/DDR VSS_5
DR4_RE DR4_BA0 DR4_CS0N
_BG0 _A8 R4_A1 _A5 4_BA1
SETN
DDR3_
DDR3_C DDR3_C DDR3_A DDR3_ DDR3_A DDR3_BA1/ DDR3_CKE/
CLKN/ DDR3_A3/DD
B LKP/DDR SN0/DDR 7/DDR4 VSS_6 A11/DD 6/DDR4 VSS_7 DDR4_CASN DDR4_RASN
DDR4_ R4_A6
4_CLKP 4_ACTN _A11 R4_A3 _A7 /DDR4_A15 /DDR4_A16
CLKN
VSS_4
H VSS_37 VSS_38 VSS_39 VSS_40 VSS_42 VSS_43 VSS_44 VSS_45
1
DDRIO DDRIO
DDR_D DDR_DQ DDR_DQ DDR_DQ
J VSS_49 _VDD_ _VDD_ VSS_50 VSS_51 VSS_52 VSS_53
QS2_N S2_P 29 25
6 7
Fig.2-6Ball Map-1
LVDS_TX GPIO3_C
_M1 O1
GPIO3_A2 GPIO3_B1/LCD
SCLK CSN0
GPIO3_B7/LCD GPIO3_B6/LCDC
GPIO1_B GPIO1_B
C_D11_M0/CIF _D10_M0/CIF_D GPIO1_B2/F
LVDS_RBI 6/FLASH_ 4/FLASH_
VSS_33 VSS_34 VSS_48 VSS_47 _D9_M1/I2S0_ 8_M1/I2S0_8CH LASH_DQS/ G
AS CS1/SPI0 CLE/SPI0
8CH_SDO2/SPI _SDO3/SPI1_MI EMMC_CMD
_CSN _MOSI
1_CLK SO
GPIO1_B GPIO1_B
GPIO1_B1/FLAS GPIO1_C4/
CPU_VDD_ 5/FLASH_ 7/FLASH_
VSS_46 VSS_55 CPU_VDD_1 CPU_VDD_3 VSS_57 H_RDY/EMMC_C SDMMC1_C H
2 WRN/SPI RDN/SPI0
LKOUT/SFC_CLK MD
0_MISO _CLK
GPIO1_C
CPU_VDD_ GPIO1_C3/
VSS_54 VSS_64 CPU_VDD_4 CPU_VDD_6 VSS_56 VCCIO6 2/UART1 J
5 UART1_RTS
_CTS
Fig.2-7Ball Map-2
LOGIC
DDR_D DDR_ VSS_ DDRIO_VDD DDRIO_VD LOGIC_ LOGIC_
L VSS_71 VSS_72 VSS_73 _VDD_
Q23 DQ20 70 _10 D_11 VDD_4 VDD_9
2
DDR_ MIPI_C
DDR_D DDR_ GPIO2_B7/ MIPI_CSI_ MIPI_C MIPI_CS
U DQS1_ DDR_D_M1 VSS_141 VCCIO3 SI_CLK
QS1_N DQ2 I2C2_SCL VCCA_1V0 SI_DP2 I_RBIAS
P N
MIPI_C
VSS_1 DDR_ GPIO2_C0/I2 MIPI_CSI_ MIPI_C MIPI_CS
V DDR_DQ12 VSS_148 GPIO2_B5 SI_CLK
47 DQ14 C2_SDA DN2 SI_DP3 I_DN0
P
DDR_D DDR_ DDR_ GPIO2_B0/CI GPIO2_B3/C GPIO2_A3/C GPIO2_A5/ GPIO2_A4/ MIPI_C USB_O
Y USB_ID
Q7 DQ3 DQ10 F_VSYNC_M0 IF_CLKO_M0 IF_D5_M0 CIF_D7_M0 CIF_D6_M0 SI_DP1 TG_DP
1 2 3 4 5 6 7 8 9 10 11
Fig.2-8Ball Map-3
GPIO1_D0/ GPIO1_D1/
VSS_7 GPIO1_C7/SD
VSS_69 VSS_66 VSS_87 VSS_88 VSS_78 VSS_79 SDMMC1_D SDMMC1_D L
7 MMC1_D1
2 3
GPIO0_B7/
VSS_6 PLL_AVDD_ GPIO1_C0/ GPIO1_C1/UA
VSS_60 VSS_75 VSS_82 VSS_83 VSS_86 PWM0/OTG M
2 1V8 UART1_RX RT1_TX
_DRV
LOGIC
