Brief Process Analysis

National Semiconductor
LM4673TM
Power Amplifier

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Report ID#: BPA-2105120001

Revision 1.0 Published: Jun 16, 2021

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 Package Summary

Manufacturer National Semiconductor

Part number LM4673TM

Device type Power Amplifier

9AG
Package markings
G4

Package type QFN

Figure1 Package Photograph

Package size 1.4mm x 1.4mm

Pin count 9

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 Package X_ray

Figure 2 Package X_ray

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 Die Summary

Die manufacturer National Semiconductor

LM4673A
Die markings (C) <NS logo> (M)
2005

Die size 1.32mm x 1.32mm

Process type CMOS

Number of metal layers 4M

Number of poly/gate layers 1

Process generation 0.35um

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 Die Photo and Markings

Figure 2 shows a photograph of the LM4673TM die.

The die size(with seal ring) is 1.32mm x 1.32mm.

Figure4 Die Markings

Figure3 Die Photo

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 Die Photo_Polysilicon

Figure5 Die Photo_Polysilicon

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 Cross Section Photographs

Figure 6 Cross Section

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 Cross Section Summary

Metal Thickness
Metal4 2.035um
Metal3 913.2nm
Metal2 496.7nm
Metal1 544.7nm

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