LOGIC_VDD PLL_AVDD_ GPIO0_B5/ GPIO0_C0/P
_VDD_ VSS_74 VSS_94 VSS_95 AVSS GPIO0_B2 N
_6 1V0 TEST_CLK1 WM1
7
GPIO0_B6/
VSS_1 VSS_12 GPIO0_C3/I GPIO0_B0/I2
VSS_121 VSS_123 VSS_124 VSS_125 GPIO0_B4 FLASH_VO R
20 2 2C1_SDA C0_SCL
LSEL
USB_A
ADC_AVDD_ VSS_14 OSC_24M_I OSC_24M_OU
VDD_1 VSS_143 VSS_144 VSS_145 VSS_146 PMUIO1 U
1V8 2 N T
V0
GPIO2_ GPIO0_A4/P
X_M1 T_M1
GPIO0_A6/TS
GPIO2_C
USB_AVDD_ ADC_IN ADC_SHUT_M
6/PDM_C VCCIO5 VSS_99 VSS_76 TVSS NPOR W
3V3 1 0/TSADC_SH
LK0_M1
UTORG
12 13 14 15 16 17 18 19 20 21 -
Fig.2-9Ball Map-4
A9 DDR3_A12/DDR4_BA1 M2 DDR_DQ11
GPIO3_D1/LCDC_D21/CIF_VSYNC_M1/PDM_SDI2/ISP_PRELIGHT
D16 R7 VSS_115
_TRIG
GPIO3_D2/LCDC_D22/CIF_HREF_M1/PDM_SDI3/ISP_FLASH_TRI
D17 R8 VSS_116
GOUT
GPIO3_D3/LCDC_D23/CIF_CLKIN_M1/PDM_SDI0_M0/ISP_FLASH
D18 R9 VSS_117
_TRIGIN
GPIO3_B1/LCDC_D5_M0/CIF_D6_M1/I2S0_8CH_SDI2/SPI1_CSN
F17 U6 VCCIO3
0
GPIO3_B4/LCDC_D8_M0/CIF_D7_M1/I2S0_8CH_SCLKRX/SPI1_
F18 U7 GPIO2_B7/I2C2_SCL
MOSI
GPIO3_B7/LCDC_D11_M0/CIF_D9_M1/I2S0_8CH_SDO2/SPI1_CL
G17 V4 DDR_DQ12
K
GPIO3_B6/LCDC_D10_M0/CIF_D8_M1/I2S0_8CH_SDO3/SPI1_MI
G18 V5 VSS_148
SO
H2 VSS_37 V9 MIPI_CSI_DP3
J1 DDR_DQS2_N W7 GPIO2_A7/CIF_D9_M0
J2 DDR_DQS2_P W8 MIPI_CSI_DN3
J3 DDR_DQ29 W9 MIPI_CSI_DN1
J4 DDR_DQ25 W10 MIPI_CSI_DP0
K2 DDR_DQ19 Y7 GPIO2_A5/CIF_D7_M0
K3 DDR_DQ24 Y8 GPIO2_A4/CIF_D6_M0
K4 DDR_DQ28 Y9 MIPI_CSI_DP1
AA1
L5 VSS_72 USB_RBIAS
1
AA1
L6 DDRIO_VDD_10 NC_2
2
AA1
L7 DDRIO_VDD_11 GPIO2_C5/I2S1_2CH_SDI/PDM_SDIO_M1
3
AA1
L8 VSS_73 GPIO2_C2/I2S1_2CH__SCLK
4
AA1
L9 LOGIC_VDD_2 GPIO2_C1/I2S1_2CH_LRCK_TXRX
5
AA1
L10 LOGIC_VDD_4 GPIO1_D5/SDMMC0_D3/ JTAG_TMS
6
AA1
L11 LOGIC_VDD_9 GPIO1_D7/SDMMC0_CMD/
7
AA1
L12 VSS_77 GPIO1_D2/SDMMC0_D0/UART2_TX_M0
8
AA1
L13 VSS_69 GPIO1_D6/SDMMC0_CLKO/ TEST_CLKO
9
AA2
L14 VSS_66 GPIO0_A3/SDMMC0_DETN
0
AA2
L15 VSS_87 VSS_3
1
PMU_VDD_
P17 PMU digital Power
1V0
VCCIO1 Power
VCCIO1 K19
Domain Power
VCCIO2 Power
VCCIO2 Y18
Domain Power
VCCIO3 Power
VCCIO3 U6
Domain Power
VCCIO4 Power
VCCIO4 D12
Domain Power
VCCIO5 Power
VCCIO5 W16
Domain Power
VCCIO6 Power
VCCIO6 J18
Domain Power
DDRIO
F8 F9 F10 G9 G10 J6 J7 K6 K7 L6 L7 M6 M7 DDR PHY Power
_VDD
PLL_AVDD_
N18 PLL Analog Power
1V0
PLL_AVDD_
M18 PLL Analog Power
1V8
USB
USB_AVDD
W13 OTG2.0/Host2.0
_3V3
Analog Power
OTP_VCC_1
T13 OTP Analog Power
V8
Pin Pin Name Func1 Func2 Func3 Func4 Func5 e① ③ Pull th② ④ domain
TSADC_SHUT_
TSADC_SHUTO PMUIO1
Pin Pin Name Func1 Func2 Func3 Func4 Func5 e① ③ Pull th② ④ domain
Pin Pin Name Func1 Func2 Func3 Func4 Func5 e① ③ Pull th② ④ domain
I2S1_2CH_LRCK_T
Pin Pin Name Func1 Func2 Func3 Func4 Func5 e① ③ Pull th② ④ domain
GPIO3_A3/LCDC_DEN_M0/CIF_D2_M1/I2S2_2CH_LRCK_T I2S2_2CH_LRCK_T
GPIO3_B1/LCDC_D5_M0/CIF_D6_M1/I2S0_8CH_SDI2/SPI
I2S0_8CH_SDI
GPIO3_B4/LCDC_D8_M0/CIF_D7_M1/I2S0_8CH_SCLKRX/S
I2S0_8CH_LRC
GPIO3_B6/LCDC_D10_M0/CIF_D8_M1/I2S0_8CH_SDO3/SP
G18 I1_MISO GPIO3_B6 LCDC_D10_M0 CIF_D8_M1 I2S0_8CH_SDO3 SPI1_MISO I/O I down 8 √ VCCIO4
GPIO3_B7/LCDC_D11_M0/CIF_D9_M1/I2S0_8CH_SDO2/SP
I2S0_8CH_SDO
Pin Pin Name Func1 Func2 Func3 Func4 Func5 e① ③ Pull th② ④ domain
I2S0_8CH_MCL
CIF_CLKOUT_M
GPIO3_D1/LCDC_D21/CIF_VSYNC_M1/PDM_SDI2/ISP_PRE ISP_PRELIGHT_T
GPIO3_D2/LCDC_D22/CIF_HREF_M1/PDM_SDI3/ISP_FLAS ISP_FLASH_TRIG
Pin Pin Name Func1 Func2 Func3 Func4 Func5 e① ③ Pull th② ④ domain
Pin Pin Name Func1 Func2 Func3 Func4 Func5 e① ③ Pull th② ④ domain
Pin Pin Name Func1 Func2 Func3 Func4 Func5 e① ③ Pull th② ④ domain
LCDC_VSYNC_
LCDC_HSYNC_
MIPI_CSI_CLK
Pin Pin Name Func1 Func2 Func3 Func4 Func5 e① ③ Pull th② ④ domain
MIPI_CSI_RBIA
Notes:
① Pad types: I = digital-input, O = digital-output, I/O = digital input/output (bidirectional) , A=Analog IO
② Def default IO direction for digital IO
③ Output Drive Unit is mA, only Digital IO has drive value;
④ INT: interrupt support;
SDIO Host SDMMC1_CMD I/O sdio card command output and response input
Controller SDMMC1_D[i]
I/O sdio card data input and output
(i=0~3)
SFC
SFC_CSNx(x=0) I/O sfc chip select signal,low active
Controller
I2C[i]_SDA
I/O I2C data
(i=0,1,2)
I2C
I2C[i]_SCL
I/O I2C clock
(i=0,1,2)
UART[i]_TX
O UART serial data output
(i=1,2)
UART
UART[i]_CTS
I UART clear to send modem tatus input
(i=1)
UART[i]_RTS
O UART modem control request to send output
(i=1)
Supply voltage for GPU and core logic VDD_LOGIC -0.3 1.15 V
Voltage for GPU and core logic LOGIC_VDD 0.90 1.00 1.10 V
VCCIO1,VCCIO2, VCCIO3,
2.97 3.30 3.63
Digital GPIO Power (3.3V/1.8V) VCCIO4VCCIO5, VCCIO6, V
1.62 1.8 1.98
PMUIO1, PMUIO2
DDR3 IO power DDR_VDD 1.425 1.5 1.575 V
DDR3L IO Power DDR_VDD 1.283 1.35 1.417 V
USB 2.0 OTG/Host Analog Power (1.8V) USB20_AVDD_1V8 1.62 1.8 1.98 V
USB 2.0 OTG/Host Analog Power (3.3V) USB20_AVDD_3V3 2.97 3.3 3.63 V
MIPI DSI Analog Power(1.0V) MIPI_DSI_VCCA_1V0 0.90 1.00 1.10 V
3.3 DC Characteristics
Table 3-3 DC Characteristics
Parameters Symbol Min Typ Max Unit
MIPI_DSI
Output Low Voltage Vol NA NA 0 V
IO@TTL mode
Short-Circuit Output Current Ios NA 35 60 mA
Fout = Fvco/POSTDIV
Output clock frequency Fout 16 3200 MHz
@3.3V/1.1V
Input
@ 3.3V/1.1V,
PLL Lock time Tlt 250 500 clock
FREF=24M,REFDIV=1
cycles
Fvco = 1000MHz,
VDDHV current @3.3V
1.0 1.2 mA
consumption Current scale as
(Fvco/1GHz)1.5
VDD Current
VDD =1.1V 1.3 1.56 uA/MHz
consumption
Power consumption
PD=HIGH, @27 ℃ 13 uA
(power-down mode)
Notes:
① REFDIV is the input divider value;
Transmitter
Differential output signal low VOL Classic (LS/FS); Io=6mA NA 0.3 0.8 V
Receiver
Classic mode +-250 mV
Receiver sensitivity RSENS
HS mode +-25 mV
HS mode (disconnect
0.5 0.6 0.7 V
comparator)
Input capacitance (seen at D+ or
NA NA 3 pF
D-)
DDR IO @ 1.2V ,
Input leakage current NA 0 0.49 nA
@LPDDR2/LPDDR3 mode 125℃
DDR IO @ 1.2V ,
Input leakage current -5 0 +5 uA
@DDR4 mode 125℃
Temperature Resolution 5 ℃
4.1 Overview
For reliability and operability concerns, the absolute maximum junction temperature has to
be below 125℃.